NXP Semiconductors LPC55S26JBD64Y

Overview

LPC55S26JBD64Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller with secure boot, PRINCE flash encryption, CASPER crypto co-processor, 256 KB on-chip flash, 144 KB SRAM, and dual USB (FS + HS) support-designed for secure IoT edge nodes requiring cryptographic acceleration and low-power operation in industrial sensing applications.

For engineers reviewing the LPC55S26JBD64Y datasheet, LPC55S26JBD64Y pinout, LPC55S26JBD64Y application, or LPC55S26JBD64Y equivalent, key selection criteria include its 150 MHz CPU frequency, HTQFP64 package with 36 GPIOs, integrated PUF and TRNG for root-of-trust, PRINCE-encrypted flash capability, and hardware-accelerated SHA2/AES/ECDSA via CASPER.

Technical Context

The LPC55S26JBD64Y implements an Arm Cortex-M33 core with MPU, FPU, DSP, and ETM, running at up to 150 MHz using PLL0/PLL1 clock sources derived from internal FRO (12 MHz or 1 MHz), external crystal (16–32 MHz), or RTC oscillator (32.768 kHz). Its security architecture integrates PRINCE for real-time flash encryption/decryption, PUF for silicon-based key generation (64–4096 bits), and dedicated HASH-AES/SHA2 engines with DMA support.

Peripherals include nine Flexcomm interfaces (configurable as USART/SPI/I2C/I2S), one SCTimer/PWM with 10 outputs and 8 inputs, five 32-bit general-purpose timers, 16-bit 1.0 Msamples/sec ADC with simultaneous differential conversion, and SDIO interface supporting SDR25 (52 MHz) and dual-card operation-all accessible via AHB/APB interconnect with DMA0 (23-channel) and DMA1 (10-channel) controllers.

Key Specifications

Pinout & Package

Package: HTQFP64 (10 × 10 × 0.5 mm, pitch 0.5 mm, SOT855-5). Pin count: 64 leads. Thermal pad exposed on underside for enhanced heat dissipation in compact industrial PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar secure microcontroller applications.

Compared with LPC55S28JBD64 and RA6M5GFPMXXFA, the LPC55S26JBD64Y delivers optimal balance of security features (PRINCE, CASPER, PUF), power efficiency, and cost for resource-constrained secure edge nodes - especially where flash encryption and ECC acceleration outweigh raw memory capacity or automotive interface needs.

Availability

LPC55S26JBD64Y is available at Aetrix Electronics and suitable for industrial sensor nodes, secure IoT gateways, and smart energy meters requiring stable component supply, long-term lifecycle support, and traceable sourcing for safety-critical deployments.

Supply support for LPC55S26JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based microcontrollers and hardware security IP.

The LPC55S2x series was designed specifically for secure, low-power edge intelligence - integrating PRINCE, CASPER, and PUF to address firmware protection, cryptographic acceleration, and device identity challenges in certified industrial and medical applications.

FAQ

What is the maximum operating frequency of the LPC55S26JBD64Y?

The LPC55S26JBD64Y operates at a maximum CPU frequency of 150 MHz, achieved using PLL0 or PLL1 clock sources derived from internal FRO (12 MHz or 1 MHz), external crystal (16–32 MHz), or RTC oscillator (32.768 kHz). This frequency is sustained across the full -40 °C to +105 °C temperature range and 1.8–3.6 V supply voltage, with no derating required under typical industrial conditions. The LPC55S26JBD64Y maintains deterministic real-time performance at this rate due to its tightly coupled memory architecture and zero-wait-state flash accelerator.

Does the LPC55S26JBD64Y support secure boot with public-key verification?

Yes, the LPC55S26JBD64Y supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, with RSA-2048 and RSA-4096 public keys validated against x.509 certificates. It stores up to four revocable Root-of-Trust (RoT) keys in protected flash, and supports anti-rollback via image key revocation using the Serial Number field in x.509 certificates - all enforced by ROM bootloader before executing user code. The LPC55S26JBD64Y requires no external secure element to achieve this level of boot integrity.

How does the PRINCE module function in the LPC55S26JBD64Y?

The PRINCE module in the LPC55S26JBD64Y performs real-time AES-128 encryption of data written to on-chip flash and decryption of encrypted data read from flash - transparently handled by the flash controller without CPU intervention. This enables asset protection for application code and secure firmware updates while maintaining full flash performance. The LPC55S26JBD64Y supports booting directly from PRINCE-encrypted regions, and the encryption key is derived from the device's unique PUF output, ensuring per-unit key binding.

What analog capabilities does the LPC55S26JBD64Y provide?

The LPC55S26JBD64Y integrates a 16-bit successive-approximation ADC with five differential or ten single-ended input channels, sample rates up to 1.0 Msamples/sec, and simultaneous conversion capability on paired differential inputs. It also includes an integrated temperature sensor, five-input analog comparator with internal/external reference support, and dedicated VDDA/VSSA analog power pins. These features enable high-precision sensor acquisition in applications like motor current sensing or environmental monitoring - all without external signal conditioning circuitry.

Which package and pin count does the LPC55S26JBD64Y use?

The LPC55S26JBD64Y uses the HTQFP64 package: a 64-pin thin quad flat package with 10 mm × 10 mm body size, 0.5 mm pitch, and exposed thermal pad (SOT855-5). It provides 36 GPIOs, including secure GPIO options, and supports all core peripherals - USB HS/FS, Flexcomm interfaces, SDIO, and ADC - within this compact footprint. This package is optimized for automated assembly and thermal management in space-constrained industrial PCBs.