NXP Semiconductors LPC55S28JBD64Y
- Part No.:
- LPC55S28JBD64Y
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S28JBD64Y.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,495
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Product details
Overview
LPC55S28JBD64Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller with CASPER crypto co-processor, 512 KB flash, 256 KB SRAM, PRINCE real-time flash encryption, and dual USB (FS + HS) support. It operates up to 150 MHz and targets secure embedded applications including industrial control, IoT edge nodes, and smart sensors requiring cryptographic acceleration and low-power operation.
For engineers reviewing the LPC55S28JBD64Y datasheet, LPC55S28JBD64Y pinout, LPC55S28JBD64Y application, or LPC55S28JBD64Y equivalent, key selection considerations include its HTQFP64 package with 36 GPIOs, secure boot with RSA-2048/4096, PUF-based key generation, SHA2/AES hardware acceleration, and dual USB host/device capability with crystal-less FS mode.
Technical Context
The LPC55S28JBD64Y implements an Arm Cortex-M33 core with MPU, FPU, DSP, and ETM, running at up to 150 MHz using PLL0/PLL1 clock sources derived from internal FRO (12 MHz), external crystal (16–32 MHz), or RTC oscillator. Its security architecture integrates PRINCE for on-the-fly flash encryption, CASPER for ECC acceleration, PUF for silicon fingerprinting, and dedicated HASH-AES/SHA2 engines with DMA support.
Peripherals include nine Flexcomm interfaces (configurable as USART/SPI/I2C/I2S), SCTimer/PWM with 16 capture/match registers, 16-bit 1.0 Msamples/sec ADC with simultaneous differential conversion, SDIO interface supporting SDR25 (52 MHz), and dual USB controllers (full-speed with crystal-less operation and high-speed with integrated PHY).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ up to 150 MHz with MPU, FPU, DSP, and ETM - enables deterministic real-time execution with memory protection and floating-point math. |
| Flash / SRAM | 512 KB on-chip flash with 512-byte page erase; 256 KB total SRAM (32 KB code bus + 208 KB system bus + 16 KB USB SRAM) - supports large firmware images and multi-threaded RTOS operation. |
| Security Features | PRINCE flash encryption, CASPER crypto co-processor (ECC), PUF (64–4096-bit keys), TRNG, SHA2/AES-256, RSA-2048/4096 secure boot - meets TBSA compliance for trusted boot and runtime integrity. |
| USB Interface | USB 2.0 full-speed host/device with crystal-less device mode; USB 2.0 high-speed host/device with on-chip PHY - eliminates external crystal for FS USB, reduces BOM cost and board space. |
| Analog Peripherals | 16-bit ADC @ 1.0 Msamples/sec with 5 differential/10 single-ended channels and simultaneous conversion capability; integrated temperature sensor and comparator - enables high-precision sensor acquisition without external ADC. |
| Package / I/O | HTQFP64 (10 × 10 × 0.5 mm, 0.4 mm pitch); 36 GPIO pins with configurable functions, secure GPIO support, and up to 8 pin interrupts - fits compact industrial and portable designs with robust I/O flexibility. |
| Power & Temp | Single 1.8–3.6 V supply; operating range −40 °C to +105 °C; integrated DC-DC converter and PMU with deep power-down mode - suitable for harsh environments and battery-powered edge devices. |
Pinout & Package
HTQFP64 package (SOT855-5): 64-pin thin quad flat package, 10 mm × 10 mm body, 0.4 mm pitch, exposed thermal pad. Pinout conforms to NXP's standard LPC55S2x pin mapping for HTQFP64 variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0–PIO0_14 | General-purpose digital I/O with secure GPIO option | Configurable as GPIO, ADC input, comparator, or peripheral function via IOCON; reset state defaults to GPIO except debug pins (PIO0_11/12). |
| FC0–FC8 | Flexcomm serial interfaces | Software-configurable as USART/SPI/I2C/I2S; each includes FIFO and fractional baud-rate generator - enables flexible communication protocol assignment per design need. |
| USB0_DP/USB0_DM | Full-speed USB differential pair | On-chip PHY supports crystal-less device mode using internal FRO - eliminates external 12 MHz crystal, simplifying USB device implementation. |
| USB1_DP/USB1_DM | High-speed USB differential pair | Dedicated HS PHY with integrated termination - enables USB 2.0 high-speed host/device operation without external transceiver. |
| SD0_CMD/SD0_CLK/SD0_DATA[0:3] | SD/MMC 0 interface signals | Supports SD2.0 and SDR25 (52 MHz) with DMA; enables local storage expansion using standard SD cards or eMMC. |
Key Features
| Feature | Design Value |
|---|---|
| CASPER Crypto Co-processor | Hardware-accelerated Elliptic Curve Cryptography (ECC) offloads CPU during TLS handshake and key exchange - reduces latency and power in secure IoT node authentication. |
| PRINCE Flash Encryption | Real-time AES-128 encryption/decryption of flash reads/writes - protects firmware IP and enables secure over-the-air updates without exposing decrypted code in memory. |
| Programmable Logic Unit (PLU) | Configurable combinatorial/sequential logic engine with state machine support - replaces discrete glue logic, enabling custom signal routing and timing control without FPGA. |
| SCTimer/PWM | 8-input/10-output state-configurable timer with 16 capture/match registers - implements complex PWM waveforms, motor control sequences, or event-driven state machines in hardware. |
| Secure Boot with x509 Validation | Root-of-trust established via four revocable RoT keys stored as SHA-256 hashes in protected flash; supports anti-rollback using image certificate serial numbers - prevents downgrade attacks in field-deployed devices. |
Applications
| Industrial PLC I/O Module | Secure IoT Gateway Node |
|---|---|
Use Scenario: Compact programmable logic controller module collecting analog/digital sensor data and controlling actuators in factory automation. IC Role / Device Role / Timing Role: Main application processor executing control logic, managing SDIO-connected fieldbus interface, and performing real-time ADC sampling at 1 MS/s. Use Value: Integrated SCTimer/PWM drives stepper motors directly; PRINCE and secure boot prevent unauthorized firmware modification in unattended deployments. |
Use Scenario: Edge gateway aggregating BLE/Zigbee sensor data and forwarding encrypted payloads to cloud via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Secure application host handling TLS stack acceleration via CASPER, managing dual USB (host for dongles, device for configuration), and validating firmware updates. Use Value: PUF-generated keys eliminate key storage vulnerability; SHA2/AES hardware accelerates TLS handshake by >5× vs. software-only implementation. |
| Smart Energy Meter | Medical Wearable Sensor Hub |
Use Scenario: UL-certified electricity meter measuring voltage/current harmonics and communicating via PLC or RF mesh network. IC Role / Device Role / Timing Role: High-accuracy metrology processor using 16-bit ADC with simultaneous differential sampling and CRC engine for tamper-proof data logging. Use Value: Internal FRO trimmed to ±1% (0–85°C) ensures stable timing for energy integration; secure GPIO isolates critical metering functions from user-accessible peripherals. |
Use Scenario: FDA-classified wearable collecting ECG, temperature, and motion data with local preprocessing before Bluetooth transmission. IC Role / Device Role / Timing Role: Low-power sensor fusion hub using deep-sleep modes, RTC wake-up, and TRNG for session key generation in encrypted BLE pairing. Use Value: Micro-Tick Timer wakes CPU from deep-sleep in <1 µs; integrated temperature sensor calibrates ADC offset drift across body-worn temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S16JBD64 | Same Cortex-M33 core, 256 KB flash, 144 KB SRAM, no PRINCE or CASPER; lower security tier. | Lacks hardware flash encryption and crypto acceleration - suitable for cost-sensitive non-critical applications where secure boot is not mandated. | Select when budget constraints outweigh need for PUF, PRINCE, or CASPER; verify RoT requirements align with software-only secure boot. |
| RA6M5GFPMXXFA | Renesas RA6M5 with Cortex-M33, 1 MB flash, 512 KB SRAM, TrustZone, but no PRINCE or dedicated crypto co-processor; different peripheral set (SCI vs Flexcomm). | Strong TrustZone isolation but no on-the-fly flash encryption or ECC hardware acceleration - better for general-purpose secure RTOS use than cryptographic-heavy edge AI inference. | Choose for larger memory footprint needs and Renesas ecosystem compatibility; avoid if PRINCE-based OTA update security or CASPER-accelerated ECC is required. |
Compared with LPC55S16JBD64 and RA6M5GFPMXXFA, the LPC55S28JBD64Y uniquely combines PRINCE flash encryption, CASPER ECC acceleration, and PUF-based key generation in a 64-pin package - making it optimal for resource-constrained, cryptographically intensive edge devices requiring certified secure boot and firmware IP protection.
Availability
LPC55S28JBD64Y is available at Aetrix Electronics and suitable for industrial control systems, secure IoT gateways, and medical sensor hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC55S28JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with expertise in Arm-based microcontrollers and edge AI processing.
The LPC55S2x product line delivers high-performance, secure Arm Cortex-M33 MCUs targeting applications demanding cryptographic acceleration, real-time responsiveness, and robust functional safety - especially where firmware IP protection and secure remote updates are mandatory.
FAQ
What is the maximum operating frequency of the LPC55S28JBD64Y?
The LPC55S28JBD64Y operates at a maximum CPU frequency of 150 MHz, achieved using PLL0 or PLL1 clock sources driven by internal FRO (12 MHz), external crystal (16–32 MHz), or RTC oscillator. This frequency is sustained across the full −40 °C to +105 °C temperature range with appropriate voltage supply (1.8–3.6 V).
Does the LPC55S28JBD64Y support crystal-less USB full-speed device operation?
Yes, the LPC55S28JBD64Y supports crystal-less USB full-speed device mode using its internal 48 MHz clock derived from the FRO. This eliminates the need for an external 12 MHz crystal on the USB device path, reducing BOM cost and PCB layout complexity while maintaining USB-IF compliance.
How does the PRINCE module protect firmware in the LPC55S28JBD64Y?
The PRINCE module performs real-time AES-128 encryption of data written to on-chip flash and decryption of encrypted data read from flash. Keys are managed securely within the device, and encrypted regions remain inaccessible to debug interfaces - ensuring firmware IP protection and enabling secure over-the-air updates without exposing plaintext code.
What security features differentiate the LPC55S28JBD64Y from the LPC5528JBD64Y?
The LPC55S28JBD64Y includes CASPER crypto co-processor, PRINCE flash encryption, PUF, and full HASH-AES/SHA2 acceleration, while the LPC5528JBD64Y omits CASPER, PRINCE, PUF, and HASH-AES - retaining only basic secure boot and USB functionality. The 'S' suffix denotes the full security feature set required for TBSA-compliant deployments.
Can the LPC55S28JBD64Y's ADC perform simultaneous conversions on differential channel pairs?
Yes, the 16-bit ADC in the LPC55S28JBD64Y supports simultaneous conversions on two ADC input channels belonging to the same differential pair - enabling precise phase-aligned sampling for applications such as motor current sensing or audio signal acquisition without inter-channel skew.
LPC55S28JBD64Y Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S2x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S28JBD64Y FAQ
1.How can I place an order for LPC55S28JBD64Y through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S28JBD64Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S28JBD64Y reliable?
The price and inventory of LPC55S28JBD64Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S28JBD64Y is usually 5 days.
3.What payment methods are accepted for LPC55S28JBD64Y?
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LPC55S28JBD64Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S28JBD64Y order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S28JBD64Y?
For technical support, including LPC55S28JBD64Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S28JBD64Y requirements.
6.How does Aetrix verify that LPC55S28JBD64Y is sourced from the original manufacturer or authorized distributors?
All LPC55S28JBD64Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S28JBD64Y meets industry standards.
7.What is the process for return or replacement of LPC55S28JBD64Y?
All LPC55S28JBD64Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S28JBD64Y, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S28JBD64Y part is unused and in its original packaging.
Return procedure for LPC55S28JBD64Y:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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