NXP Semiconductors LPC810M021FN8129
- Part No.:
- LPC810M021FN8129
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 8-DIP (0.300", 7.62mm)
- Datasheet:
-
LPC810M021FN8129.pdf
- Description:
- IC MCU 32BIT 4KB FLASH 8DIP
- Quantity:
- Payment:

- Shipping:

Inventory:3,717
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC810M021FN8129 from NXP Semiconductors is a 32-bit ARM Cortex-M0+ microcontroller in an 8-pin DIP package, operating up to 30 MHz with 4 kB flash and 1 kB SRAM. It integrates one I²C-bus interface, two USARTs, one SPI controller, one analog comparator, six GPIO pins, and supports low-power Deep power-down mode with wake-up via PIO0_4. It targets cost-sensitive embedded control in lighting and consumer appliances.
For engineers reviewing the LPC810M021FN8129 datasheet, LPC810M021FN8129 pinout, LPC810M021FN8129 application, or LPC810M021FN8129 equivalent, key selection factors include its DIP8 footprint for prototyping, fixed-function pin mapping (RESET, SWDIO, SWCLK, XTALIN/XTALOUT not available), limited peripheral count versus other LPC81xM variants, and reliance on the switch matrix for peripheral routing - all critical for legacy board upgrades and educational use cases.
Technical Context
The LPC810M021FN8129 implements an ARM Cortex-M0+ core with single-cycle I/O access and a 2-stage pipeline, tightly coupled to a Nested Vectored Interrupt Controller (NVIC) supporting up to 8 GPIO-selectable interrupt sources. Its memory subsystem includes 4 kB of on-chip flash (64-byte page erase/write) and 1 kB SRAM, with boot code v13.1 stored in ROM.
Peripheral routing is managed by a hardware switch matrix enabling assignment of movable functions-including U0_TXD/U0_RXD, SPI0_SCK/MOSI/MISO, I2C0_SCL/SDA, and SCTimer inputs/outputs-to any non-power GPIO pin. Fixed functions (RESET, SWDIO, SWCLK, PIO0_4/WAKEUP, PIO0_0–PIO0_5) are physically bound to DIP8 pins 1–8 per Figure 2 and Table 4, with no XTAL or comparator pins exposed in this package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0+, 30 MHz max - enables deterministic real-time control with <10 µs interrupt latency. |
| Flash Memory | 4 kB - sufficient for basic sensor interface firmware or simple motor control logic without external storage. |
| SRAM | 1 kB - supports small data buffers, stack depth for lightweight RTOS, or ISR context preservation. |
| GPIO Pins | 6 configurable digital I/O - all support pull-up/pull-down, glitch filtering, and input inversion; four sourced at 20 mA. |
| Serial Interfaces | 2 USARTs, 1 SPI, 1 I²C - routed via switch matrix; I²C requires external pull-ups on PIO0_10/PIO0_11 (not present in DIP8). |
| Power Modes | Deep power-down with 50 ns wake-up on PIO0_4 - reduces standby current to sub-µA for battery-powered applications. |
| Operating Temp | −40 °C to +85 °C - validated for consumer and industrial ambient environments, excluding extended-temp DIP8 variants. |
Pinout & Package
Package: Plastic dual in-line package (DIP8), 300 mil width, through-hole mounting. Pin pitch 0.1 inch (2.54 mm). RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: RESET/PIO0_5 | Reset input / general-purpose I/O | Active-low reset; must be pulled HIGH externally in Deep power-down mode; default GPIO function enabled unless boundary scan active. |
| 2: PIO0_4/WAKEUP/TRST | Wake-up trigger / debug test reset | Generates wake-up from Deep power-down on LOW pulse ≥50 ns; TRST only active in boundary scan mode. |
| 3: SWCLK/PIO0_3/TCK | SWD clock / JTAG test clock | Primary debug clock input; SWCLK enabled by default; TCK active only during boundary scan. |
| 4: SWDIO/PIO0_2/TMS | SWD bidirectional data / JTAG mode select | Default Serial Wire Debug I/O; TMS active only in boundary scan; GPIO function disabled when debug enabled. |
| 5: PIO0_1/ACMP_I2/CLKIN/TDI | ISP entry / comparator input / clock source / JTAG data in | LOW during reset initiates ISP mode (v13.1); ACMP_I2 and CLKIN selectable via switch matrix; TDI active only in boundary scan. |
| 6: VDD | Main power supply | 3.3 V ±10 % supply; decoupling capacitor required near pin for noise immunity and stable core operation. |
| 7: VSS | Ground reference | Digital ground return; must be connected to system GND plane with low-inductance path to minimize switching noise. |
| 8: PIO0_0/ACMP_I1/TDO | USART0 RX / comparator input / JTAG data out | Default U0_RXD in ISP mode; ACMP_I1 selectable; TDO active only in boundary scan; 5 V tolerant in digital mode. |
Key Features
| Feature | Design Value |
|---|---|
| Single-cycle GPIO access | ARM Cortex-M0+ IO bus placement enables 15 MHz GPIO toggle rate - critical for bit-banged protocols or precise timing signals. |
| Switch matrix peripheral routing | Assigns USART, SPI, and SCTimer functions to any GPIO pin except VDD/VSS - eliminates fixed peripheral pin conflicts in constrained layouts. |
| Deep power-down wake-up | PIO0_4 triggers exit from sub-µA Deep power-down with 50 ns pulse - enables ultra-low-energy sensing nodes with external event detection. |
| ROM-based boot loader & drivers | 8 kB ROM contains ISP/IAP, USART/I²C APIs, and power profile configuration - reduces flash usage and accelerates firmware development. |
| Configurable I/O pad options | Per-pin control of pull-up/down, glitch filter, input inversion, and hysteresis - simplifies signal conditioning for noisy industrial environments. |
Applications
| Lighting Control | Consumer Appliance Interface |
|---|---|
Use Scenario: Dimmable LED driver with push-button input and status LED feedback in compact fixtures. IC Role / Device Role / Timing Role: Main controller executing PWM dimming logic, reading tactile switches, and driving indicator LEDs via GPIO. Use Value: DIP8 package allows rapid breadboard validation; 4 kB flash accommodates touch debounce and fade algorithms; 20 mA GPIO sink drives LEDs directly without external transistors. |
Use Scenario: Keypad scanner and display driver in microwave ovens or coffee makers with minimal BOM count. IC Role / Device Role / Timing Role: Input scanner managing matrix keypad and output controller for 7-segment or LCD segments. Use Value: Six GPIO pins suffice for 3×3 keypad + 3 segment lines; Deep power-down extends battery life in clock backup circuits; ROM UART API simplifies serial communication with main MCU. |
| Industrial Sensor Node | Legacy Equipment Upgrade |
Use Scenario: Temperature/humidity sensor node transmitting data over UART to gateway, powered by coin cell. IC Role / Device Role / Timing Role: Data acquisition and low-power wireless interface coordinator using wake-on-event architecture. Use Value: Sub-µA Deep power-down with PIO0_4 wake-up extends coin-cell life to >2 years; 1 kB SRAM buffers sensor readings between transmissions. |
Use Scenario: Replacing obsolete 8-bit microcontrollers (e.g., PIC12F) in existing PCBs without layout changes. IC Role / Device Role / Timing Role: Drop-in functional replacement handling timing-critical I/O and simple protocol translation. Use Value: DIP8 footprint matches legacy sockets; 30 MHz Cortex-M0+ delivers 5× throughput vs. 20 MHz 8-bit parts; SWD debug replaces ICSP, reducing test fixture complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC811M001JDH16 | TSSOP16 package, 8 kB flash, 2 kB SRAM, 14 GPIO, adds second SPI and third USART. | Requires PCB redesign for 16-pin surface-mount; supports richer peripheral sets for multi-sensor hubs. | Select when needing >6 GPIO or additional serial interfaces; not pin-compatible with LPC810M021FN8129. |
| STM32F030F4P6 | SO8 package, 16 kB flash, 4 kB SRAM, 15 GPIO, no switch matrix, fixed USART/SPI/I²C pinout. | Fixed peripheral mapping simplifies layout but limits routing flexibility; higher flash supports bootloader + application separation. | Choose for cost-sensitive SO8 designs where pin-fixed routing is acceptable and ROM API features are not required. |
Compared with LPC810M021FN8129, LPC811M001JDH16 offers expanded memory and I/O at the cost of package compatibility, while STM32F030F4P6 provides higher density in SO8 but lacks the switch matrix's routing agility and NXP's ROM-based driver ecosystem.
Availability
LPC810M021FN8129 is available at Aetrix Electronics and suitable for lighting control, consumer appliance interfaces, and industrial sensor nodes requiring stable component supply across prototyping, pilot production, and long-lifecycle manufacturing.
Supply support for LPC810M021FN8129 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC81xM product line was designed for cost-optimized, low-power 32-bit control in space-constrained applications - delivering ARM Cortex-M0+ performance with flexible peripheral routing and robust power management in legacy-friendly packages.
FAQ
What is the maximum operating frequency of the LPC810M021FN8129?
The LPC810M021FN8129 operates at a maximum CPU frequency of 30 MHz. This is achieved using the internal 12 MHz RC oscillator with PLL multiplication or an external crystal up to 25 MHz. The ARM Cortex-M0+ core executes instructions with a two-stage pipeline, enabling deterministic real-time response critical for timing-sensitive control loops in the LPC810M021FN8129.
Does the LPC810M021FN8129 support external crystal oscillators?
No, the LPC810M021FN8129 in the DIP8 package does not expose XTALIN or XTALOUT pins. Per Figure 2 and Table 4, pins PIO0_8 and PIO0_9 - which serve as XTALIN/XTALOUT in larger packages - are omitted from the DIP8 variant. The LPC810M021FN8129 relies solely on its 12 MHz internal RC oscillator (±1.5 % accuracy) or external clock input via PIO0_1/CLKIN for system timing.
How many GPIO pins are available on the LPC810M021FN8129?
The LPC810M021FN8129 provides six general-purpose I/O pins: PIO0_0, PIO0_1, PIO0_2, PIO0_3, PIO0_4, and PIO0_5. All six are accessible on the DIP8 package (pins 8, 5, 4, 3, 2, and 1 respectively) and support configurable pull-up/pull-down resistors, input inversion, glitch filtering, and 20 mA source capability on four pins. This count is confirmed in Table 2 of the datasheet.
Can the LPC810M021FN8129 be programmed via UART (ISP)?
Yes, the LPC810M021FN8129 supports In-System Programming via UART. With boot code version 13.1 (as indicated by '1A' revision marking), ISP entry is triggered by holding PIO0_1 LOW during reset, using PIO0_0 as U0_RXD and PIO0_4 as U0_TXD. The 8 kB ROM contains the full ISP handler and UART driver API, eliminating the need for external programming hardware beyond a TTL-level UART adapter for the LPC810M021FN8129.
What debug interface does the LPC810M021FN8129 support?
The LPC810M021FN8129 supports Serial Wire Debug (SWD) using dedicated pins SWDIO (PIO0_2) and SWCLK (PIO0_3), both accessible on the DIP8 package. JTAG is not supported in standard operation; TMS and TCK functions appear only during boundary scan mode. SWD enables full debugging - including breakpoints, watchpoints, and memory inspection - with minimal two-wire connection overhead for the LPC810M021FN8129.
LPC810M021FN8129 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 8-DIP (0.300", 7.62mm)
- Series:
- LPC81xM
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 30MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 6
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
LPC810M021FN8129 FAQ
1.How can I place an order for LPC810M021FN8129 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC810M021FN8129 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC810M021FN8129 reliable?
The price and inventory of LPC810M021FN8129 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC810M021FN8129 is usually 5 days.
3.What payment methods are accepted for LPC810M021FN8129?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC810M021FN8129 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC810M021FN8129?
LPC810M021FN8129 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC810M021FN8129 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC810M021FN8129?
For technical support, including LPC810M021FN8129 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC810M021FN8129 requirements.
6.How does Aetrix verify that LPC810M021FN8129 is sourced from the original manufacturer or authorized distributors?
All LPC810M021FN8129 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC810M021FN8129 meets industry standards.
7.What is the process for return or replacement of LPC810M021FN8129?
All LPC810M021FN8129 units undergo pre-shipment inspection (PSI). If there is an issue with LPC810M021FN8129, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC810M021FN8129 part is unused and in its original packaging.
Return procedure for LPC810M021FN8129:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC810M021FN8129 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

