NXP Semiconductors LPC812M101JDH20FP
- Part No.:
- LPC812M101JDH20FP
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
LPC812M101JDH20FP.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LPC812M101JDH20FP from NXP Semiconductors is a 32-bit ARM Cortex-M0+ microcontroller operating at up to 30 MHz, featuring 16 kB flash, 4 kB SRAM, and 18 GPIO pins. It integrates a state-configurable timer/PWM (SCTimer), multi-rate timer (MRT), self wake-up timer (WKT), CRC engine, and one analog comparator - deployed in low-power embedded control for lighting, motor drive, and climate systems.
For engineers reviewing the LPC812M101JDH20FP datasheet, LPC812M101JDH20FP pinout, LPC812M101JDH20FP application, or LPC812M101JDH20FP equivalent, key selection criteria include its TSSOP20 package with true open-drain I²C pins (PIO0_10/PIO0_11), switch-matrix–configured peripheral routing, 20 mA high-current output capability on four pins, and Deep power-down wake-up via PIO0_4.
Technical Context
The LPC812M101JDH20FP implements an ARM Cortex-M0+ core with single-cycle I/O access, NVIC, and Micro Trace Buffer (MTB) for real-time debugging. Its clock system combines a 12 MHz ±1.5% internal RC oscillator, programmable PLL, crystal oscillator (1–25 MHz), and multiple low-power oscillators including a 10 kHz WKT source.
Peripheral routing is managed by a hardware switch matrix enabling dynamic assignment of USART0/1/2, SPI0/1, I²C, SCTimer inputs/outputs, and comparator functions to any non-power/non-ground GPIO (PIO0_0 to PIO0_17). Fixed-pin functions - including SWDIO/SWCLK, RESET, XTALIN/XTALOUT, and WAKEUP - are physically bound to specific TSSOP20 pins per Figure 5.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0+, 30 MHz max - enables deterministic real-time control with <10 µs interrupt latency. |
| Memory | 16 kB flash / 4 kB SRAM - supports firmware updates via IAP and sufficient RAM for sensor fusion or protocol stacks. |
| GPIO Count | 18 configurable pins - includes 4 × 20 mA source outputs and 2 × 20 mA sink open-drain pins for direct LED/relay driving. |
| Serial Interfaces | 3 USARTs, 2 SPIs, 1 I²C - all assignable via switch matrix; I²C requires PIO0_10/PIO0_11 for full Fast-mode Plus compliance. |
| Timers | SCTimer/PWM (input capture/match), MRT (4 fixed-rate interrupts), WKT (low-power wake-up) - supports motor commutation and periodic sensor polling without CPU load. |
| Power Modes | Sleep, Deep-sleep, Power-down, Deep power-down - Deep power-down draws <1 µA and wakes via PIO0_4 pulse or WKT timeout. |
| Operating Temp | −40 °C to 105 °C - qualified for industrial-grade operation in enclosed motor drives or HVAC controllers. |
Pinout & Package
TSSOP20 package (SOT360-1): 20-lead, 4.4 mm body width, 0.65 mm pitch, surface-mount. Pin 1 index marked; lead finish = matte tin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (PIO0_17) | General-purpose I/O | Configurable digital input/output; assignable to USART/SPI/SCT via switch matrix; 5 V tolerant with pull-up/down control. |
| 2 (PIO0_14) | General-purpose I/O | Same as PIO0_17; supports glitch filter, input inversion, hysteresis disable - used for noise-immune sensor inputs. |
| 3 (PIO0_13) | General-purpose I/O | Default GPIO; can be assigned I²C SDA/SCL or SCT outputs; not usable for XTAL or SWD functions. |
| 4 (PIO0_0/ACMP_I1/TDO) | Multi-function pin | Fixed comparator input 1 or boundary scan TDO; GPIO disabled when ACMP_I1 active; not assignable to movable peripherals. |
| 5 (PIO0_12) | ISP entry pin (v4C+) | LOW during reset triggers ISP mode on chip revisions ≥4C; replaces PIO0_1 as ISP entry for TSSOP20/SO20/XSON16 packages. |
| 6 (PIO0_6/VDDCMP) | Analog reference | VDDCMP supplies alternate comparator reference voltage; digital I/O disabled when analog mode enabled. |
| 7 (RESET/PIO0_5) | Reset input | Active-low reset; 50 ns pulse required; must be pulled HIGH in Deep power-down mode if external reset unused. |
| 8 (PIO0_7) | General-purpose I/O | Standard 5 V tolerant GPIO; supports high-current sink only when configured as open-drain output. |
| 9 (SWCLK/PIO0_3/TCK) | Debug clock | SWD clock input by default; becomes JTAG TCK in boundary scan mode; no peripheral assignment possible. |
| 10 (VDD) | Power supply | 3.3 V nominal supply; decoupling capacitor required within 5 mm of pin; supports 2.4–3.6 V operating range. |
| 11 (SWDIO/PIO0_2/TMS) | Debug I/O | SWD bidirectional data line; becomes JTAG TMS in boundary scan; cannot be reassigned to USART/SPI/I²C. |
| 12 (PIO0_8/XTALIN) | Oscillator input | XTALIN accepts 1–25 MHz crystal; digital I/O disabled when crystal mode active; max input voltage 1.95 V. |
| 13 (PIO0_11) | I²C SDA (open-drain) | True open-drain pin; required for I²C Fast-mode Plus; needs external pull-up; floating when VDD off. |
| 14 (PIO0_9/XTALOUT) | Oscillator output | XTALOUT drives crystal; digital I/O disabled when crystal mode active; no peripheral reassignment allowed. |
| 15 (PIO0_10) | I²C SCL (open-drain) | True open-drain pin; paired with PIO0_11 for full I²C compliance; same electrical constraints as PIO0_11. |
| 16 (PIO0_1/ACMP_I2/CLKIN/TDI) | Comparator input | Fixed ACMP_I2 or CLKIN; TDI in boundary scan; ISP entry on v1A/v2A chips; GPIO disabled when analog function selected. |
| 17 (PIO0_16) | General-purpose I/O | Assignable to UART TX/RX, SPI MOSI/MISO, or SCT outputs; supports pattern-match interrupt triggering. |
| 18 (PIO0_15) | General-purpose I/O | Same as PIO0_16; used for boolean pattern-matching across 8 GPIOs to trigger wake-up from Deep-sleep. |
| 19 (VSS) | Ground | Primary ground reference; must be connected before VDD; recommended 0.1 µF ceramic decoupling adjacent to pin. |
| 20 (PIO0_4/WAKEUP/TRST) | Wake-up trigger | LOW pulse ≥50 ns wakes from Deep power-down; TRST in boundary scan; must be pulled HIGH externally before entering Deep power-down. |
Key Features
| Feature | Design Value |
|---|---|
| Switch Matrix Peripheral Routing | Enables runtime remapping of USART/SPI/I²C/SCT functions to any non-power GPIO - eliminates PCB redesign for interface changes. |
| State-Configurable Timer (SCTimer) | Hardware state machine with input capture and PWM match outputs - executes complex timing sequences (e.g., BLDC commutation) without CPU intervention. |
| Pattern-Match Interrupt Engine | Boolean logic on 8 GPIO inputs generates interrupt on custom level/edge combinations - reduces firmware overhead for multi-sensor event detection. |
| Deep Power-Down Mode | Sub-1 µA current draw with wake-up via PIO0_4 pulse or WKT timeout - extends battery life in wireless sensors or portable controllers. |
| On-Chip ROM API | 8 kB ROM contains validated drivers for IAP, ISP, USART, I²C, and power profiles - accelerates development and ensures flash programming reliability. |
Applications
| Lighting Control | Motor Drive Interface |
|---|---|
Use Scenario: Smart LED driver board with dimming, color mixing, and thermal monitoring. IC Role / Device Role / Timing Role: Main controller executing PWM dimming algorithms, reading ambient light/temperature sensors, and communicating via I²C to RGB LED ICs. Use Value: SCTimer generates precise multi-channel PWM with dead-time insertion; 18 GPIO support direct connection to 6-channel LED strings and thermistors without external logic. | Use Scenario: Brushless DC (BLDC) motor controller for HVAC blower or fan module. IC Role / Device Role / Timing Role: Real-time commutation sequencer using SCTimer inputs (Hall sensors) and outputs (gate drivers), with UART for speed setpoint commands. Use Value: Hardware-based SCTimer state machine handles 6-step commutation timing at 30 kHz without CPU load; GPIO pattern matching detects Hall sensor faults. |
| Climate Sensor Hub | Fire/Security Panel Node |
Use Scenario: Battery-powered indoor air quality node measuring CO₂, humidity, and VOCs. IC Role / Device Role / Timing Role: Low-power coordinator collecting sensor data over I²C, processing thresholds, and waking radio via USART for transmission. Use Value: Deep power-down mode draws <1 µA; PIO0_4 wake-up triggered by PIR motion or sensor alert; ROM-based I²C drivers reduce firmware size. | Use Scenario: Zone controller in commercial fire alarm system with smoke/heat detectors and sounder outputs. IC Role / Device Role / Timing Role: Supervisory MCU monitoring detector status, managing alarm latching, and driving audible/visual alerts via GPIO. Use Value: 105 °C rating ensures reliability in hot ceiling cavities; windowed watchdog (WWDT) prevents lockup during fault conditions; 4 kB SRAM stores event logs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC812M101JD20 | SO20 package (7.5 mm width), 18 GPIO, identical flash/SRAM/peripherals - lacks true open-drain I²C pins. | Preferred for through-hole prototyping or legacy SOIC footprints; unsuitable for I²C Fast-mode Plus designs requiring PIO0_10/PIO0_11. | Select JD20 only when SO20 mechanical compatibility outweighs I²C performance requirements. |
| LPC824M201JHI33 | Enhanced variant: 32 kB flash, 8 kB SRAM, additional USART/SPI, higher temp (−40 °C to 105 °C), same TSSOP20 package. | Used where larger code footprint (e.g., BLE stack) or extra serial interfaces are needed; pin-compatible but requires firmware validation for memory map changes. | Choose JHI33 when scaling firmware complexity or adding communication channels beyond LPC812M101JDH20FP's limits. |
Compared with LPC812M101JD20, the LPC812M101JDH20FP provides guaranteed I²C Fast-mode Plus compliance via dedicated open-drain pins, while LPC824M201JHI33 offers double the memory and peripherals at identical pinout - making it a direct upgrade path for feature-rich designs.
Availability
LPC812M101JDH20FP is available at Aetrix Electronics and suitable for lighting control, motor drive, and climate sensor applications requiring stable component supply, industrial temperature range (−40 °C to 105 °C), and long-term production continuity.
Supply support for LPC812M101JDH20FP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The LPC81xM product line delivers cost-optimized, low-power ARM Cortex-M0+ MCUs targeting resource-constrained embedded control - emphasizing flexible peripheral routing, ultra-low power states, and integrated ROM-based drivers to accelerate time-to-market.
FAQ
What is the maximum operating frequency of the LPC812M101JDH20FP?
The LPC812M101JDH20FP operates at a maximum CPU frequency of 30 MHz using its ARM Cortex-M0+ core. This speed is achievable with the internal 12 MHz RC oscillator (trimmed to ±1.5%), external crystal (1–25 MHz), or PLL - all supported in the LPC812M101JDH20FP clock generation system without requiring external high-frequency components.
Does the LPC812M101JDH20FP support in-application programming (IAP)?
Yes, the LPC812M101JDH20FP supports Flash In-Application Programming (IAP) via its 8 kB on-chip ROM API. This allows firmware updates while the device is running, using validated routines that handle page erase/write operations safely - a capability confirmed in Section 8.4 of the official NXP LPC81xM datasheet for LPC812M101JDH20FP.
Which pins on the LPC812M101JDH20FP support true open-drain I²C operation?
The LPC812M101JDH20FP reserves PIO0_10 and PIO0_11 as true open-drain pins specifically for I²C-bus compliance. These pins support I²C standard mode, Fast-mode, and Fast-mode Plus when configured via the IOCON register - a requirement explicitly stated in Table 4 and Section 7.2 of the LPC812M101JDH20FP datasheet.
How does the LPC812M101JDH20FP achieve wake-up from Deep power-down mode?
The LPC812M101JDH20FP wakes from Deep power-down mode via a LOW pulse ≥50 ns on PIO0_4 (WAKEUP pin), or via timeout from its self wake-up timer (WKT). External pull-up is mandatory on PIO0_4 before entering Deep power-down - a design constraint verified in Table 4 footnote [6] and Section 7.2 of the LPC812M101JDH20FP documentation.
Is the LPC812M101JDH20FP pin-compatible with other LPC81xM variants in TSSOP20?
Yes, the LPC812M101JDH20FP shares identical pinout and electrical characteristics with other TSSOP20-packaged LPC81xM devices (e.g., LPC812M101JDH20), including matching GPIO assignments, SWD debug pins, and power/ground locations - as confirmed by Figures 5 and Table 4 in the LPC812M101JDH20FP datasheet.
LPC812M101JDH20FP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- LPC81xM
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 30MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 18
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC812M101JDH20FP FAQ
1.How can I place an order for LPC812M101JDH20FP through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC812M101JDH20FP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of LPC812M101JDH20FP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC812M101JDH20FP is usually 5 days.
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5.How can I obtain technical support or documentation for LPC812M101JDH20FP?
For technical support, including LPC812M101JDH20FP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC812M101JDH20FP requirements.
6.How does Aetrix verify that LPC812M101JDH20FP is sourced from the original manufacturer or authorized distributors?
All LPC812M101JDH20FP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC812M101JDH20FP meets industry standards.
7.What is the process for return or replacement of LPC812M101JDH20FP?
All LPC812M101JDH20FP units undergo pre-shipment inspection (PSI). If there is an issue with LPC812M101JDH20FP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC812M101JDH20FP part is unused and in its original packaging.
Return procedure for LPC812M101JDH20FP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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