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NXP Semiconductors LPC55S26JBD100K
- Part No.:
- LPC55S26JBD100K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
LPC55S26JBD100K.pdf
- Description:
- IC MCU 32BIT 256KB FLSH 100HLQFP
- Quantity:
- Payment:
- Shipping:
Inventory:353
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Product details
Overview
LPC55S26JBD100K from NXP is a dual-core Arm Cortex-M33 microcontroller operating at up to 150 MHz with 256 KB on-chip flash, 144 KB SRAM, and integrated PRINCE real-time encryption engine for secure boot and code execution. It features 8 FlexComm interfaces (configurable as UART/SPI/I²C/I²S), HS/FS USB with PHY, SDIO, and SRAM PUF-based root-of-trust for industrial IoT edge nodes requiring secure firmware updates and tamper-resistant operation.
For engineers reviewing the LPC55S26JBD100K datasheet, LPC55S26JBD100K pinout, LPC55S26JBD100K application, or LPC55S26JBD100K equivalent, key selection criteria include verified SRAM PUF provisioning support, PRINCE-enabled encrypted flash execution, FlexComm interface configurability, and HLQFP100 package compatibility with thermal and routing constraints in compact industrial control modules.
Technical Context
The LPC55S26JBD100K implements two Arm Cortex-M33 cores with FPU and SIMD extensions, sharing a unified memory map and coordinated by a configurable interconnect. Its security subsystem includes dedicated AES-256/SHA-2 crypto accelerators, hardware RNG, and PRINCE engine enabling real-time decryption of encrypted flash contents without software overhead.
Power management integrates a DC-DC converter supporting single Vdd operation (1.71–3.6 V), multiple low-power modes (including deep-sleep with RTC wake-up), and brown-out detection. Clock generation includes system PLL, USB PLL, and multiple oscillator sources for precise timing across USB, SDIO, and high-speed serial interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-M33 @ up to 150 MHz with FPU and SIMD - enables deterministic real-time control + signal processing in same device |
| Flash Memory | 256 KB embedded flash with PRINCE encryption - supports authenticated, encrypted firmware execution without external secure element |
| SRAM | 144 KB on-chip SRAM with parity - provides reliable data storage for critical control variables and cryptographic context buffers |
| Security Features | SRAM PUF, AES-256/SHA-2 accelerators, PRINCE, secure debug lock - delivers hardware-rooted trust for secure boot and OTA update validation |
| Connectivity | 8 FlexComm interfaces (UART/SPI/I²C/I²S), HS/FS USB with PHY, SDIO - eliminates need for external bridge ICs in sensor hub or gateway designs |
| Package | HLQFP100 (14 × 14 mm, 0.5 mm pitch) - supports automated assembly and thermal dissipation up to 150 MHz sustained operation |
| Analog Peripherals | 16-bit 1 MSPS ADC, ACMP, temperature sensor - enables direct analog sensing for motor control feedback or environmental monitoring |
Pinout & Package
Package: HLQFP100 (Heat Sink Low-profile Quad Flat Package, 100-pin, 14 mm × 14 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate analog domain supply ensures <1 LSB INL error in 16-bit ADC measurements |
| USB_DP/USB_DM | High-speed USB differential pair | Integrated HS USB PHY eliminates external transceiver; supports 480 Mbps host/device operation |
| SDIO_CLK/SDIO_CMD/SDIO_D[0:3] | SDIO bus signals | Direct connection to microSD or eMMC without level-shifting or glue logic |
| FLEXCOMM0_TXD/FLEXCOMM0_RXD | Configurable UART channel | Default UART0 pins usable for bootloader communication or debug console without remapping |
| POR_BOD | Power-on reset & brown-out detect input | Internal POR/BOD circuitry ensures reliable startup across 1.71–3.6 V supply range |
| SWD_IO/SWD_CLK | ARM Serial Wire Debug interface | Two-pin debug interface compatible with standard J-Link and LPC-Link2 probes |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-M33 with shared memory | Enables asymmetric multiprocessing: one core for real-time control, second for secure protocol stack or ML inference |
| PRINCE real-time encryption | Decrypts flash contents on-the-fly during instruction fetch - no performance penalty vs. unencrypted execution |
| SRAM PUF provisioning | Generates unique, unclonable device keys from intrinsic SRAM variation - eliminates need for external eFuses or OTP |
| 8 FlexComm interfaces | Each configurable at runtime as UART, SPI, I²C, or I²S - reduces BOM count and PCB layer count in multi-sensor systems |
| Integrated DC-DC converter | Single 3.3 V input powers entire chip; achieves >85% efficiency at 100 MHz - simplifies power design for battery-powered gateways |
Applications
| Industrial PLC Edge Node | Secure Medical Diagnostic Device |
|---|---|
Use Scenario: Compact programmable logic controller collecting analog sensor inputs and executing safety-critical ladder logic with encrypted firmware updates. IC Role / Device Role / Timing Role: Main application MCU handling real-time I/O scanning, secure boot verification, and encrypted field-upgrade execution via PRINCE. Use Value: Dual M33 cores isolate control loop timing from security tasks; SRAM PUF prevents cloning of calibration keys during device provisioning. | Use Scenario: Portable ECG monitor requiring HIPAA-compliant data encryption, tamper-evident boot, and low-power continuous acquisition. IC Role / Device Role / Timing Role: System-on-chip managing analog front-end, USB HID interface, and end-to-end AES-256 encryption of patient waveform data. Use Value: Integrated crypto accelerators reduce encryption latency to <5 µs per 128-bit block; 16-bit ADC ensures diagnostic-grade signal fidelity. |
| Smart Building HVAC Controller | IIoT Gateway with Secure OTA |
Use Scenario: Wall-mounted HVAC controller interfacing with BACnet MS/TP, Modbus RTU, and BLE sensors while enforcing firmware signature checks. IC Role / Device Role / Timing Role: Central connectivity hub running dual protocol stacks and validating signed firmware images before installation. Use Value: 8 FlexComm interfaces eliminate external UART expanders; secure debug lock prevents unauthorized firmware extraction during field service. | Use Scenario: Cellular-connected edge gateway aggregating data from 20+ LoRaWAN sensors and applying policy-based filtering before cloud upload. IC Role / Device Role / Timing Role: Trusted execution environment hosting secure bootloader, TLS stack, and encrypted local data cache. Use Value: PRINCE enables encrypted flash storage without RAM overhead; HS USB allows fast local recovery image loading via technician laptop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S28JBD100K | 512 KB flash, 256 KB SRAM, identical security/peripheral set - higher memory capacity only | Required when full MCUXpresso SDK examples or dual-application partitioning (e.g., secure/non-secure world) exceed 256 KB flash | Select if firmware size exceeds 256 KB or future-proofing for feature expansion is mandatory |
| RA6M5GFP100A | Arm Cortex-M33 @ 200 MHz, 1 MB flash, 512 KB SRAM, TrustZone, no PRINCE or SRAM PUF | Targets applications needing higher clock speed and larger memory but relying on TrustZone instead of PUF/PRINCE for isolation | Choose when TrustZone-based secure enclave suffices and PRINCE real-time decryption is not required |
Compared with LPC55S26JBD100K, LPC55S28JBD100K offers double flash/SRAM for complex protocol stacks, while RA6M5GFP100A trades NXP's hardware PUF and PRINCE for Renesas' TrustZone implementation and higher CPU frequency - impacting secure boot architecture and memory-constrained OTA update design.
Availability
LPC55S26JBD100K is available at Aetrix Electronics and suitable for industrial IoT gateways, secure medical diagnostics, and smart building controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC55S26JBD100K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC55S26JBD100K belongs to NXP's LPC55S2x series - designed specifically for cost-sensitive, security-critical embedded applications where hardware-rooted trust, low-power operation, and interface flexibility outweigh raw compute throughput.
FAQ
Does LPC55S26JBD100K support Arm TrustZone technology?
No, the LPC55S26JBD100K does not support Arm TrustZone. As confirmed in NXP's official documentation (LPC552xFAMFS REV 1), the LPC55S2x/2x family relies on alternative security mechanisms including SRAM PUF, PRINCE encryption, and secure debug lock instead of TrustZone. This architectural choice prioritizes deterministic real-time behavior and hardware-rooted key generation over software-managed secure world isolation. The LPC55S26JBD100K achieves secure boot and runtime protection through its dedicated crypto engines and immutable root-of-trust.
What is the maximum operating frequency of LPC55S26JBD100K?
The LPC55S26JBD100K operates at up to 150 MHz across its specified voltage and temperature range (1.71–3.6 V, –40°C to +105°C). This frequency applies to both Cortex-M33 cores and is sustained using the internal system PLL with appropriate clock configuration. Performance benchmarks confirm consistent 150 MHz operation under thermal load in HLQFP100 packaging, with no derating required for typical industrial ambient conditions. The LPC55S26JBD100K maintains this speed while executing from encrypted flash via PRINCE.
Is LPC55S26JBD100K pin-compatible with LPC55S28JBD100K?
Yes, the LPC55S26JBD100K is pin-compatible with the LPC55S28JBD100K in the HLQFP100 package. Both share identical pin count, mechanical footprint, power/ground pin allocation, and peripheral signal mapping. This allows direct PCB-level substitution when upgrading from 256 KB to 512 KB flash, provided firmware and layout accommodate the increased memory size. No changes to schematic or board layout are needed - only software recompilation and flash programming adjustments are required for migration to LPC55S26JBD100K or LPC55S28JBD100K.
What development tools support LPC55S26JBD100K?
The LPC55S26JBD100K is fully supported by NXP's MCUXpresso ecosystem, including MCUXpresso IDE v11.7+, MCUXpresso SDK v2.12+, and LPCXpresso55S26 development board (OM13091). It also works with IAR Embedded Workbench for Arm and Arm Keil MDK-ARM. Debugging uses standard SWD protocol via LPC-Link2 or J-Link probes. All toolchains provide validated drivers for PRINCE, SRAM PUF, and FlexComm peripherals - no third-party patches or custom HAL layers are required for basic secure boot or interface initialization of LPC55S26JBD100K.
Does LPC55S26JBD100K include an integrated USB PHY?
Yes, the LPC55S26JBD100K includes a fully integrated high-speed (480 Mbps) and full-speed (12 Mbps) USB PHY compliant with USB 2.0 specifications. This eliminates the need for external transceivers in USB device or host implementations. The PHY connects directly to USB_DP and USB_DM pins in the HLQFP100 package and is managed by the on-chip USB controller with DMA support. Verified operation includes CDC ACM, HID, and MSC class devices - all tested and documented in NXP's LPC55S26 USB examples within the MCUXpresso SDK.
LPC55S26JBD100K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- LPC55S2x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 144K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S26JBD100K FAQ
1.How can I place an order for LPC55S26JBD100K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S26JBD100K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S26JBD100K reliable?
The price and inventory of LPC55S26JBD100K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S26JBD100K is usually 5 days.
3.What payment methods are accepted for LPC55S26JBD100K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S26JBD100K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC55S26JBD100K?
LPC55S26JBD100K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S26JBD100K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S26JBD100K?
For technical support, including LPC55S26JBD100K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S26JBD100K requirements.
6.How does Aetrix verify that LPC55S26JBD100K is sourced from the original manufacturer or authorized distributors?
All LPC55S26JBD100K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S26JBD100K meets industry standards.
7.What is the process for return or replacement of LPC55S26JBD100K?
All LPC55S26JBD100K units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S26JBD100K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S26JBD100K part is unused and in its original packaging.
Return procedure for LPC55S26JBD100K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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