NXP Semiconductors LPC55S69JBD64K
- Part No.:
- LPC55S69JBD64K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S69JBD64K.pdf
- Description:
- IC MCU 32BIT 640KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LPC55S69JBD64K from NXP Semiconductors is a dual-core ARM Cortex-M33 microcontroller with TrustZone security, designed for secure embedded control in industrial IoT edge nodes. It integrates a 150 MHz primary core (CPU0), 640 KB on-chip flash, 320 KB SRAM, PRINCE real-time flash encryption, CASPER crypto accelerator, and PowerQuad DSP engine. It supports USB HS/FS, SDIO, nine Flexcomm serial interfaces, and a 16-bit 1.0 Msamples/sec ADC - enabling secure motor control, sensor fusion, and OTA-updatable gateways.
For engineers reviewing the LPC55S69JBD64K datasheet, LPC55S69JBD64K pinout, LPC55S69JBD64K application, or LPC55S69JBD64K equivalent, key selection criteria include dual-core TrustZone isolation, PRINCE-encrypted flash for firmware IP protection, hardware-accelerated ECC/SHA/AES via CASPER, PowerQuad-enabled CMSIS-DSP execution, and HTQFP64 package compatibility with constrained PCB layouts.
Technical Context
The LPC55S69JBD64K implements two ARM Cortex-M33 cores: CPU0 (150 MHz, with FPU, MPU, TrustZone, ETM) handles secure application execution and system management, while CPU1 (150 MHz, no FPU/MPU/TrustZone) offloads deterministic real-time tasks. Its security stack includes PUF-generated keys, AES-256 engine, SHA-2, TRNG, and DICE-compliant secure boot using RSA-2048/4096 signatures and x.509 certificate validation.
Peripherals are routed through a multilayer AHB matrix and dual DMA controllers (DMA0: 23 channels; DMA1: 10 channels). The 36 GPIO pins support secure I/O, pin interrupts, group interrupts (GINT), and PLU-based logic programmability. Clocking uses dual FROs (96 MHz ±1%, 32 kHz ±2%), PLLs, and crystal oscillators (16–32 MHz & 32.768 kHz), with integrated capacitor banks for CL tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual ARM Cortex-M33: CPU0 @ 150 MHz with FPU, MPU, TrustZone; CPU1 @ 150 MHz without FPU/MPU/TrustZone - enables secure main application + isolated real-time co-processing. |
| Memory | 640 KB on-chip flash (512-byte page erase/write); 320 KB SRAM (272 KB contiguous system bus + 32 KB code bus + 16 KB USB SRAM) - supports large secure firmware images and real-time data buffering. |
| Security | PRINCE flash encryption/decryption; CASPER crypto co-processor (ECC, RSA acceleration); PUF key generation (64–4096 bits); SHA-2/AES-256; DICE v2.0 Level 00 - meets TBSA requirements for secure boot and runtime attestation. |
| Analog | 16-bit ADC @ 1.0 Msamples/sec with 5 differential/10 single-ended channels, simultaneous conversion capability, internal temp sensor, and 5-input comparator - suitable for precision current/voltage sensing in power systems. |
| Connectivity | USB 2.0 HS/FS host/device with on-chip PHY; SDIO (SD2.0/SDR25); nine Flexcomm interfaces (configurable as USART/SPI/I2C/I2S); two I2C buses (Fast-mode Plus, 1 Mbit/s; HS slave, 3.4 Mbit/s) - enables multi-protocol edge device connectivity. |
| Timers & Logic | Five 32-bit general-purpose timers; SCTimer/PWM (16 capture/match, 10 outputs); 24-bit MRT; RTC with wake-up from deep power-down; PLU for state-machine logic - supports complex PWM generation, time-critical event sequencing, and low-power scheduling. |
| Package & Environment | HTQFP64 (10 × 10 × 0.5 mm, 0.5 mm pitch); operating temperature −40 °C to +105 °C; single 1.8–3.6 V supply with integrated DC-DC converter - suited for industrial-grade compact designs with extended thermal range. |
Pinout & Package
Package: HTQFP64 (plastic low-profile quad flat package, 64 leads, body 10 × 10 × 0.5 mm, pitch 0.5 mm, SOT855-5).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 / ACMP0_A | GPIO / Analog Comparator Input A | Configurable digital I/O or comparator input A; requires ANAMODE=1/DIGIMODE=0 in IOCON - used for analog threshold detection with hardware response. |
| PIO0_5 / TDI | JTAG Test Data In / Boot Source Selector | At reset, pin state selects boot source (flash, ISP, ROM); default pull-up enables safe default boot path - critical for field firmware recovery and secure provisioning. |
| PIO0_11 / ADC0_9 | GPIO / ADC Channel 1B (Differential Negative) | Single-ended ADC input CH1B or negative leg of differential pair CH1A/CH1B - enables high-accuracy current sensing with noise rejection. |
| PIO0_12 / ADC0_10 | GPIO / ADC Channel 2B (Differential Negative) | Single-ended ADC input CH2B or negative leg of differential pair CH2A/CH2B - supports dual-channel synchronized sampling for motor phase monitoring. |
| SWCLK | Serial Wire Debug Clock | Default debug clock after boot; dedicated trace interface for non-intrusive real-time debugging and secure firmware validation - essential for safety-critical development. |
Key Features
| Feature | Design Value |
|---|---|
| ARM TrustZone® + Secure Boot | Hardware-enforced memory isolation between secure/non-secure worlds; RSA-2048/4096 signature verification with x.509 certificate chain and anti-rollback - prevents unauthorized firmware execution and rollback attacks. |
| CASPER Crypto Engine | Hardware acceleration for ECC scalar multiplication, modular exponentiation, and SHA-2 hashing - reduces cryptographic operation latency by >10× vs. software-only, enabling fast TLS handshake and secure OTA updates. |
| PowerQuad DSP Accelerator | Fixed/floating-point CMSIS-DSP function acceleration (FFT, FIR, matrix math) with SDK API integration - achieves real-time FFT analysis on 1024-point datasets at <50 µs per transform. |
| PRINCE Flash Encryption | On-the-fly AES-128 encryption/decryption of flash reads/writes using keys derived from PUF - protects firmware IP without performance penalty or external secure element dependency. |
| Flexcomm Serial Interfaces | Nine software-configurable peripherals (Flexcomm 0–7, 8) supporting USART/SPI/I2C/I2S with shared fractional baud-rate generator and FIFO - eliminates need for discrete level shifters or protocol translators in multi-sensor systems. |
Applications
| Industrial Motor Control | Secure Edge Gateway |
|---|---|
|
Use Scenario: Closed-loop control of BLDC motors in factory automation with real-time current sensing and position feedback. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithm on CPU0; CPU1 handles encoder interrupt servicing and PWM update timing; SCTimer/PWM generates precise 3-phase gate drive signals. Use Value: Dual-core deterministic timing ensures sub-microsecond PWM jitter; 16-bit ADC enables <0.1% current measurement accuracy; PRINCE encryption secures proprietary motor control firmware. |
Use Scenario: Protocol-agnostic field gateway aggregating Modbus, CAN, and BLE sensor data for cloud upload with TLS-secured MQTT. IC Role / Device Role / Timing Role: Secure application host (CPU0) managing TLS stack and OTA; CASPER accelerates ECC key exchange; PowerQuad processes sensor fusion before transmission. Use Value: Hardware crypto offload reduces TLS handshake time to <15 ms; 640 KB flash stores multiple firmware images and root CA certificates; SDIO supports local logging to microSD. |
| Smart Energy Metering | Medical Sensor Hub |
|
Use Scenario: DIN-rail mounted electricity meter with harmonic analysis, tamper detection, and remote firmware update. IC Role / Device Role / Timing Role: ADC samples voltage/current at 1.0 Msamples/sec; PowerQuad computes real-time FFT up to 50th harmonic; PRINCE encrypts metering logs before storage. Use Value: Simultaneous dual-channel ADC conversion enables phase-angle accuracy <0.05°; PUF-derived keys prevent cloning; secure boot ensures only signed firmware executes. |
Use Scenario: Portable patient monitor collecting ECG, SpO₂, and temperature with local AI inference and HIPAA-compliant data export. IC Role / Device Role / Timing Role: CPU0 runs certified medical OS and secure bootloader; CPU1 performs real-time ECG R-peak detection; TRNG seeds encryption for patient data packets. Use Value: 105 °C rating supports battery-charging thermal environments; secure GPIO isolates critical alarm outputs; SHA-2 validates firmware patches pre-installation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S66JBD64 | Same HTQFP64 package, identical dual-core M33 architecture, but 256 KB flash and 144 KB SRAM - lacks PRINCE, PowerQuad, and CASPER modules. | Suitable for cost-sensitive secure boot applications without hardware crypto acceleration or intensive DSP workloads. | Select LPC55S66JBD64 only when firmware size ≤256 KB and cryptographic operations are infrequent or software-implemented. |
| RA6M5GFPMXXFA | Renesas RA6M5 with Cortex-M33, 1 MB flash, 448 KB SRAM, but no PRINCE, no CASPER, and no PowerQuad; includes SCE7 security engine (AES/SHA/RSA) and TSB. | Offers larger memory and higher peripheral count, but requires software integration for ECC and lacks on-the-fly flash encryption. | Choose RA6M5GFPMXXFA when needing >640 KB flash or CAN FD support, accepting trade-off of no PRINCE and less optimized crypto throughput than CASPER. |
Compared with LPC55S66JBD64 and RA6M5GFPMXXFA, the LPC55S69JBD64K uniquely delivers integrated PRINCE flash encryption, CASPER-accelerated ECC, and PowerQuad DSP in a 64-pin footprint - making it optimal for space-constrained, high-security, real-time signal processing applications where firmware IP protection and deterministic crypto performance are mandatory.
Availability
LPC55S69JBD64K is available at Aetrix Electronics and suitable for industrial motor control, secure edge gateways, smart energy metering, and medical sensor hubs requiring stable component supply across long-lifecycle deployments.
Supply support for LPC55S69JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and hardware security.
The LPC55S6x product line targets secure, real-time embedded applications demanding TrustZone isolation, hardware-accelerated cryptography, and deterministic DSP - specifically engineered for industrial edge intelligence and certified device endpoints.
FAQ
What is the maximum operating frequency of the LPC55S69JBD64K?
The LPC55S69JBD64K operates at a maximum CPU frequency of 150 MHz for both its primary (CPU0) and secondary (CPU1) ARM Cortex-M33 cores. This specification applies to device revision 1B, confirmed in the official NXP ordering information table and supported by internal PLL and FRO clocking architecture capable of sustaining full-speed operation across the −40 °C to +105 °C temperature range.
Does the LPC55S69JBD64K support secure boot with cryptographic verification?
Yes, the LPC55S69JBD64K supports robust secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, validated against RSA-2048 or RSA-4096 public keys stored in x.509 certificates. It enforces anti-rollback via image key revocation and establishes Root of Trust by storing SHA-256 hashes of up to four RoT keys in protected flash - all implemented in hardware without software dependency.
What differentiates the LPC55S69JBD64K from the LPC55S66JBD64?
The LPC55S69JBD64K includes 640 KB flash and 320 KB SRAM versus 256 KB flash and 144 KB SRAM in the LPC55S66JBD64. Crucially, only the LPC55S69JBD64K integrates PRINCE flash encryption, CASPER crypto acceleration, and PowerQuad DSP hardware - making it uniquely capable of real-time encrypted firmware execution and hardware-accelerated ECC/SHA operations.
Which package type does the LPC55S69JBD64K use, and how many GPIOs are available?
The LPC55S69JBD64K uses the HTQFP64 package (SOT855-5, 10 × 10 × 0.5 mm). It provides 36 general-purpose I/O pins, each configurable as secure GPIO, analog input, or peripheral function via IOCON registers - with up to eight supporting pin interrupts and two supporting group interrupts (GINT) for logical combination triggering.
Can the LPC55S69JBD64K perform simultaneous analog-to-digital conversions?
Yes, the LPC55S69JBD64K's 16-bit ADC supports simultaneous conversions on two input channels belonging to the same differential pair - for example, converting both CH1A and CH1B at 1.0 Msamples/sec. This capability is explicitly documented in the analog peripherals section and enables accurate phase-current measurement in motor control applications.
LPC55S69JBD64K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S6x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 640KB (640K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 320K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S69JBD64K FAQ
1.How can I place an order for LPC55S69JBD64K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S69JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S69JBD64K reliable?
The price and inventory of LPC55S69JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S69JBD64K is usually 5 days.
3.What payment methods are accepted for LPC55S69JBD64K?
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4.How is shipping managed for LPC55S69JBD64K?
LPC55S69JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S69JBD64K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S69JBD64K?
For technical support, including LPC55S69JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S69JBD64K requirements.
6.How does Aetrix verify that LPC55S69JBD64K is sourced from the original manufacturer or authorized distributors?
All LPC55S69JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S69JBD64K meets industry standards.
7.What is the process for return or replacement of LPC55S69JBD64K?
All LPC55S69JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S69JBD64K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S69JBD64K part is unused and in its original packaging.
Return procedure for LPC55S69JBD64K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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