Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors LPC55S26JBD100E

Part No.:
LPC55S26JBD100E
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP Exposed Pad
Datasheet:
AetrixLPC55S26JBD100E.pdf
Description:
IC MCU 32BIT 256KB FLSH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,255

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LPC55S26JBD100 from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller with CASPER crypto co-processor, 256 KB flash, 144 KB SRAM, PRINCE real-time flash encryption, and dual USB (FS + HS) support. It operates up to 150 MHz and targets secure embedded applications including industrial control, IoT edge nodes, and trusted firmware execution.

For engineers reviewing the LPC55S26JBD100 datasheet, LPC55S26JBD100 pinout, LPC55S26JBD100 application, or LPC55S26JBD100 equivalent, key selection criteria include its HLQFP100 package, secure boot with RSA-2048/4096, PUF-based key generation, 16-bit 1.0 Msamples/sec ADC, and SCTimer/PWM with 10 configurable outputs - all validated for -40 °C to +105 °C operation.

Technical Context

The LPC55S26JBD100 implements an Arm Cortex-M33 core with MPU, FPU, DSP, and ETM, running at up to 150 MHz using PLL0/PLL1 clock sources derived from internal FRO (12 MHz or 1 MHz), external crystal (16–32 MHz), or RTC oscillator (32.768 kHz). Its security architecture integrates PRINCE for on-the-fly flash encryption/decryption, CASPER for ECC acceleration, PUF for silicon fingerprinting, and SHA2/AES engines with dedicated DMA.

Peripheral subsystems include nine Flexcomm interfaces (configurable as USART/SPI/I2C/I2S), SDIO with dual-card support, SCTimer/PWM with 16 capture/match registers and pin-routed I/O, and a 24-bit multi-rate timer (MRT) with four fixed-rate interrupt channels. Power management supports deep power-down with RAM retention and wake-up via RTC, Micro-Tick Timer, or GPIO interrupts.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreArm Cortex-M33 @ up to 150 MHz with MPU, FPU, DSP, and ETM - enables deterministic real-time control with hardware-enforced memory isolation and floating-point math acceleration.
Memory256 KB on-chip flash (512-byte page erase/write) + 144 KB SRAM (32 KB code bus + 96 KB system bus + 16 KB USB SRAM) - supports secure firmware updates and high-bandwidth peripheral buffering.
SecurityPRINCE flash encryption, CASPER crypto co-processor (ECC), PUF (64–4096-bit keys), SHA2/AES-256, RSA-2048/4096 secure boot - provides hardware-rooted trust for certified bootloader validation and runtime key protection.
Analog16-bit ADC with 1.0 Msamples/sec sampling rate, simultaneous dual-channel conversion, five differential pairs, integrated temperature sensor - delivers precision sensing for closed-loop control without external signal conditioning.
Timers & PWMSCTimer/PWM with 10 outputs, 16 match/capture registers, and internal routing; five 32-bit general-purpose timers; RTC with 1 s resolution and 1 ms wake-up capability - enables complex waveform generation and low-power timekeeping across all power modes.
ConnectivityUSB 2.0 full-speed + high-speed host/device with on-chip PHY, nine Flexcomm interfaces (USART/SPI/I2C/I2S), SDIO (SD2.0/SDR25), and I2C Fast-mode Plus (1 Mbit/s) - supports mixed-speed peripheral aggregation and crystal-less FS USB device operation.
PackageHLQFP100 (14 × 14 × 0.5 mm, 0.5 mm pitch, SOT1570-3) - provides 100-pin routability for high I/O count while maintaining compatibility with standard QFP assembly processes.

Pinout & Package

HLQFP100 package: 100-lead plastic low-profile quad flat package, body size 14 mm × 14 mm × 0.5 mm, 0.5 mm lead pitch, exposed thermal pad (SOT1570-3). Pin 1 index located at top-left corner with marking "LPC55S26JBD100" on first line.

Pin/Terminal Circuit Role Design Meaning
PIO0_0 / ACMP0_AGPIO / Analog Comparator Input AConfigurable digital I/O or comparator input A when analog mode enabled - supports voltage monitoring with hysteresis in safety-critical sensing paths.
PIO0_9 / ACMP0_BGPIO / Analog Comparator Input BPaired with PIO0_0 as differential comparator input - enables zero-crossing detection and overvoltage protection without external op-amps.
PIO0_10 / ADC0_1GPIO / ADC Channel 1ASingle-ended or positive differential ADC input - used for precision current/voltage measurement with simultaneous sampling capability.
PIO0_11 / ADC0_9GPIO / ADC Channel 1BNegative differential ADC input paired with PIO0_10 - forms differential pair for noise-immune analog acquisition in motor control feedback loops.
FC3_TXD_SCL_MISO_WSFlexcomm 3 I/OMulti-function pin supporting USART TX, I2C clock, SPI MISO, or I2S word-select - enables flexible interface assignment without PCB redesign.
SWCLK / PIO0_12Debug Clock InputSerial Wire Debug clock input (default function after boot) - provides non-intrusive debug access without consuming dedicated debug pins beyond SWD interface.
VDD / VSSPower Supply / GroundMultiple VDD/VSS pairs distributed across package periphery - ensures stable core and I/O rail decoupling for EMI-sensitive industrial environments.

Key Features

Feature Design Value
CASPER Crypto Co-processorHardware-accelerated Elliptic Curve Cryptography (ECC) offloads asymmetric operations from CPU, reducing secure boot latency by >70% versus software-only implementation.
PRINCE Flash EncryptionReal-time AES-128 encryption/decryption of flash reads/writes enables secure over-the-air updates without exposing decrypted firmware in memory or on storage media.
Programmable Logic Unit (PLU)Configurable combinatorial/sequential logic block with state machine support - replaces discrete glue logic for custom signal routing, debouncing, or protocol translation without CPU intervention.
Secure Boot with x509 ValidationSupports up to four revocable Root of Trust keys stored as SHA-256 hashes in protected flash, enabling field-upgradable trust anchors and anti-rollback enforcement via image serial number revocation.
Crystal-less Full-Speed USB DeviceUSB 2.0 FS device operation without external crystal using internal FRO trimming - eliminates BOM cost and board space for timing components in cost-sensitive USB peripherals.
Flexible Flexcomm InterfacesNine software-configurable serial peripherals (Flexcomm 0–7 + FC8) with shared fractional baud-rate generator and FIFO - allows dynamic reassignment of UART/SPI/I2C/I2S functions per application phase.

Applications

Industrial Motor Control Secure IoT Edge Node

Use Scenario: Closed-loop servo drive with real-time current sensing, position feedback, and encrypted firmware updates.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing ADC-triggered PWM, and validating signed firmware images before installation.

Use Value: Simultaneous 1.0 Msamples/sec ADC sampling on differential pairs enables precise current reconstruction; PRINCE and secure boot prevent unauthorized firmware modification in field-deployed equipment.

Use Scenario: Battery-powered sensor hub aggregating environmental data and transmitting via encrypted TLS to cloud backend.

IC Role / Device Role / Timing Role: Secure root-of-trust MCU handling sensor fusion, cryptographic signing, and authenticated communication stack.

Use Value: PUF-generated keys eliminate need for external secure element; CASPER accelerates ECDSA signing; deep power-down with RTC wake-up extends battery life beyond 5 years.

Medical Diagnostic Device Smart Energy Meter

Use Scenario: Portable ultrasound front-end requiring low-noise analog acquisition and HIPAA-compliant data encryption.

IC Role / Device Role / Timing Role: Signal processor interfacing with transducer array, digitizing RF echo data, and encrypting patient records before storage.

Use Value: 16-bit ADC with simultaneous dual-channel conversion preserves signal integrity; AES-256 engine encrypts data at line rate; TBSA compliance satisfies medical device cybersecurity standards.

Use Scenario: Revenue-grade meter with tamper detection, secure metrology firmware, and DLMS/COSEM communication stack.

IC Role / Device Role / Timing Role: Metrology controller acquiring voltage/current waveforms, computing harmonics, and enforcing secure remote firmware upgrades.

Use Value: SCTimer/PWM generates precise metrology sampling triggers synchronized to grid frequency; secure boot prevents malicious firmware injection during utility OTA campaigns.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC55S28JBD100512 KB flash, 256 KB SRAM, identical security/peripheral set - adds 256 KB flash and 112 KB SRAM over LPC55S26JBD100.Required for larger firmware images or extended data logging buffers; same pinout and software compatibility.Select when firmware size exceeds 256 KB or additional SRAM is needed for real-time analytics.
LPC5526JBD100No CASPER, no PUF, no PRINCE, no secure boot - shares same package and core but lacks all hardware security accelerators.Suitable only for non-security-critical applications where cost reduction outweighs cryptographic requirements.Choose only if security features are unnecessary and BOM cost is primary constraint; not drop-in for secure deployments.

Compared with LPC55S26JBD100, LPC55S28JBD100 offers higher memory capacity without sacrificing security or peripheral functionality, while LPC5526JBD100 removes all hardware security blocks - making it unsuitable for applications requiring certified secure boot or runtime key protection.

Availability

LPC55S26JBD100 is available at Aetrix Electronics and suitable for industrial motor control, secure IoT edge nodes, and medical diagnostic devices requiring stable component supply across long product lifecycles.

Supply support for LPC55S26JBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller innovation.

The LPC55S2x series is designed for high-integrity embedded applications demanding hardware-rooted security, real-time performance, and energy efficiency - targeting certified industrial control, medical, and smart infrastructure systems.

FAQ

What is the maximum operating frequency of the LPC55S26JBD100?

The LPC55S26JBD100 features an Arm Cortex-M33 core rated for operation up to 150 MHz. This maximum frequency is achieved using PLL0 or PLL1 clock sources derived from internal FRO (12 MHz), external crystal (16–32 MHz), or RTC oscillator (32.768 kHz). The device maintains this performance across its full industrial temperature range of -40 °C to +105 °C with appropriate power supply regulation and thermal management.

Does the LPC55S26JBD100 support secure boot with public-key cryptography?

Yes, the LPC55S26JBD100 supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, with RSA-2048 and RSA-4096 public key support. It validates images using x509 certificates and stores up to four revocable Root of Trust keys as SHA-256 hashes in protected flash. The LPC55S26JBD100 also supports anti-rollback via image key certificate revocation using the serial number field in x509 certificates.

What analog peripherals are integrated into the LPC55S26JBD100?

The LPC55S26JBD100 integrates a 16-bit ADC with 1.0 Msamples/sec sampling rate, five differential channel pairs (10 single-ended inputs), simultaneous dual-channel conversion capability, and an integrated temperature sensor. It also includes an analog comparator with five input pins and selectable internal/external reference voltage - all accessible through dedicated GPIO pins like PIO0_0/ACMP0_A and PIO0_9/ACMP0_B.

Can the LPC55S26JBD100 operate USB full-speed device mode without an external crystal?

Yes, the LPC55S26JBD100 supports crystal-less USB 2.0 full-speed device operation using its internal Free Running Oscillator (FRO) trimmed to ±1% accuracy over 0 °C to 85 °C. This capability eliminates the need for an external 12 MHz crystal in USB peripheral designs, reducing BOM cost and PCB area while maintaining USB specification compliance for device enumeration and data transfer.

What is the package type and pin count of the LPC55S26JBD100?

The LPC55S26JBD100 uses the HLQFP100 package: a 100-lead plastic low-profile quad flat package with 14 mm × 14 mm body size, 0.5 mm lead pitch, and exposed thermal pad (SOT1570-3). Pin 1 is marked at the top-left corner, and the top-side marking reads "LPC55S26JBD100" on the first line, followed by date code and revision information.

LPC55S26JBD100E Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP Exposed Pad
Series:
LPC55S2x
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
144K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S26JBD100E FAQ

1.How can I place an order for LPC55S26JBD100E through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S26JBD100E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S26JBD100E reliable?

The price and inventory of LPC55S26JBD100E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S26JBD100E is usually 5 days.

3.What payment methods are accepted for LPC55S26JBD100E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S26JBD100E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S26JBD100E?

LPC55S26JBD100E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S26JBD100E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S26JBD100E?

For technical support, including LPC55S26JBD100E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S26JBD100E requirements.

6.How does Aetrix verify that LPC55S26JBD100E is sourced from the original manufacturer or authorized distributors?

All LPC55S26JBD100E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S26JBD100E meets industry standards.

7.What is the process for return or replacement of LPC55S26JBD100E?

All LPC55S26JBD100E units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S26JBD100E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S26JBD100E part is unused and in its original packaging.

Return procedure for LPC55S26JBD100E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC55S26JBD100E Tags

  • LPC55S26JBD100E
  • LPC55S26JBD100E PDF
  • LPC55S26JBD100E Datasheet
  • LPC55S26JBD100E Specifications
  • LPC55S26JBD100E Images
  • NXP Semiconductors
  • NXP Semiconductors LPC55S26JBD100E
  • Buy LPC55S26JBD100E
  • LPC55S26JBD100E Price
  • LPC55S26JBD100E Distributor
  • LPC55S26JBD100E Supplier
  • LPC55S26JBD100E Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER