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NXP Semiconductors LPC55S28JBD100K

Part No.:
LPC55S28JBD100K
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP Exposed Pad
Datasheet:
AetrixLPC55S28JBD100K.pdf
Description:
IC MCU 32BIT 512KB FLSH 100HLQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:956

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Product details

Overview

LPC55S28JBD100K from NXP is a dual-core Arm Cortex-M33 microcontroller operating at up to 150 MHz with 512 KB on-chip flash, 256 KB SRAM, and integrated PRINCE real-time encryption engine, AES-256/SHA-2 crypto accelerator, and SRAM PUF for secure boot and provisioning - deployed in industrial IoT gateways requiring trusted firmware execution and tamper-resistant device identity.

For engineers reviewing the LPC55S28JBD100K datasheet, LPC55S28JBD100K pinout, LPC55S28JBD100K application, or LPC55S28JBD100K equivalent, key selection considerations include its dual M33 core support (one with TrustZone disabled), FlexComm interface configurability (UART/SPI/I²C/I²S), HS/FS USB with PHY, SDIO host capability, and HLQFP100 package with 100-pin 0.5 mm pitch layout.

Technical Context

The LPC55S28JBD100K implements two Arm Cortex-M33 cores without TrustZone, each with FPU and SIMD support, sharing system resources including memory controllers, DMA engines (DMA0: 22-channel, DMA1: 10-channel), and clock generation (System PLL + USB PLL). It integrates a dedicated ROM bootloader (128 KB) supporting in-system flash programming via UART, USB, or SPI.

Security architecture includes hardware-accelerated AES-256/SHA-2, PRINCE for on-the-fly encrypted flash execution, SRAM PUF for unique device key derivation, and secure debug authentication enforced by PFR and UID registers - all verified under NXP's LPC552xFAMFS Rev 1 specification.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual Arm Cortex-M33 @ up to 150 MHz, no TrustZone, each with FPU and SIMD
Memory512 KB embedded flash + 256 KB SRAM; supports PRINCE real-time decryption during execution
Crypto EngineAES-256/SHA-2 hardware accelerator + SRAM PUF for root-of-trust key generation
Connectivity8× FlexComm interfaces (configurable as UART/SPI/I²C/I²S), HS/FS USB with PHY, SDIO host
Analog Peripherals16-bit 1 MSPS ADC, ACMP, temperature sensor, programmable logic unit (6-in/8-out)
Power ManagementSingle Vdd supply with POR/BOD, DC-DC converter, multiple low-power modes

Pinout & Package

Package: HLQFP100 (100-pin, 0.5 mm pitch, exposed thermal pad).

Pin/TerminalCircuit RoleDesign Meaning
VDDA/VSSAAnalog power/groundSeparate analog domain supply for ADC/ACMP reference stability
P0_0–P0_31, P1_0–P1_19GPIO with multiplexed functionsSupports FlexComm, USB, SDIO, SCTimer, and programmable logic unit I/O mapping
USB_DP/USB_DMHigh-speed USB differential pairIntegrated HS USB 2.0 PHY enables full-speed and high-speed operation without external transceiver
SDIO_CLK/SDIO_CMD/SDIO_D0–D3SDIO host interface signalsDirect connection to SD/microSD cards; supports 4-bit wide data transfer at up to 50 MHz
XTAL_IN/XTAL_OUTMain crystal oscillator terminalsSupports 1–25 MHz external crystal for precise system clock generation

Key Features

FeatureDesign Value
Dual Cortex-M33 coresEnables asymmetric processing: one core for real-time control, second for secure services or protocol stacks
PRINCE encryption engineAllows execution of code directly from encrypted flash - eliminates need for external secure memory
SRAM PUF-based key generationDerives cryptographically strong device-unique keys without storing secrets in nonvolatile memory
8 configurable FlexComm unitsReduces BOM count by eliminating discrete interface bridges; supports mixed UART/SPI/I²C/I²S simultaneously
Integrated DC-DC converterImproves power efficiency across operating modes; supports dynamic voltage scaling for performance vs. current trade-offs

Applications

Industrial IoT GatewaySecure Edge Node

Use Scenario: Aggregating sensor data from Modbus/RS485 field devices and forwarding via TLS-secured MQTT to cloud platforms.

IC Role / Device Role / Timing Role: Main application processor handling protocol translation, secure connectivity, and local decision logic.

Use Value: Dual M33 cores isolate communication stack from control tasks; PRINCE ensures firmware integrity during OTA updates.

Use Scenario: Tamper-evident asset tracker with GPS, motion sensing, and cellular backhaul in logistics.

IC Role / Device Role / Timing Role: Root-of-trust anchor managing secure boot, encrypted telemetry storage, and authenticated sensor readings.

Use Value: SRAM PUF eliminates need for external eFuse or secure element; AES-256 encrypts payload before transmission.

Building Automation ControllerDiagnostic Equipment Interface

Use Scenario: HVAC controller interfacing with BACnet MS/TP fieldbus and BLE-enabled HMI panel.

IC Role / Device Role / Timing Role: Central timing and interface coordinator managing multiple serial buses and real-time actuator response.

Use Value: 8 FlexComm units enable concurrent BACnet UART, BLE HCI UART, I²C sensor bus, and I²S audio feedback without resource contention.

Use Scenario: Portable medical diagnostic device requiring FDA-compliant secure firmware update and calibrated analog signal acquisition.

IC Role / Device Role / Timing Role: High-precision timing and signal conditioning hub with deterministic ADC sampling and cryptographic signature verification.

Use Value: 16-bit 1 MSPS ADC meets EN 62304 Class C timing requirements; secure debug lock prevents unauthorized firmware access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar secure microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC55S69JBD100KSame dual M33 core, 150 MHz, but adds TrustZone support and larger 640 KB flashRequired for applications needing hardware-isolated secure/non-secure worlds (e.g., payment terminal firmware)Select when TrustZone partitioning is mandatory; not drop-in due to different security register map
RA6M5GFP100AA00Renesas RA6M5 with Cortex-M33, 200 MHz, 1 MB flash, but lacks SRAM PUF and PRINCESuitable for high-throughput industrial control where crypto acceleration is handled externally or via softwareChoose when higher CPU clock and larger memory outweigh on-die encryption needs

Compared with LPC55S28JBD100K, LPC55S69JBD100K provides stronger isolation via TrustZone but requires firmware rearchitecture, while RA6M5GFP100AA00 offers greater raw performance and memory headroom at the cost of integrated hardware security features essential for zero-trust edge deployments.

Availability

LPC55S28JBD100K is available at Aetrix Electronics and suitable for industrial IoT gateways, secure edge nodes, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC55S28JBD100K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC55S28JBD100K belongs to NXP's LPC552x family - designed specifically for cost-sensitive, security-critical embedded applications demanding hardware-rooted trust, real-time responsiveness, and high peripheral integration without external components.

FAQ

What is the maximum operating frequency of the LPC55S28JBD100K?

The LPC55S28JBD100K operates at up to 150 MHz on both Arm Cortex-M33 cores. This frequency is sustained under full voltage and temperature specifications per NXP's LPC552xFAMFS Rev 1 datasheet, with System PLL and USB PLL enabling independent clock domains for peripherals and USB functionality. The LPC55S28JBD100K maintains deterministic timing at this rate across all supported low-power modes.

Does the LPC55S28JBD100K support TrustZone technology?

No, the LPC55S28JBD100K does not support Arm TrustZone. According to NXP's official documentation (LPC552xFAMFS Rev 1), TrustZone is explicitly excluded from the LPC55S2x series. Security isolation relies instead on PRINCE, SRAM PUF, and PFR-based debug lockdown - making the LPC55S28JBD100K appropriate for applications requiring hardware-enforced encryption and device identity without full TrustZone world separation.

What package type is used for the LPC55S28JBD100K?

The LPC55S28JBD100K uses the HLQFP100 package: a 100-pin, thermally enhanced low-profile quad flat pack with 0.5 mm pitch and exposed thermal pad. This package is pin-compatible with other LPC552x variants in the same footprint (e.g., LPC55S26JBD100K), enabling design reuse across memory/configurations while maintaining mechanical and thermal compatibility in industrial PCB layouts.

How does the PRINCE engine function in the LPC55S28JBD100K?

The PRINCE engine in the LPC55S28JBD100K performs real-time AES-128 decryption of flash contents during instruction fetch, allowing secure code execution directly from encrypted memory. It operates transparently to software, requires no runtime CPU overhead, and supports key provisioning via SRAM PUF - ensuring that the LPC55S28JBD100K can run authenticated, encrypted firmware images without exposing plaintext code in memory or flash.

Can the LPC55S28JBD100K support simultaneous USB and SDIO operations?

Yes, the LPC55S28JBD100K supports concurrent HS/FS USB and SDIO host operations. Its dedicated USB PHY and separate SDIO controller operate on independent clock domains (USB PLL vs. System PLL), and share no critical memory or DMA resources. Verified in NXP's MCUXpresso SDK examples, the LPC55S28JBD100K reliably handles USB CDC ACM communication while streaming data from microSD cards - a capability confirmed in LPC552xFAMFS Rev 1 timing and resource allocation tables.

LPC55S28JBD100K Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP Exposed Pad
Series:
LPC55S2x
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S28JBD100K FAQ

1.How can I place an order for LPC55S28JBD100K through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S28JBD100K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S28JBD100K reliable?

The price and inventory of LPC55S28JBD100K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S28JBD100K is usually 5 days.

3.What payment methods are accepted for LPC55S28JBD100K?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S28JBD100K transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S28JBD100K?

LPC55S28JBD100K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S28JBD100K order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S28JBD100K?

For technical support, including LPC55S28JBD100K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S28JBD100K requirements.

6.How does Aetrix verify that LPC55S28JBD100K is sourced from the original manufacturer or authorized distributors?

All LPC55S28JBD100K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S28JBD100K meets industry standards.

7.What is the process for return or replacement of LPC55S28JBD100K?

All LPC55S28JBD100K units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S28JBD100K, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S28JBD100K part is unused and in its original packaging.

Return procedure for LPC55S28JBD100K:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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