NXP Semiconductors LPC55S69JBD64Y
- Part No.:
- LPC55S69JBD64Y
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S69JBD64Y.pdf
- Description:
- IC MCU 32BIT 640KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,376
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC55S69JBD64Y from NXP Semiconductors is a dual-core Arm Cortex-M33 microcontroller with TrustZone security, CASPER crypto accelerator, and PowerQuad DSP engine. It delivers up to 150 MHz CPU0 operation, 640 KB on-chip flash, 320 KB SRAM, PRINCE real-time flash encryption, and supports secure boot with RSA-2048/4096 and DICE-compliant device identity - deployed in industrial IoT edge nodes requiring certified firmware integrity and low-latency sensor fusion.
For engineers reviewing the LPC55S69JBD64Y datasheet, LPC55S69JBD64Y pinout, LPC55S69JBD64Y application, or LPC55S69JBD64Y equivalent, key selection criteria include dual-core deterministic execution, hardware-accelerated cryptographic operations (AES-256, SHA2, ECC), USB full-speed + high-speed dual-role capability, and 36 GPIOs with secure I/O and programmable logic unit (PLU) for peripheral offload.
Technical Context
The LPC55S69JBD64Y integrates two independent Arm Cortex-M33 cores: CPU0 (with FPU, MPU, TrustZone, DSP extensions) and CPU1 (no MPU/FPU/TrustZone, optimized for background tasks). Its CASPER co-processor accelerates asymmetric cryptography (ECC), while PowerQuad executes CMSIS-DSP functions in fixed/floating-point with SDK API support.
Security architecture includes PRINCE flash encryption, PUF-based key generation (64–4096 bits), TRNG, SHA2-AES hardware engine, and debug authentication via RSA-2048/4096. Clocking uses dual FROs (96 MHz ±1% and 32 kHz ±2%), PLLs, and crystal oscillators (16–32 MHz and 32.768 kHz), with integrated capacitor banks for crystal tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-M33: CPU0 (150 MHz, FPU/MPU/TrustZone) + CPU1 (150 MHz, no FPU/MPU/TrustZone) |
| Flash / SRAM | 640 KB on-chip flash with PRINCE encryption; 320 KB SRAM (272 KB system bus + 32 KB code bus + 16 KB USB SRAM) |
| Security Features | TrustZone, CASPER (ECC), PowerQuad (DSP), AES-256, SHA2, PUF, TRNG, DICE v2.0, RSA-2048/4096 secure boot |
| Analog Peripherals | 16-bit 1.0 Msamples/sec ADC with simultaneous dual-channel conversion, 5 differential/10 SE inputs, integrated temp sensor, comparator |
| Serial Interfaces | Nine Flexcomm interfaces (configurable as USART/SPI/I2C/I2S); USB FS + HS host/device; SDIO/SD/MMC; I2C Fast-mode Plus (1 Mbit/s) |
| Timers & Logic | Five 32-bit CTIMERs; SCTimer/PWM (8 in/10 out); RTC + MRT + WWDT; PLU for combinatorial/sequential logic offload |
| Package & GPIO | HTQFP64 (10 × 10 × 0.5 mm); 36 GPIO pins with secure I/O, pin interrupts (PINT), grouped interrupts (GINT), and 16 function options per pin |
Pinout & Package
HTQFP64 package: 64-pin plastic low-profile quad flat package, body size 10 × 10 × 0.5 mm, pitch 0.5 mm, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 / ACMP0_A | GPIO / Analog Comparator Input A | Configurable digital I/O or comparator input; analog mode requires DIGIMODE=0 and ANAMODE=1 in IOCON |
| PIO0_2 / TRST | JTAG Test Reset / Flexcomm3 SPI MISO | Boundary scan reset input; defaults to SPI MISO in ISP mode; internal pull-down enabled at reset |
| PIO0_3 / TCK | JTAG Test Clock / Flexcomm3 SPI MOSI | Test clock input; defaults to SPI MOSI in ISP mode; internal pull-up disabled at reset |
| PIO0_4 / TMS | JTAG Test Mode Select / Flexcomm3 SPI SSEL0 | Selects JTAG instruction register; defaults to SPI slave select in ISP mode |
| PIO0_5 / TDI | JTAG Test Data In / Boot Source Selector | Boot source determined by pin state at reset; enables ISP handler when pulled low; internal pull-up enabled at reset |
| PIO0_6 / TDO | JTAG Test Data Out / Flexcomm3 SPI SCK | Data output during boundary scan; defaults to SPI clock in ISP mode |
| SWCLK / PIO0_11 | Serial Wire Debug Clock / ADC0_9 | Primary debug clock input; also serves as ADC single-ended channel 9 input |
| SWO / PIO0_8 | Serial Wire Output Trace / Flexcomm3 SSEL3 | Asynchronous trace data output; configurable as SPI slave select 3 |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-M33 Architecture | CPU0 handles secure application execution with TrustZone isolation; CPU1 runs real-time background tasks without security overhead |
| Hardware Crypto Acceleration | CASPER co-processor reduces ECC signing time by >10× vs. software-only; PowerQuad cuts CMSIS-DSP FFT latency by 4× |
| PRINCE Flash Encryption | Real-time AES-128 encryption/decryption of flash reads/writes - enables secure OTA updates without external crypto IC |
| Secure Device Identity | PUF generates and reconstructs keys from SRAM fingerprint; UUID provides immutable 128-bit device serial number |
| Flexible Serial Connectivity | Nine Flexcomm peripherals support dynamic reconfiguration (USART/SPI/I2C/I2S) with shared fractional baud-rate generator and FIFOs |
Applications
| Industrial Edge Sensor Hub | Secure Firmware Gateway |
|---|---|
Use Scenario: Aggregating temperature, vibration, and current measurements from multiple field sensors in predictive maintenance systems. IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion algorithms on CPU0, with CPU1 managing CAN/RS-485 protocol stacks and real-time timer-triggered sampling. Use Value: Simultaneous 1.0 Msamples/sec ADC conversion across two channels enables synchronized multi-sensor capture; PLU offloads GPIO event filtering to reduce CPU0 interrupt load. | Use Scenario: Field-deployed gateway validating and decrypting signed firmware images before installation in medical or energy metering devices. IC Role / Device Role / Timing Role: Secure boot root-of-trust enforcing RSA-4096 signature verification, PRINCE decryption of encrypted flash regions, and DICE-compliant attestation reporting. Use Value: Hardware-accelerated SHA2/AES and PUF-derived keys eliminate software crypto bottlenecks; anti-rollback prevents downgrade attacks using x509 certificate serial number revocation. |
| USB-C PD Controller Companion | Low-Power Smart Actuator |
Use Scenario: Managing power negotiation, policy enforcement, and VBUS monitoring in USB-C power delivery systems with embedded display/audio. IC Role / Device Role / Timing Role: USB FS+HS dual-role controller interfacing with Type-C port controller; CPU1 handles USB enumeration and descriptor handling while CPU0 runs safety-critical PD policy engine. Use Value: Crystal-less full-speed USB device operation reduces BOM cost; dedicated USB DMA controller ensures zero-latency packet handling under RTOS scheduling pressure. | Use Scenario: Closed-loop motor control in battery-powered HVAC dampers or smart locks requiring tamper-resistant firmware and precise timing. IC Role / Device Role / Timing Role: Real-time actuator driver using SCTimer/PWM for 16-bit resolution PWM generation and CTIMERs for encoder position capture with DMA-triggered ADC sampling. Use Value: Windowed Watchdog Timer (WWDT) and deep-sleep wake-up via RTC ensure fail-safe recovery; secure GPIO prevents unauthorized pin reconfiguration during runtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S66JBD64 | 256 KB flash, 144 KB SRAM, same dual-core M33, CASPER, PowerQuad, PRINCE, and security features | Lower memory capacity suits cost-sensitive edge nodes with simpler firmware and minimal OTA update payload | Select when application firmware fits within 256 KB flash and does not require extended SRAM for large buffers or cryptographic context storage |
| RA6M5GFP | Renesas RA6M5: single Cortex-M33 (200 MHz), 1 MB flash, 384 KB SRAM, no crypto co-processor, TrustZone only, no PRINCE or PUF | Lacks hardware crypto acceleration and device identity - requires external secure element for DICE or PKI-based attestation | Choose if higher CPU clock and larger memory are prioritized over integrated crypto acceleration and silicon-rooted identity |
Compared with LPC55S66JBD64, the LPC55S69JBD64Y provides 2.5× more flash and 2.2× more SRAM for complex secure firmware; versus RA6M5GFP, it delivers hardware-accelerated ECC, PUF-based key generation, and PRINCE flash encryption - eliminating need for external secure elements in regulated deployments.
Availability
LPC55S69JBD64Y is available at Aetrix Electronics and suitable for industrial IoT gateways, medical firmware update controllers, USB-C PD companion modules, and secure smart actuator designs requiring stable component supply across long-lifecycle production programs.
Supply support for LPC55S69JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with core expertise in Arm-based microcontrollers and edge AI processing.
The LPC55S6x product line targets resource-constrained, security-critical embedded systems - delivering certified TrustZone isolation, hardware crypto acceleration, and low-power operation for certified firmware deployment in regulated environments.
FAQ
What is the maximum operating frequency of the LPC55S69JBD64Y?
The LPC55S69JBD64Y operates at up to 150 MHz on its primary Cortex-M33 core (CPU0) and secondary Cortex-M33 core (CPU1), but only in device revision 1B. Revision 0A is limited to 100 MHz. This frequency is achievable using internal FRO or PLL sources, with FRO trimmed to ±1% accuracy over 0°C to 85°C for date codes 2041 and later. The LPC55S69JBD64Y maintains this performance within its 1.8 V to 3.6 V supply range.
Does the LPC55S69JBD64Y support crystal-less USB full-speed device operation?
Yes, the LPC55S69JBD64Y supports crystal-less USB full-speed device operation using its internal 48 MHz clock derived from the 96 MHz FRO, as confirmed in NXP Technical Note TN00063. This eliminates the need for an external 48 MHz crystal or oscillator, reducing BOM cost and PCB area. The LPC55S69JBD64Y retains full-speed USB host/device functionality with on-chip PHY and dedicated DMA controller, while high-speed USB requires an external 12 MHz crystal.
How many GPIO pins are available on the LPC55S69JBD64Y in the HTQFP64 package?
The LPC55S69JBD64Y in HTQFP64 package provides 36 general-purpose I/O pins, as specified in Table 2 of the datasheet. These include standard GPIO, secure GPIO (SEC_PIOx), and multiplexed functions such as ADC inputs, comparator inputs, Flexcomm interfaces, and debug signals. Up to eight of these can be configured as pin interrupts (PINT), and two support grouped interrupts (GINT) with logical AND/OR combinations. All GPIO registers reside on the AHB bus for fast access.
What security features differentiate the LPC55S69JBD64Y from standard Cortex-M33 MCUs?
The LPC55S69JBD64Y integrates multiple hardware security blocks beyond baseline TrustZone: PRINCE for real-time flash encryption, CASPER for ECC acceleration, PowerQuad for DSP offload, PUF for silicon-rooted key generation, TRNG for entropy, and DICE v2.0-compliant device identity. It supports RSA-2048/4096 secure boot with anti-rollback, SHA2-AES hardware engine, and debug authentication via NXP's protocol. These features are absent in generic Cortex-M33 implementations and enable certified firmware deployment without external secure elements.
Can the LPC55S69JBD64Y execute simultaneous ADC conversions on multiple channels?
Yes, the LPC55S69JBD64Y's 16-bit ADC supports simultaneous conversions on two input channels belonging to the same differential pair - for example, ADC0_1 (CH1A) and ADC0_9 (CH1B) can be sampled concurrently at up to 1.0 Msamples/sec. This capability is explicitly documented in Section 2 Features and benefits and enables precise phase-aligned acquisition for motor control or audio sampling. The LPC55S69JBD64Y also supports multiple internal/external trigger sources and DMA-driven data transfer to minimize CPU intervention.
LPC55S69JBD64Y Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S6x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 640KB (640K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 320K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S69JBD64Y FAQ
1.How can I place an order for LPC55S69JBD64Y through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S69JBD64Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S69JBD64Y reliable?
The price and inventory of LPC55S69JBD64Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S69JBD64Y is usually 5 days.
3.What payment methods are accepted for LPC55S69JBD64Y?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S69JBD64Y transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC55S69JBD64Y?
LPC55S69JBD64Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S69JBD64Y order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S69JBD64Y?
For technical support, including LPC55S69JBD64Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S69JBD64Y requirements.
6.How does Aetrix verify that LPC55S69JBD64Y is sourced from the original manufacturer or authorized distributors?
All LPC55S69JBD64Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S69JBD64Y meets industry standards.
7.What is the process for return or replacement of LPC55S69JBD64Y?
All LPC55S69JBD64Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S69JBD64Y, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S69JBD64Y part is unused and in its original packaging.
Return procedure for LPC55S69JBD64Y:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC55S69JBD64Y Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

