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NXP Semiconductors LPC55S26JBD64E

Part No.:
LPC55S26JBD64E
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-TQFP Exposed Pad
Datasheet:
AetrixLPC55S26JBD64E.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:160

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Product details

Overview

LPC55S26JBD64E from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller with secure boot, PRINCE flash encryption, CASPER crypto co-processor, 256 KB on-chip flash, 144 KB SRAM, and dual USB (FS + HS) support - deployed in industrial IoT edge nodes requiring real-time control and cryptographic integrity.

For engineers reviewing the LPC55S26JBD64E datasheet, LPC55S26JBD64E pinout, LPC55S26JBD64E application, or LPC55S26JBD64E equivalent, key selection criteria include its HTQFP64 package (64-pin, 10 × 10 mm), 150 MHz CPU frequency, 36 GPIOs, integrated PUF/SHA2/AES engines, and support for SDIO, SCTimer/PWM, and Flexcomm serial peripherals.

Technical Context

The LPC55S26JBD64E implements an Arm Cortex-M33 core with MPU, FPU, DSP, and ETM, running at up to 150 MHz using PLL0/PLL1 clock sources derived from internal FRO (12 MHz or 1 MHz), external crystal (16–32 MHz), or RTC oscillator (32.768 kHz). Its security architecture integrates PRINCE for real-time flash encryption, CASPER for ECC acceleration, and PUF-based key generation.

Peripherals include nine Flexcomm interfaces (configurable as USART/SPI/I²C/I²S), a 16-bit 1.0 Msamples/sec ADC with simultaneous differential conversion, SCTimer/PWM with 16 capture/match registers, and dual USB controllers (full-speed + high-speed) with on-chip PHYs - all accessible via AHB/APB interconnect and managed by two DMA controllers (23 + 10 channels).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 @ 150 MHz with MPU, FPU, DSP, ETM
Memory256 KB flash (512-byte page erase/write) + 144 KB SRAM (32 KB code bus + 112 KB system bus)
SecurityPRINCE flash encryption, CASPER crypto co-processor, PUF, SHA2-AES engine, RSA-2048/4096 secure boot
USBFull-speed + high-speed host/device controller with on-chip PHY and crystal-less FS operation
Analog16-bit ADC @ 1.0 Msamples/sec, 5 differential/10 single-ended channels, integrated temp sensor & comparator
Timers5× 32-bit CTIMER, SCTimer/PWM (8 inputs/10 outputs), RTC (32 kHz FRO/crystal), MRT, WWDT, Micro-Tick Timer
I/O & Serial36 GPIOs, 9 Flexcomm interfaces (USART/SPI/I²C/I²S), SDIO, PLU, CRC engine, frequency measurement unit

Pinout & Package

Package: HTQFP64 (plastic low-profile quad flat package, 64 leads, 10 × 10 × 0.5 mm pitch, SOT855-5).

Pin/TerminalCircuit RoleDesign Meaning
PIO0_0 / ACMP0_AGPIO / Analog Comparator Input ADual-role pin supporting digital I/O or analog comparator input when ANAMODE enabled
PIO0_2 / TRSTJTAG Test Reset / Flexcomm3 SPI MISOBoundary scan reset function; defaults to SPI MISO in ISP mode
PIO0_3 / TCKJTAG Test Clock / Flexcomm3 SPI MOSIPrimary JTAG clock input; configured as SPI MOSI during ISP programming
PIO0_4 / TMSJTAG Test Mode Select / Flexcomm3 SPI SSEL0Selects JTAG instruction register; serves as SPI slave select in ISP mode
PIO0_5 / TDIJTAG Test Data In / Boot Source SelectorState at reset determines boot source (flash, USB, UART, SPI); enables ISP handler
PIO0_6 / TDOJTAG Test Data Out / Flexcomm3 SPI SCKSerial output of JTAG data; used as SPI clock during ISP programming
SWCLKSerial Wire Debug ClockDefault debug clock after boot; supports SWD interface without JTAG pins
SWOSerial Wire Output TraceAsynchronous trace output for real-time program flow analysis via SWD

Key Features

FeatureDesign Value
Secure Boot ArchitectureRSASSA-PKCS1-v1_5 signature verification using SHA256 digest and RSA-2048/4096 keys stored in x509 certificates
Real-Time Flash ProtectionPRINCE module encrypts/decrypts flash on-the-fly, enabling secure over-the-air updates without exposing plaintext firmware
Cryptographic AccelerationCASPER co-processor offloads ECC operations (e.g., ECDH, ECDSA), reducing CPU load and latency for TLS handshake
Flexible Serial PeripheralsNine software-configurable Flexcomm interfaces support mixed protocols (e.g., I²C master + SPI slave + USART simultaneously)
Low-Power Timing PrecisionRTC powered by 32.768 kHz FRO or crystal provides 1 s resolution and wake-up from deep power-down with 1 ms resolution

Applications

Industrial PLC Edge NodeSecure Medical Sensor Hub

Use Scenario: Real-time monitoring and control of motor drives, temperature sensors, and safety interlocks in factory automation cabinets.

IC Role / Device Role / Timing Role: Main application processor executing deterministic control loops, managing SDIO-connected fieldbus modules, and enforcing secure firmware updates.

Use Value: 150 MHz Cortex-M33 with SCTimer/PWM ensures sub-microsecond PWM jitter; PRINCE + secure boot prevents unauthorized firmware injection.

Use Scenario: Aggregation and cryptographic signing of ECG, SpO₂, and temperature data from multiple wired/wireless sensors in point-of-care devices.

IC Role / Device Role / Timing Role: Trusted execution environment for sensor fusion, AES-256 encryption, and secure boot validation before data transmission.

Use Value: PUF-generated keys eliminate key storage vulnerability; CASPER accelerates ECDSA signing for HIPAA-compliant audit logs.

Smart Energy GatewayAutomotive Diagnostic Tool

Use Scenario: Two-way communication between smart meters and utility headends via NB-IoT/LTE-M, with local energy analytics and tamper detection.

IC Role / Device Role / Timing Role: Secure host controller interfacing with cellular modem via UART/USB, managing encrypted flash partitions for OTA updates.

Use Value: Dual USB (FS+HS) enables high-speed diagnostics and firmware recovery; SHA2-AES engine validates signed firmware images pre-execution.

Use Scenario: Handheld OBD-II scanner performing UDS diagnostics, ECU reprogramming, and vehicle network security testing.

IC Role / Device Role / Timing Role: High-integrity bridge between USB-C host and CAN FD/J2534 physical layer, with secure bootloader for tool firmware updates.

Use Value: 36 GPIOs support custom CAN transceiver control and isolation logic; secure GPIO pins prevent unauthorized access to diagnostic interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC55S28JBD64512 KB flash, 256 KB SRAM, same package and peripheral setHigher memory capacity required for complex RTOS stacks or dual-application partitioningSelect when >256 KB flash is needed for feature-rich firmware or secure boot image redundancy
LPC5526JBD64No CASPER, PRINCE, PUF, or secure boot; identical core/peripherals otherwiseCost-sensitive industrial control where cryptographic features are unnecessaryChoose for non-security-critical applications to reduce BOM cost while retaining timing/peripheral compatibility

Compared with LPC55S26JBD64E, LPC55S28JBD64 offers expanded memory for larger firmware images, while LPC5526JBD64 removes security hardware to lower cost - making LPC55S26JBD64E the optimal balance of security, performance, and footprint for certified edge devices.

Availability

LPC55S26JBD64E is available at Aetrix Electronics and suitable for industrial IoT gateways, medical sensor hubs, and automotive diagnostic tools requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC55S26JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC55S2x product line delivers Arm Cortex-M33 microcontrollers with hardware-enforced security, optimized for edge devices needing certified secure boot, real-time control, and cryptographic processing in compact packages.

FAQ

What is the maximum operating frequency of the LPC55S26JBD64E?

The LPC55S26JBD64E operates at a maximum CPU frequency of 150 MHz, achieved using PLL0 or PLL1 clock sources derived from internal FRO (12 MHz or 1 MHz), external crystal (16–32 MHz), or the 32.768 kHz RTC oscillator. This frequency is sustained across the full industrial temperature range (−40 °C to +105 °C) with voltage supply between 1.8 V and 3.6 V.

Does the LPC55S26JBD64E support secure boot with public-key cryptography?

Yes, the LPC55S26JBD64E supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, validated against RSA-2048 or RSA-4096 public keys stored in x509 certificates. It enforces anti-rollback via image key revocation and stores up to four Root of Trust public key hashes in protected flash.

How many GPIO pins does the LPC55S26JBD64E provide in its HTQFP64 package?

The LPC55S26JBD64E in HTQFP64 package provides 36 general-purpose I/O pins. These include configurable functions such as ADC inputs, comparator inputs, Flexcomm peripheral signals, and secure GPIO capability. Pin multiplexing is controlled via IOCON registers, with default reset state disabling pull-ups/pull-downs except on designated debug and boot pins.

What USB capabilities does the LPC55S26JBD64E offer?

The LPC55S26JBD64E integrates both USB 2.0 full-speed and high-speed host/device controllers with on-chip PHYs. Full-speed mode supports crystal-less operation using software library TN00063, while high-speed mode uses a dedicated on-chip PHY. Both controllers include dedicated DMA support and operate independently with separate endpoints and buffers.

Is the LPC55S26JBD64E compatible with the LPC55S28JBD64 in terms of pinout and software?

Yes, the LPC55S26JBD64E is pin-compatible with LPC55S28JBD64 in the HTQFP64 package, sharing identical pin assignments, peripheral mappings, and register layout. Software developed for LPC55S28JBD64 runs unmodified on LPC55S26JBD64E, though flash/SRAM size differences require linker script adjustment for memory allocation.

LPC55S26JBD64E Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-TQFP Exposed Pad
Series:
LPC55S2x
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
144K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S26JBD64E FAQ

1.How can I place an order for LPC55S26JBD64E through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S26JBD64E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S26JBD64E reliable?

The price and inventory of LPC55S26JBD64E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S26JBD64E is usually 5 days.

3.What payment methods are accepted for LPC55S26JBD64E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S26JBD64E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S26JBD64E?

LPC55S26JBD64E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S26JBD64E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S26JBD64E?

For technical support, including LPC55S26JBD64E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S26JBD64E requirements.

6.How does Aetrix verify that LPC55S26JBD64E is sourced from the original manufacturer or authorized distributors?

All LPC55S26JBD64E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S26JBD64E meets industry standards.

7.What is the process for return or replacement of LPC55S26JBD64E?

All LPC55S26JBD64E units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S26JBD64E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S26JBD64E part is unused and in its original packaging.

Return procedure for LPC55S26JBD64E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC55S26JBD64E Tags

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