My Inquiry
My Account
NXP Semiconductors LPC811M001FDH16FP
- Part No.:
- LPC811M001FDH16FP
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
LPC811M001FDH16FP.pdf
- Description:
- IC MCU 32BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,122
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC811M001FDH16FP from NXP Semiconductors is a 32-bit ARM Cortex-M0+ microcontroller in TSSOP16 package, operating up to 30 MHz with 8 kB flash, 2 kB SRAM, 2 USARTs, 1 I2C, 1 SPI, 1 comparator, and 14 GPIO pins. It targets cost-sensitive embedded control in lighting, motor control, and consumer devices requiring low-power operation and flexible pin assignment via switch matrix.
For engineers reviewing the LPC811M001FDH16FP datasheet, LPC811M001FDH16FP pinout, LPC811M001FDH16FP application, or LPC811M001FDH16FP equivalent, key selection considerations include its fixed-pin SWD debug interface, movable peripheral functions assigned through the switch matrix, Deep power-down wake-up capability on PIO0_4, and I2C compliance requiring open-drain assignment to PIO0_10/PIO0_11.
Technical Context
The LPC811M001FDH16FP integrates an ARM Cortex-M0+ core with single-cycle I/O access and NVIC supporting up to 8 external GPIO interrupts. Its switch matrix enables runtime reassignment of USART, SPI, I2C, and SCT functions to any non-power/non-ground pin - except fixed functions like SWDIO (PIO0_2), SWCLK (PIO0_3), RESET (PIO0_5), and WAKEUP (PIO0_4).
Power management includes Sleep, Deep-sleep, Power-down, and Deep power-down modes, with wake-up from Deep power-down triggered by a LOW pulse on PIO0_4. The analog comparator uses external reference VDDCMP (PIO0_6) and supports output routing via the switch matrix as ACMP_O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0+, 30 MHz max - enables deterministic real-time control with low gate count and energy efficiency. |
| Flash Memory | 8 kB - sufficient for compact firmware with bootloader, drivers, and application logic in resource-constrained designs. |
| SRAM | 2 kB - supports moderate stack depth, data buffers, and peripheral register shadowing without external memory. |
| GPIO Pins | 14 - all configurable via switch matrix; includes 5 V tolerant pads with programmable pull-up/pull-down and hysteresis. |
| Serial Interfaces | 2 USARTs, 1 I2C, 1 SPI - movable functions assigned dynamically to GPIO pins, enabling flexible board layout and multi-protocol support. |
| Comparator | 1-channel with external reference (VDDCMP on PIO0_6) - supports threshold detection and analog monitoring without ADC overhead. |
| Package | TSSOP16 (SOT403-1), 4.4 mm body width - surface-mount compatible with standard PCB assembly and space-efficient for compact modules. |
Pinout & Package
Package: TSSOP16 (SOT403-1), 16-pin plastic thin shrink small outline, 0.65 mm pitch, 4.4 mm body width.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 | General-purpose I/O / SWD TDO / USART0 RX | Default GPIO; serves as SWD test data out or ISP receive; reset state: input with pull-up enabled. |
| PIO0_1 | General-purpose I/O / CLKIN / USART0 TX | ISP entry pin (LOW at reset); accepts external clock; 5 V tolerant with configurable hysteresis. |
| PIO0_2 | SWDIO / TMS | Serial Wire Debug I/O enabled by default; boundary scan mode selects JTAG TMS; 5 V tolerant high-current driver. |
| PIO0_3 | SWCLK / TCK | Serial Wire Clock input; JTAG test clock in boundary scan; 5 V tolerant with configurable hysteresis. |
| PIO0_4 | WAKEUP / TRST | Deep power-down wake-up trigger (LOW pulse ≥50 ns); also JTAG test reset; 5 V tolerant; must remain unassigned for wake-up use. |
| PIO0_5 | RESET / GPIO | External active-low reset input; resets peripherals and CPU; requires external pull-up for Deep power-down mode. |
| PIO0_6 | VDDCMP / GPIO | Comparator reference voltage input; analog function disables digital I/O; 3 V tolerant due to analog role. |
| PIO0_7–PIO0_13 | General-purpose I/O | All 5 V tolerant; support configurable pull-up/down, glitch filter, repeater mode, and open-drain output. |
| VDD | Power Supply | 3.3 V nominal supply; decoupling required near pin for stable core/peripheral operation. |
| VSS | Ground | Dedicated ground return; must be connected to system GND plane with low-inductance path. |
Key Features
| Feature | Design Value |
|---|---|
| Switch Matrix (SWM) | Enables dynamic assignment of USART, SPI, I2C, SCT, and comparator functions to any GPIO pin - eliminating fixed peripheral pin constraints and simplifying PCB layout. |
| State Configurable Timer (SCT) | Hardware-based timer with capture/match logic assignable to GPIO pins via SWM - supports complex timing sequences (e.g., PWM generation, input capture) without CPU overhead. |
| Pin Interrupt & Pattern Match Engine | Configures up to 8 GPIO pins for edge/level interrupts or boolean pattern matching - enables hardware-accelerated event detection and state-machine triggering. |
| Low-Power Modes | Four modes (Sleep, Deep-sleep, Power-down, Deep power-down) with wake-up from all via PIO0_4 or RTC - extends battery life in portable and energy-harvesting applications. |
| On-chip ROM API | 8 kB ROM contains validated ISP/IAP, USART/I2C drivers, and power profile APIs - reduces firmware size and accelerates development of field-upgradable systems. |
Applications
| Lighting Control | Motor Drive Interface |
|---|---|
Use Scenario: Digital dimming and color mixing in LED luminaires using PWM and I2C-connected ambient light sensors. IC Role / Device Role / Timing Role: MCU executing closed-loop brightness control, managing I2C sensor reads, and generating synchronized PWM outputs via SCT. Use Value: 14 GPIO + switch matrix allows co-location of I2C, PWM, and status LEDs on minimal pins; Deep-sleep mode reduces standby current to <1 µA. | Use Scenario: Fan speed regulation and fault monitoring in HVAC blowers using hall-effect feedback and thermal shutdown signals. IC Role / Device Role / Timing Role: Real-time motor commutation timing via SCT match outputs and overtemperature interrupt handling on PIO0_4. Use Value: Single-cycle GPIO and NVIC latency <12 cycles ensure precise timing; 30 MHz CPU handles sensor fusion and safety checks within 100 µs windows. |
| Consumer Appliance UI | Fire & Security Sensor Node |
Use Scenario: Touchless button interface and display backlight control in kitchen appliances using capacitive sensing and UART diagnostics. IC Role / Device Role / Timing Role: GPIO-driven capacitive sense scanning with pattern-match engine detecting multi-pin gestures; USART0 for service port logging. Use Value: Boolean pattern matching on 8 GPIO inputs enables gesture recognition without CPU polling; ROM-based USART driver simplifies firmware updates. | Use Scenario: Battery-powered smoke detector with CO sensor, acoustic alarm, and wireless reporting via UART-to-LoRa bridge. IC Role / Device Role / Timing Role: Low-power supervisor monitoring analog comparator output for smoke threshold crossing and waking CPU from Deep power-down. Use Value: Wake-up on PIO0_4 from comparator event achieves sub-µA average current; 2 kB SRAM retains sensor history across wake cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC812M101FDH16 | 16 kB flash, 4 kB SRAM, 3 USARTs, 2 SPI, 14 GPIO - adds USART2 and second SPI vs. LPC811M001FDH16FP. | Supports dual UART bridging or simultaneous SPI+USART protocols where LPC811M001FDH16FP lacks bandwidth. | Select when firmware growth exceeds 8 kB or additional serial channels are required; same TSSOP16 footprint and pinout. |
| STM32F030F4P6 | 16 MHz Cortex-M0, 16 kB flash, 4 kB SRAM, 1 USART, 1 SPI, 1 I2C, 15 GPIO - no switch matrix, fixed peripheral mapping, no Deep power-down wake-up pin. | Lacks flexible pin assignment and ultra-low-power wake-up capability; suited for simpler, cost-optimized designs without dynamic I/O reconfiguration. | Choose for legacy toolchain compatibility or when fixed pinout suffices; requires PCB redesign due to different pin functions and no PIO0_4 wake-up equivalent. |
Compared with LPC811M001FDH16FP, LPC812M101FDH16 offers expanded memory and interfaces in identical packaging, while STM32F030F4P6 trades flexibility and ultra-low-power features for lower unit cost and broader ecosystem support - making LPC811M001FDH16FP optimal for pin-constrained, power-aware designs needing runtime peripheral remapping.
Availability
LPC811M001FDH16FP is available at Aetrix Electronics and suitable for lighting control, motor drive interface, and consumer appliance UI applications requiring stable component supply, long-term manufacturability, and NXP's industrial-grade qualification.
Supply support for LPC811M001FDH16FP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC800 series, including LPC811M001FDH16FP, was designed for cost-sensitive, low-power embedded control applications - emphasizing flexible I/O, integrated debug, and energy efficiency in compact packages.
FAQ
What is the maximum operating frequency of the LPC811M001FDH16FP?
The LPC811M001FDH16FP operates at a maximum CPU frequency of 30 MHz, enabled by its ARM Cortex-M0+ core with two-stage pipeline and single-cycle multiplier. This frequency is achievable using the internal 12 MHz RC oscillator (trimmed to ±1 %), external crystal (1–25 MHz), or PLL - allowing design flexibility without requiring high-frequency crystals. The LPC811M001FDH16FP maintains full peripheral functionality at this rate, including USART bit rates up to 1.875 Mbit/s.
Does the LPC811M001FDH16FP support in-system programming (ISP)?
Yes, the LPC811M001FDH16FP supports In-System Programming (ISP) via its built-in ROM bootloader. Entry is triggered by holding PIO0_1 LOW during reset, enabling UART-based firmware updates without external programmers. The 8 kB on-chip ROM provides validated ISP and IAP APIs, allowing safe flash reprogramming from running application code - a capability confirmed in the LPC81xM objective data sheet Rev. 1.0. This makes LPC811M001FDH16FP suitable for field-upgradable devices.
How many GPIO pins does the LPC811M001FDH16FP have, and are they 5 V tolerant?
The LPC811M001FDH16FP provides 14 general-purpose I/O pins (PIO0_0 to PIO0_13), all of which are 5 V tolerant except PIO0_6 (VDDCMP, 3 V tolerant due to analog function). Each pin supports configurable pull-up/pull-down resistors, hysteresis, glitch filtering, and open-drain output - verified in Table 3 of the LPC81xM datasheet. This tolerance simplifies interfacing with legacy 5 V logic and sensors without level shifters.
Can the LPC811M001FDH16FP wake up from Deep power-down mode, and how?
Yes, the LPC811M001FDH16FP can wake up from Deep power-down mode exclusively via a LOW-going pulse (≥50 ns) on PIO0_4, designated as the WAKEUP pin. This pin is 5 V tolerant and must not be assigned any movable function (e.g., USART, SPI) if wake-up is required. External circuitry must pull PIO0_4 HIGH to enter Deep power-down and LOW to exit - a hardware-triggered mechanism independent of software execution, ensuring reliable low-power operation in battery-powered applications.
What debug interface does the LPC811M001FDH16FP support, and which pins are used?
The LPC811M001FDH16FP supports Serial Wire Debug (SWD) using dedicated pins SWDIO (PIO0_2) and SWCLK (PIO0_3), both enabled by default after reset. These pins are 5 V tolerant and include high-current drivers for robust signal integrity. JTAG is available only in boundary scan mode (TDO/TDI/TCK/TMS on PIO0_0–PIO0_4), but SWD is the primary debug interface - confirmed in Section 2 features and Table 3 pin description of the LPC81xM datasheet.
LPC811M001FDH16FP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- LPC81xM
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 30MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 14
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC811M001FDH16FP FAQ
1.How can I place an order for LPC811M001FDH16FP through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC811M001FDH16FP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC811M001FDH16FP reliable?
The price and inventory of LPC811M001FDH16FP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC811M001FDH16FP is usually 5 days.
3.What payment methods are accepted for LPC811M001FDH16FP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC811M001FDH16FP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC811M001FDH16FP?
LPC811M001FDH16FP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC811M001FDH16FP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC811M001FDH16FP?
For technical support, including LPC811M001FDH16FP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC811M001FDH16FP requirements.
6.How does Aetrix verify that LPC811M001FDH16FP is sourced from the original manufacturer or authorized distributors?
All LPC811M001FDH16FP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC811M001FDH16FP meets industry standards.
7.What is the process for return or replacement of LPC811M001FDH16FP?
All LPC811M001FDH16FP units undergo pre-shipment inspection (PSI). If there is an issue with LPC811M001FDH16FP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC811M001FDH16FP part is unused and in its original packaging.
Return procedure for LPC811M001FDH16FP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC811M001FDH16FP Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
