NXP Semiconductors LPC55S66JBD64E
- Part No.:
- LPC55S66JBD64E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S66JBD64E.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:160
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Product details
Overview
LPC55S66JBD64E from NXP Semiconductors is a dual-core Arm Cortex-M33 microcontroller with TrustZone security, CASPER crypto accelerator, and PowerQuad DSP engine-designed for secure embedded control in industrial IoT gateways, smart sensors, and edge AI endpoints. It delivers 150 MHz CPU0 operation (rev 1B), 256 KB flash, 144 KB SRAM, and integrated PRINCE flash encryption.
For engineers reviewing the LPC55S66JBD64E datasheet, LPC55S66JBD64E pinout, LPC55S66JBD64E application, or LPC55S66JBD64E equivalent, key selection criteria include dual-core secure boot support, hardware-accelerated ECC/SHA2/AES, USB FS+HS interface count (36 GPIO), and HTQFP64 package compatibility with industrial temperature range (−40 °C to +105 °C).
Technical Context
The LPC55S66JBD64E integrates two Arm Cortex-M33 cores: CPU0 (with FPU, MPU, TrustZone, DSP) and CPU1 (no FPU/MPU/TrustZone), enabling secure real-time partitioning. Its CASPER co-processor accelerates Elliptic Curve Cryptography, while PowerQuad offloads CMSIS-DSP functions including FFT and filtering.
Security architecture includes PRINCE for on-the-fly flash encryption, PUF-based key generation (64–4096 bits), TRNG, SHA2-AES hardware engine, and DICE-compliant device identity. Clocking supports FRO (±1% @ 0–85 °C), 32 kHz RTC oscillator, and PLLs for flexible frequency synthesis up to 150 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-M33 (CPU0 + CPU1), rev r0p3; CPU0 includes FPU, MPU, TrustZone, DSP instructions |
| Max Operating Frequency | 150 MHz for CPU0/CPU1 (device revision 1B only); requires FRO 96 MHz or PLL input |
| Memory | 256 KB on-chip flash (512-byte page erase), 144 KB SRAM (32 KB code bus + 272 KB system bus − 128 KB reserved) |
| Security Features | PRINCE flash encryption/decryption, CASPER ECC acceleration, PUF key generation, SHA2-AES engine, DICE v2.0 compliance |
| USB Interface | Full-speed + high-speed host/device controller with on-chip PHY; crystal-less FS mode supported |
| Analog Peripherals | 16-bit ADC with 1.0 Msamples/sec sampling rate, simultaneous dual-channel conversion, five differential inputs |
| Package & Temp | HTQFP64 (10 × 10 × 0.5 mm, 0.5 mm pitch); operating temperature −40 °C to +105 °C |
Pinout & Package
HTQFP64 package with exposed thermal pad; 64-pin low-profile quad flat package compliant with JEDEC MO-220, RoHS and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 / ACMP0_A | GPIO / Analog Comparator Input A | Configurable digital I/O or comparator input; analog function enabled only when DIGIMODE=0 and ANAMODE=1 |
| PIO0_5 / TDI | JTAG Test Data In / Boot Source Selector | State at reset determines boot source (flash, ISP, ROM); default internal pull-up enables safe default boot path |
| FC3_SCK | Flexcomm 3 Clock | Shared clock for USART/SPI/I2S; supports fractional baud-rate generation and timeout features |
| SCT0_OUT0 | SCTimer/PWM Output 0 | Programmable PWM output with configurable duty cycle, period, and dead-time insertion |
| SD0_CMD | SD/MMC 0 Command Line | Bi-directional command/data line for SDIO/SDMMC interface; supports DMA-driven transfers |
| SWCLK | Serial Wire Debug Clock | Default debug clock after boot; enables SWD programming and real-time trace via SWO pin |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Core Secure Partitioning | CPU0 (TrustZone-enabled) runs secure firmware; CPU1 handles non-secure real-time tasks-enabling certified separation without software overhead |
| Hardware Crypto Acceleration | CASPER performs ECC point multiplication in <100k cycles; PowerQuad executes CMSIS-DSP FFTs at 3× speed vs. software-only execution |
| On-the-Fly Flash Protection | PRINCE encrypts/decrypts flash reads/writes transparently using AES-128; no performance penalty or software intervention required |
| Flexible Serial Connectivity | Nine Flexcomm interfaces (FC0–FC8) each configurable as USART/SPI/I2C/I2S; FC8 dedicated to high-speed SPI |
| Secure Identity & Boot | PUF generates device-unique keys; secure boot validates SHA256-RSA2048/4096 signatures; supports anti-rollback via x.509 certificate serial number revocation |
Applications
| Industrial Edge Gateway | Smart Sensor Node |
|---|---|
Use Scenario: Local protocol translation (Modbus-to-Matter) with OTA update integrity verification in factory automation. IC Role / Device Role / Timing Role: Primary application processor executing RTOS, managing dual USB interfaces (FS for HID config, HS for bulk data), and enforcing secure boot chain. Use Value: PRINCE encryption prevents firmware tampering during field updates; CASPER accelerates TLS handshake for encrypted cloud telemetry. |
Use Scenario: Battery-powered environmental monitor with vibration, temperature, and humidity sensing. IC Role / Device Role / Timing Role: Low-power sensor hub aggregating ADC, comparator, and I²C sensor data; wakes via RTC alarm or GPIO interrupt. Use Value: Deep-sleep mode with RAM retention draws <10 µA; PowerQuad accelerates sensor fusion algorithms without waking CPU0. |
| Secure Access Controller | Medical Diagnostic Endpoint |
Use Scenario: Biometric door lock with fingerprint matching and encrypted credential storage. IC Role / Device Role / Timing Role: Trusted execution environment (CPU0) isolates biometric processing; secure GPIO controls solenoid driver with tamper detection. Use Value: PUF-derived keys protect stored templates; SHA2-AES engine signs challenge-response auth tokens in <5 ms. |
Use Scenario: Portable ECG device requiring clinical-grade signal acquisition and HIPAA-compliant data export. IC Role / Device Role / Timing Role: High-fidelity analog front-end controller: 16-bit ADC samples at 1.0 Msps with simultaneous dual-channel capture for lead I/II derivation. Use Value: Integrated temperature sensor calibrates ADC offset drift; TRNG seeds encryption for Bluetooth LE medical data packets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S69JBD64 | 640 KB flash, 320 KB SRAM, identical core/peripheral set; same HTQFP64 package | Supports larger firmware images and complex RTOS stacks; higher memory bandwidth for DSP workloads | Select when >256 KB flash is required for feature-rich firmware or cryptographic key storage |
| RA6M5GFP64FB | Arm Cortex-M33 (single core), 1 MB flash, 448 KB SRAM, Renesas TrustZone, no CASPER/PowerQuad | Lacks hardware crypto/DSP accelerators; relies on software libraries for ECC/FFT; different peripheral mapping | Choose for cost-sensitive designs where software-based crypto suffices and flash headroom is critical |
Compared with LPC55S66JBD64E, LPC55S69JBD64 offers double memory capacity without changing PCB layout, while RA6M5GFP64FB trades hardware acceleration for higher base memory-making LPC55S66JBD64E optimal for memory-constrained, crypto-intensive edge nodes.
Availability
LPC55S66JBD64E is available at Aetrix Electronics and suitable for industrial IoT gateways, smart sensor nodes, secure access controllers, and portable medical diagnostics requiring stable component supply across extended product lifecycles.
Supply support for LPC55S66JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based microcontrollers and trusted execution environments.
The LPC55S6x family-including LPC55S66JBD64E-is engineered for secure edge intelligence, combining dual-core Arm Cortex-M33 with hardware crypto, DSP acceleration, and robust power management for resource-constrained embedded systems.
FAQ
What is the maximum CPU frequency supported by LPC55S66JBD64E?
The LPC55S66JBD64E operates at up to 150 MHz on both CPU0 and CPU1 when using device revision 1B. This frequency requires either the internal 96 MHz FRO or PLL configuration; revision 0A parts are limited to 100 MHz. The datasheet specifies this limit under "Ordering Options" Table 2 and confirms it in Section 2.1's General Description.
Does LPC55S66JBD64E support secure boot with RSA-4096 signatures?
Yes, LPC55S66JBD64E supports RSA-4096 public key verification for secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests. It stores root-of-trust keys in protected flash and supports up to four revocable RoT certificates, as documented in Section 2.4 "Secure Boot support" of the datasheet Rev. 2.5.
How many GPIO pins are available on the LPC55S66JBD64E in HTQFP64 package?
The LPC55S66JBD64E provides 36 GPIO pins in the HTQFP64 package, as confirmed in Table 2 "Ordering options" under the "GPIO" column. These include standard and secure GPIOs (SEC_PIOx_y), with up to eight configurable as pin interrupts and two grouped for logical AND/OR wake-up events.
Can LPC55S66JBD64E perform simultaneous ADC conversions on multiple channels?
Yes, LPC55S66JBD64E supports simultaneous conversions on two ADC input channels belonging to the same differential pair-enabled by its 16-bit, 1.0 Msamples/sec ADC with dual-sample-and-hold capability. This is explicitly stated in Section 2.7 "Analog peripherals" and verified in the block diagram (Figure 5).
Is the PRINCE module active by default on LPC55S66JBD64E after reset?
No, the PRINCE module is disabled by default after reset. It must be explicitly enabled and configured via the PFR (Protected Flash Region) registers before use. Encryption/decryption only occurs when PRINCE is activated and region keys are loaded-ensuring flash remains readable until security policy is intentionally applied, per Section 2.2 "On-chip memory".
LPC55S66JBD64E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S6x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 144K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S66JBD64E FAQ
1.How can I place an order for LPC55S66JBD64E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S66JBD64E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S66JBD64E reliable?
The price and inventory of LPC55S66JBD64E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S66JBD64E is usually 5 days.
3.What payment methods are accepted for LPC55S66JBD64E?
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LPC55S66JBD64E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S66JBD64E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S66JBD64E?
For technical support, including LPC55S66JBD64E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S66JBD64E requirements.
6.How does Aetrix verify that LPC55S66JBD64E is sourced from the original manufacturer or authorized distributors?
All LPC55S66JBD64E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S66JBD64E meets industry standards.
7.What is the process for return or replacement of LPC55S66JBD64E?
All LPC55S66JBD64E units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S66JBD64E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S66JBD64E part is unused and in its original packaging.
Return procedure for LPC55S66JBD64E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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