NXP Semiconductors LPC55S26JBD64K
- Part No.:
- LPC55S26JBD64K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S26JBD64K.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,362
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Product details
Overview
LPC55S26JBD64K from NXP is a dual-core Arm Cortex-M33 microcontroller operating at up to 150 MHz with 256 KB on-chip flash, 144 KB SRAM, and integrated security features including AES-256, SHA-2, SRAM PUF, and PRINCE real-time encryption-designed for secure industrial IoT edge nodes requiring authenticated boot and encrypted firmware execution.
For engineers reviewing the LPC55S26JBD64K datasheet, LPC55S26JBD64K pinout, LPC55S26JBD64K application, or LPC55S26JBD64K equivalent, key selection considerations include its HTQFP64 package, dual M33 cores with TrustZone *not supported*, FlexComm interface configurability (UART/SPI/I²C/I²S), USB HS/FS PHY integration, and mandatory secure debug authentication via PFR and UID.
Technical Context
The LPC55S26JBD64K implements two Arm Cortex-M33 cores without TrustZone, sharing a unified memory map and clocked by a configurable System PLL up to 150 MHz. It integrates a dedicated Crypto Engine supporting AES-256/SHA-2 acceleration and PRINCE for transparent flash decryption during execution.
Its analog subsystem includes a 16-bit 1 MSPS ADC, ACMP, and on-die temperature sensor; digital peripherals include 8 FlexComm units (each configurable as UART/SPI/I²C/I²S), SDIO, HS/FS USB with embedded PHY, and a programmable logic unit (6-input, 8-output) for glue logic offload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-M33 @ up to 150 MHz, no TrustZone support per official family documentation |
| Memory | 256 KB flash + 144 KB SRAM; supports PRINCE real-time encrypted execution from flash |
| Security | AES-256/SHA-2 hardware accelerator, SRAM PUF for device-unique key generation, secure debug enforced via PFR |
| Connectivity | 8 FlexComm interfaces (UART/SPI/I²C/I²S configurable), HS/FS USB with on-chip PHY, SDIO, HS SPI |
| Analog | 16-bit 1 MSPS ADC, 2-channel ACMP, integrated temperature sensor |
| Power | Single Vdd supply with POR/BOD, multiple low-power modes, integrated DC-DC converter |
Pinout & Package
Package: HTQFP64 (64-pin, 10 mm × 10 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate analog domain supply for ADC/ACMP reference stability |
| P0_0–P0_31 | GPIO / FlexComm / USB / SDIO | Multiplexed I/O supporting up to 8 FlexComm instances, USB D+/D−, SDIO bus, and high-drive GPIO |
| XTAL_IN/XTAL_OUT | Crystal oscillator input/output | Supports 1–25 MHz external crystal for precision clock source feeding CGU |
| USB_DP/USB_DM | High-speed USB differential pair | Integrated HS USB PHY enables full-speed and high-speed operation without external transceiver |
| SWD_CLK/SWD_DIO | Secure debug interface | Two-pin SWD port with PFR-enforced authentication required for debug access |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-M33 cores | Independent execution domains enable asymmetric RTOS partitioning or lockstep safety monitoring (non-certified) |
| PRINCE encryption engine | Enables real-time decryption of encrypted flash contents-no external memory or software decryption overhead |
| SRAM PUF | Generates device-unique cryptographic keys from intrinsic SRAM startup behavior-no eFUSE or nonvolatile key storage needed |
| 8 FlexComm interfaces | Each configurable in runtime as UART, SPI, I²C, or I²S-reduces need for external level shifters or protocol bridges |
| Integrated DC-DC converter | Reduces external component count and improves efficiency across active and low-power modes vs. LDO-only solutions |
Applications
| Smart Building Sensor Node | Industrial Diagnostic Tool |
|---|---|
Use Scenario: Wireless HVAC sensor hub collecting temperature, humidity, and CO₂ data with local anomaly detection and encrypted OTA updates. IC Role / Device Role / Timing Role: Main application processor executing RTOS, managing multi-sensor ADC acquisition, running SHA-2/AES-256 for firmware signature verification and payload encryption. Use Value: SRAM PUF eliminates secure key provisioning cost; PRINCE enables encrypted field-upgradable firmware without RAM footprint penalty. | Use Scenario: Portable handheld tester for motor drive commissioning, capturing PWM waveforms and bus voltage/current via isolated probes. IC Role / Device Role / Timing Role: Real-time controller synchronizing 16-bit ADC sampling to gate driver timing, buffering data in SRAM, and streaming over USB HS to PC host. Use Value: Dual M33 cores allow dedicated waveform capture thread and separate UI/communication thread; FlexComm flexibility supports custom probe interface protocols. |
| Secure Consumer Gateway | Edge AI Inference Node |
Use Scenario: Home automation gateway aggregating Zigbee/Z-Wave devices, enforcing TLS 1.3 tunneling to cloud, and performing local policy enforcement. IC Role / Device Role / Timing Role: Secure root-of-trust anchor using PUF-derived keys, authenticating boot chain, and accelerating TLS handshake via Crypto Engine. Use Value: Hardware-accelerated SHA-2 and AES-256 reduce CPU load by >70% during TLS negotiation vs. software-only implementation. | Use Scenario: Battery-powered predictive maintenance node running lightweight neural network inference on vibration spectra from MEMS accelerometers. IC Role / Device Role / Timing Role: Low-latency inference engine leveraging SIMD instructions in Cortex-M33 core, with ADC-triggered DMA transfers to minimize CPU intervention. Use Value: 1 MSPS 16-bit ADC captures high-fidelity spectral data; integrated DC-DC extends battery life by 35% vs. LDO-based designs at 10 mA average load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S28JBD64K | 512 KB flash, 256 KB SRAM, identical security/peripheral set, same HTQFP64 package | Supports larger firmware images and complex middleware stacks (e.g., full BLE stack + secure bootloader) | Select when firmware size exceeds 256 KB or additional SRAM is required for multi-threaded RTOS workloads |
| RA6M5GFP100CH00 | Arm Cortex-M33 with TrustZone, 1 MB flash, 512 KB SRAM, no PRINCE or SRAM PUF, Renesas GigaDevice-compatible toolchain | Targets functional safety (IEC 61508 SIL2-ready) but lacks NXP's hardware root-of-trust primitives | Select when TrustZone isolation is mandatory and external key management infrastructure is acceptable |
Compared with LPC55S26JBD64K, LPC55S28JBD64K offers double flash/SRAM for scalable firmware while retaining identical security architecture; RA6M5GFP100CH00 provides TrustZone-based isolation but requires external key provisioning and lacks PUF/PRINCE-making it less suitable for zero-touch secure deployment.
Availability
LPC55S26JBD64K is available at Aetrix Electronics and suitable for industrial IoT edge nodes, secure diagnostic tools, and smart building controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC55S26JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC55S26JBD64K belongs to NXP's LPC5500 series-a mainstream Arm Cortex-M33 MCU family engineered for cost-sensitive, security-critical embedded applications where energy efficiency, peripheral integration, and hardware-rooted trust are essential.
FAQ
Does LPC55S26JBD64K support Arm TrustZone technology?
No, the LPC55S26JBD64K explicitly does not support Arm TrustZone. This is confirmed in the official LPC552xFAMFS document revision 1, which states "LPC55S2x/2x does not support Arm TrustZone technology." Security isolation relies instead on NXP's proprietary PFR, secure debug enforcement, and memory protection unit (MPU) configuration-making LPC55S26JBD64K appropriate for applications requiring hardware-rooted security without TrustZone dependency.
What is the maximum clock frequency and core configuration of LPC55S26JBD64K?
The LPC55S26JBD64K operates at up to 150 MHz using two Arm Cortex-M33 cores without floating-point units enabled by default. Both cores share the same memory map and clock domain, and each supports SIMD instructions. The System PLL generates the core clock, and the USB PLL provides dedicated timing for high-speed USB operation-enabling deterministic real-time response in dual-core configurations.
How does the PRINCE engine function in LPC55S26JBD64K?
The PRINCE engine in LPC55S26JBD64K performs real-time AES-128 decryption of encrypted flash contents during instruction fetch-without requiring decrypted code to reside in SRAM. This allows LPC55S26JBD64K to execute firmware directly from encrypted flash, reducing attack surface and eliminating RAM-based decryption overhead. PRINCE keys are derived from the SRAM PUF and protected by the PFR, ensuring that decryption only occurs under authenticated boot conditions.
Which development boards are compatible with LPC55S26JBD64K?
The LPCXpresso55S28 Development Board (LPC55S28-EVK) is fully compatible with LPC55S26JBD64K due to pin, peripheral, and software compatibility within the LPC55S2x family. It features onboard Link2 debug probe, Arduino®/Mikroe headers, and direct support in MCUXpresso IDE-allowing rapid evaluation of LPC55S26JBD64K's FlexComm, USB, and security features without hardware modification.
What security features are unique to LPC55S26JBD64K compared to standard Cortex-M33 MCUs?
LPC55S26JBD64K integrates several hardware security features uncommon in generic Cortex-M33 MCUs: SRAM PUF for unclonable key generation, PRINCE for real-time encrypted flash execution, dedicated Crypto Engine for AES-256/SHA-2 acceleration, and PFR-enforced secure debug authentication. These features collectively establish a hardware-rooted chain of trust absent in most competitive offerings-making LPC55S26JBD64K especially suited for zero-touch provisioning and firmware IP protection.
LPC55S26JBD64K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S2x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 144K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S26JBD64K FAQ
1.How can I place an order for LPC55S26JBD64K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S26JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S26JBD64K reliable?
The price and inventory of LPC55S26JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S26JBD64K is usually 5 days.
3.What payment methods are accepted for LPC55S26JBD64K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S26JBD64K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC55S26JBD64K?
LPC55S26JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S26JBD64K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S26JBD64K?
For technical support, including LPC55S26JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S26JBD64K requirements.
6.How does Aetrix verify that LPC55S26JBD64K is sourced from the original manufacturer or authorized distributors?
All LPC55S26JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S26JBD64K meets industry standards.
7.What is the process for return or replacement of LPC55S26JBD64K?
All LPC55S26JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S26JBD64K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S26JBD64K part is unused and in its original packaging.
Return procedure for LPC55S26JBD64K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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