NXP Semiconductors LPC812M101FDH16FP

Overview

LPC812M101FDH16FP from NXP Semiconductors is a 32-bit ARM Cortex-M0+ microcontroller in TSSOP16 package, operating up to 30 MHz with 16 kB flash and 4 kB SRAM. It integrates three USARTs, two SPI interfaces, one I²C-bus interface, a State Configurable Timer (SCT), CRC engine, and 14 GPIO pins-designed for cost-sensitive embedded control in lighting and motor drive applications.

For engineers reviewing the LPC812M101FDH16FP datasheet, LPC812M101FDH16FP pinout, LPC812M101FDH16FP application, or LPC812M101FDH16FP equivalent, key selection criteria include its switch-matrix–enabled peripheral routing, deep power-down wake-up capability via PIO0_4, 5 V-tolerant I/O with configurable hysteresis, and ROM-based ISP/IAP support for field firmware updates.

Technical Context

The LPC812M101FDH16FP implements an ARM Cortex-M0+ core with single-cycle I/O access and integrated NVIC supporting 32 vectored interrupts-including up to eight external GPIO interrupts with edge/level sensitivity. Its switch matrix enables dynamic assignment of USART, SPI, I²C, and SCT functions to any non-power/non-ground pin, decoupling peripheral logic from fixed pinout constraints.

Power management includes four low-power modes (Sleep, Deep-sleep, Power-down, Deep power-down), with wake-up from Deep power-down triggered by PIO0_4. Clocking supports internal 12 MHz RC oscillator (±1 %), external crystal (1–25 MHz), PLL for CPU rate scaling, and dedicated clock output with programmable divider.

Key Specifications

Pinout & Package

TSSOP16 package (SOT403-1), 4.4 mm body width, 0.65 mm pitch - compatible with standard surface-mount assembly processes and space-constrained PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC812M101FDH20 and LPC811M001FDH16, the LPC812M101FDH16FP delivers optimal balance of I/O count, peripheral richness, and package size - retaining full SCT, three USARTs, and IAP capability within the smallest TSSOP footprint of the LPC81xM family.

Availability

LPC812M101FDH16FP is available at Aetrix Electronics and suitable for lighting control, motor drive interface, and climate sensor node applications requiring stable component supply and long-term industrial availability.

Supply support for LPC812M101FDH16FP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC81xM product line was designed for cost-sensitive, low-power embedded control applications - emphasizing flexible peripheral routing, ultra-low-power operation, and rapid firmware development through ROM-based drivers and intuitive toolchain support.

FAQ

What is the maximum operating frequency of the LPC812M101FDH16FP?

The LPC812M101FDH16FP operates at a maximum CPU frequency of 30 MHz, enabled by its ARM Cortex-M0+ core and internal PLL. This frequency is achievable using the internal 12 MHz RC oscillator, external crystal (1–25 MHz), or CLKIN source - with the PLL configured to scale the clock without requiring a high-frequency crystal. The LPC812M101FDH16FP maintains timing integrity across all supported clock sources per its objective data sheet Rev. 1.0.

Does the LPC812M101FDH16FP support in-application programming (IAP)?

Yes, the LPC812M101FDH16FP supports Flash In-Application Programming (IAP) via its on-chip 8 kB ROM API, which includes verified IAP routines for erasing and writing flash sectors without halting execution. This capability is documented in Section 7.4 of the LPC81xM objective data sheet and enables field firmware updates while maintaining real-time control - a core feature of the LPC812M101FDH16FP's design.

How many USART interfaces does the LPC812M101FDH16FP have, and are they all accessible in TSSOP16?

The LPC812M101FDH16FP integrates three USART interfaces (USART0, USART1, USART2), and all are fully accessible in the TSSOP16 package via the switch matrix. Unlike some variants, USART2 is explicitly supported on LPC812M101FDH16FP per Table 2 of the ordering information - enabling simultaneous UART communication with multiple peripherals without multiplexing or external logic.

What is the role of the switch matrix (SWM) in the LPC812M101FDH16FP?

The switch matrix (SWM) in the LPC812M101FDH16FP dynamically routes movable peripheral functions - including USART, SPI, I²C, SCT, and clock outputs - to any GPIO pin except VDD/VSS. This eliminates fixed peripheral pin constraints, allowing designers to optimize PCB layout and reuse firmware across variants. The LPC812M101FDH16FP's SWM is central to its flexibility, as confirmed in Section 7.9 of the official data sheet.

Can the LPC812M101FDH16FP wake up from Deep power-down mode, and how?

Yes, the LPC812M101FDH16FP can wake up from Deep power-down mode exclusively via the PIO0_4 pin, which functions as WAKEUP. A LOW-going pulse of at least 50 ns on this pin triggers wake-up - and the pin must not be assigned any movable function to preserve this capability. External pull-up is required for stable Deep power-down entry, as specified in Table 3 footnote [6] of the LPC812M101FDH16FP data sheet.