NXP Semiconductors LPC55S28JBD100K
- Part No.:
- LPC55S28JBD100K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
LPC55S28JBD100K.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 100HLQFP
- Quantity:
- Payment:

- Shipping:

Inventory:956
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC55S28JBD100K from NXP is a dual-core Arm Cortex-M33 microcontroller operating at up to 150 MHz with 512 KB on-chip flash, 256 KB SRAM, and integrated PRINCE real-time encryption engine, AES-256/SHA-2 crypto accelerator, and SRAM PUF for secure boot and provisioning - deployed in industrial IoT gateways requiring trusted firmware execution and tamper-resistant device identity.
For engineers reviewing the LPC55S28JBD100K datasheet, LPC55S28JBD100K pinout, LPC55S28JBD100K application, or LPC55S28JBD100K equivalent, key selection considerations include its dual M33 core support (one with TrustZone disabled), FlexComm interface configurability (UART/SPI/I²C/I²S), HS/FS USB with PHY, SDIO host capability, and HLQFP100 package with 100-pin 0.5 mm pitch layout.
Technical Context
The LPC55S28JBD100K implements two Arm Cortex-M33 cores without TrustZone, each with FPU and SIMD support, sharing system resources including memory controllers, DMA engines (DMA0: 22-channel, DMA1: 10-channel), and clock generation (System PLL + USB PLL). It integrates a dedicated ROM bootloader (128 KB) supporting in-system flash programming via UART, USB, or SPI.
Security architecture includes hardware-accelerated AES-256/SHA-2, PRINCE for on-the-fly encrypted flash execution, SRAM PUF for unique device key derivation, and secure debug authentication enforced by PFR and UID registers - all verified under NXP's LPC552xFAMFS Rev 1 specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-M33 @ up to 150 MHz, no TrustZone, each with FPU and SIMD |
| Memory | 512 KB embedded flash + 256 KB SRAM; supports PRINCE real-time decryption during execution |
| Crypto Engine | AES-256/SHA-2 hardware accelerator + SRAM PUF for root-of-trust key generation |
| Connectivity | 8× FlexComm interfaces (configurable as UART/SPI/I²C/I²S), HS/FS USB with PHY, SDIO host |
| Analog Peripherals | 16-bit 1 MSPS ADC, ACMP, temperature sensor, programmable logic unit (6-in/8-out) |
| Power Management | Single Vdd supply with POR/BOD, DC-DC converter, multiple low-power modes |
Pinout & Package
Package: HLQFP100 (100-pin, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate analog domain supply for ADC/ACMP reference stability |
| P0_0–P0_31, P1_0–P1_19 | GPIO with multiplexed functions | Supports FlexComm, USB, SDIO, SCTimer, and programmable logic unit I/O mapping |
| USB_DP/USB_DM | High-speed USB differential pair | Integrated HS USB 2.0 PHY enables full-speed and high-speed operation without external transceiver |
| SDIO_CLK/SDIO_CMD/SDIO_D0–D3 | SDIO host interface signals | Direct connection to SD/microSD cards; supports 4-bit wide data transfer at up to 50 MHz |
| XTAL_IN/XTAL_OUT | Main crystal oscillator terminals | Supports 1–25 MHz external crystal for precise system clock generation |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-M33 cores | Enables asymmetric processing: one core for real-time control, second for secure services or protocol stacks |
| PRINCE encryption engine | Allows execution of code directly from encrypted flash - eliminates need for external secure memory |
| SRAM PUF-based key generation | Derives cryptographically strong device-unique keys without storing secrets in nonvolatile memory |
| 8 configurable FlexComm units | Reduces BOM count by eliminating discrete interface bridges; supports mixed UART/SPI/I²C/I²S simultaneously |
| Integrated DC-DC converter | Improves power efficiency across operating modes; supports dynamic voltage scaling for performance vs. current trade-offs |
Applications
| Industrial IoT Gateway | Secure Edge Node |
|---|---|
Use Scenario: Aggregating sensor data from Modbus/RS485 field devices and forwarding via TLS-secured MQTT to cloud platforms. IC Role / Device Role / Timing Role: Main application processor handling protocol translation, secure connectivity, and local decision logic. Use Value: Dual M33 cores isolate communication stack from control tasks; PRINCE ensures firmware integrity during OTA updates. | Use Scenario: Tamper-evident asset tracker with GPS, motion sensing, and cellular backhaul in logistics. IC Role / Device Role / Timing Role: Root-of-trust anchor managing secure boot, encrypted telemetry storage, and authenticated sensor readings. Use Value: SRAM PUF eliminates need for external eFuse or secure element; AES-256 encrypts payload before transmission. |
| Building Automation Controller | Diagnostic Equipment Interface |
Use Scenario: HVAC controller interfacing with BACnet MS/TP fieldbus and BLE-enabled HMI panel. IC Role / Device Role / Timing Role: Central timing and interface coordinator managing multiple serial buses and real-time actuator response. Use Value: 8 FlexComm units enable concurrent BACnet UART, BLE HCI UART, I²C sensor bus, and I²S audio feedback without resource contention. | Use Scenario: Portable medical diagnostic device requiring FDA-compliant secure firmware update and calibrated analog signal acquisition. IC Role / Device Role / Timing Role: High-precision timing and signal conditioning hub with deterministic ADC sampling and cryptographic signature verification. Use Value: 16-bit 1 MSPS ADC meets EN 62304 Class C timing requirements; secure debug lock prevents unauthorized firmware access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S69JBD100K | Same dual M33 core, 150 MHz, but adds TrustZone support and larger 640 KB flash | Required for applications needing hardware-isolated secure/non-secure worlds (e.g., payment terminal firmware) | Select when TrustZone partitioning is mandatory; not drop-in due to different security register map |
| RA6M5GFP100AA00 | Renesas RA6M5 with Cortex-M33, 200 MHz, 1 MB flash, but lacks SRAM PUF and PRINCE | Suitable for high-throughput industrial control where crypto acceleration is handled externally or via software | Choose when higher CPU clock and larger memory outweigh on-die encryption needs |
Compared with LPC55S28JBD100K, LPC55S69JBD100K provides stronger isolation via TrustZone but requires firmware rearchitecture, while RA6M5GFP100AA00 offers greater raw performance and memory headroom at the cost of integrated hardware security features essential for zero-trust edge deployments.
Availability
LPC55S28JBD100K is available at Aetrix Electronics and suitable for industrial IoT gateways, secure edge nodes, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC55S28JBD100K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC55S28JBD100K belongs to NXP's LPC552x family - designed specifically for cost-sensitive, security-critical embedded applications demanding hardware-rooted trust, real-time responsiveness, and high peripheral integration without external components.
FAQ
What is the maximum operating frequency of the LPC55S28JBD100K?
The LPC55S28JBD100K operates at up to 150 MHz on both Arm Cortex-M33 cores. This frequency is sustained under full voltage and temperature specifications per NXP's LPC552xFAMFS Rev 1 datasheet, with System PLL and USB PLL enabling independent clock domains for peripherals and USB functionality. The LPC55S28JBD100K maintains deterministic timing at this rate across all supported low-power modes.
Does the LPC55S28JBD100K support TrustZone technology?
No, the LPC55S28JBD100K does not support Arm TrustZone. According to NXP's official documentation (LPC552xFAMFS Rev 1), TrustZone is explicitly excluded from the LPC55S2x series. Security isolation relies instead on PRINCE, SRAM PUF, and PFR-based debug lockdown - making the LPC55S28JBD100K appropriate for applications requiring hardware-enforced encryption and device identity without full TrustZone world separation.
What package type is used for the LPC55S28JBD100K?
The LPC55S28JBD100K uses the HLQFP100 package: a 100-pin, thermally enhanced low-profile quad flat pack with 0.5 mm pitch and exposed thermal pad. This package is pin-compatible with other LPC552x variants in the same footprint (e.g., LPC55S26JBD100K), enabling design reuse across memory/configurations while maintaining mechanical and thermal compatibility in industrial PCB layouts.
How does the PRINCE engine function in the LPC55S28JBD100K?
The PRINCE engine in the LPC55S28JBD100K performs real-time AES-128 decryption of flash contents during instruction fetch, allowing secure code execution directly from encrypted memory. It operates transparently to software, requires no runtime CPU overhead, and supports key provisioning via SRAM PUF - ensuring that the LPC55S28JBD100K can run authenticated, encrypted firmware images without exposing plaintext code in memory or flash.
Can the LPC55S28JBD100K support simultaneous USB and SDIO operations?
Yes, the LPC55S28JBD100K supports concurrent HS/FS USB and SDIO host operations. Its dedicated USB PHY and separate SDIO controller operate on independent clock domains (USB PLL vs. System PLL), and share no critical memory or DMA resources. Verified in NXP's MCUXpresso SDK examples, the LPC55S28JBD100K reliably handles USB CDC ACM communication while streaming data from microSD cards - a capability confirmed in LPC552xFAMFS Rev 1 timing and resource allocation tables.
LPC55S28JBD100K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- LPC55S2x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S28JBD100K FAQ
1.How can I place an order for LPC55S28JBD100K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S28JBD100K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S28JBD100K reliable?
The price and inventory of LPC55S28JBD100K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S28JBD100K is usually 5 days.
3.What payment methods are accepted for LPC55S28JBD100K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S28JBD100K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC55S28JBD100K?
LPC55S28JBD100K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S28JBD100K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S28JBD100K?
For technical support, including LPC55S28JBD100K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S28JBD100K requirements.
6.How does Aetrix verify that LPC55S28JBD100K is sourced from the original manufacturer or authorized distributors?
All LPC55S28JBD100K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S28JBD100K meets industry standards.
7.What is the process for return or replacement of LPC55S28JBD100K?
All LPC55S28JBD100K units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S28JBD100K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S28JBD100K part is unused and in its original packaging.
Return procedure for LPC55S28JBD100K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC55S28JBD100K Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

