NXP Semiconductors LPC812M101JTB16X
- Part No.:
- LPC812M101JTB16X
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-XFDFN
- Datasheet:
-
LPC812M101JTB16X.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 16XSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LPC812M101JTB16X from NXP Semiconductors is a 32-bit ARM Cortex-M0+ microcontroller operating at up to 30 MHz, featuring 16 kB flash, 4 kB SRAM, and 14 GPIO pins in a 16-terminal XSON package. It integrates a state-configurable timer/PWM (SCTimer), three USARTs, two SPI interfaces, one I²C-bus interface, and an analog comparator - enabling compact, low-power embedded control in space-constrained applications such as lighting modules and sensor nodes.
For engineers reviewing the LPC812M101JTB16X datasheet, LPC812M101JTB16X pinout, LPC812M101JTB16X application, or LPC812M101JTB16X equivalent, this device offers verified support for ISP/IAP programming, SWD debug, flexible peripheral routing via switch matrix, and wake-up from deep power-down mode using PIO0_4 - critical for battery-powered industrial and consumer edge devices.
Technical Context
The LPC812M101JTB16X implements a two-stage-pipeline ARM Cortex-M0+ core with single-cycle I/O access and integrated NVIC supporting 32 vectored interrupts. Its switch matrix enables dynamic assignment of USART, SPI, I²C, and SCTimer functions to any non-power GPIO pin - decoupling hardware layout from firmware-defined peripheral mapping.
Power management includes four low-power modes (Sleep, Deep-sleep, Power-down, Deep power-down), with wake-up capability from USART/SPI/I²C activity or dedicated WAKEUP pin (PIO0_4). Clocking combines a 12 MHz ±1.5% IRC, external crystal (1–25 MHz), PLL, and multiple low-power oscillators - all configurable via SYSCON registers without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0+, 30 MHz max - delivers deterministic real-time control with <100 ns GPIO toggle latency. |
| Flash / SRAM | 16 kB flash (64 B page erase/write), 4 kB SRAM - sufficient for bootloader + application code with data buffers. |
| GPIO Pins | 14 configurable digital I/O pins - supports pull-up/down, open-drain, glitch filter, and input inversion per pin. |
| Serial Interfaces | 3 × USART, 2 × SPI, 1 × I²C - all assignable via switch matrix; I²C compliant with Fast-mode Plus on true open-drain pins. |
| Timers & PWM | SCTimer/PWM (input capture/match), MRT (4-channel multi-rate), WKT (self-wake) - enables motor commutation and precise timing without external ICs. |
| Analog Function | 1 × comparator with internal/external reference (VDDCMP) - supports overvoltage detection and threshold sensing. |
| Package | XSON16 (2.5 × 3.2 × 0.5 mm) - ultra-compact footprint ideal for PCB area-limited designs like smart switches. |
Pinout & Package
XSON16 package: 2.5 mm × 3.2 mm × 0.5 mm body, 16-terminal no-lead surface-mount, rated for −40 °C to 105 °C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | PIO0_13 | General-purpose I/O; assignable to USART/SPI/SCT via switch matrix; 5 V tolerant with configurable pull-up/down. |
| 2 | PIO0_12 | General-purpose I/O; ISP entry pin (chip rev 4C+) during reset; supports interrupt generation and pattern matching. |
| 3 | RESET/PIO0_5 | Active-low reset input; must be pulled HIGH in Deep power-down mode; doubles as GPIO when reset not used. |
| 4 | PIO0_4/WAKEUP/TRST | Wake-up trigger from Deep power-down; LOW pulse ≥50 ns exits low-power state; also serves as JTAG TRST. |
| 5 | SWCLK/PIO0_3/TCK | Serial Wire Debug clock; enabled by default; supports boundary scan TCK function in test mode. |
| 6 | SWDIO/PIO0_2/TMS | Serial Wire Debug bidirectional I/O; default debug interface; provides TMS in boundary scan mode. |
| 7 | PIO0_11 | True open-drain I/O; assigned to I²C SDA for full I²C compliance; high-current sink (20 mA) enabled. |
| 8 | PIO0_10 | True open-drain I/O; assigned to I²C SCL for full I²C compliance; high-current sink (20 mA) enabled. |
| 9 | PIO0_0/ACMP_I1/TDO | Comparator input 1 or JTAG TDO; analog input disables digital section; 5 V tolerant in digital mode. |
| 10 | PIO0_6/VDDCMP | Alternate comparator reference voltage source; digital I/O when not used as analog reference. |
| 11 | PIO0_7 | General-purpose I/O; supports interrupt generation and boolean pattern matching on eight GPIO inputs. |
| 12 | VSS | Ground reference; must be connected to PCB ground plane for stable analog/digital operation. |
| 13 | VDD | 3.3 V supply input; requires local 100 nF ceramic decoupling capacitor near pin. |
| 14 | PIO0_8/XTALIN | Crystal oscillator input; accepts 1–25 MHz external crystal; 5 V tolerant only in digital mode. |
| 15 | PIO0_9/XTALOUT | Crystal oscillator output; drives external crystal; must not be loaded externally beyond datasheet limits. |
| 16 | PIO0_1/ACMP_I2/CLKIN/TDI | Comparator input 2, external clock input, or JTAG TDI; ISP entry pin (rev 1A/2A); 5 V tolerant in digital mode. |
Key Features
| Feature | Design Value |
|---|---|
| Switch Matrix Routing | Enables dynamic assignment of USART/SPI/I²C/SCTimer functions to any non-power GPIO pin - eliminates fixed-peripheral-layout constraints. |
| Deep Power-Down Wake-Up | PIO0_4 triggers exit from Deep power-down mode with ≤50 ns pulse - extends battery life in intermittent-sensing applications. |
| High-Current I/O Drivers | Four pins support 20 mA source; two true open-drain pins support 20 mA sink - drive LEDs or small relays directly without external transistors. |
| ROM API Firmware | 8 kB boot ROM includes validated ISP/IAP, USART/I²C drivers, and power profile APIs - reduces firmware development time and flash usage. |
| Pattern-Match Interrupt Engine | Boolean logic on eight GPIO inputs generates interrupt on custom level/edge combinations - replaces external logic ICs in state-detection circuits. |
Applications
| Lighting Control | Smart Sensor Node |
|---|---|
Use Scenario: Dimmable LED driver with ambient light feedback and wireless command reception. IC Role / Device Role / Timing Role: Main controller executing PWM dimming, ADC sampling, and UART-based BLE command parsing. Use Value: SCTimer/PWM provides precise 16-bit LED current control; 3 USARTs enable simultaneous BLE, debug, and sensor interface without multiplexing. | Use Scenario: Battery-powered temperature/humidity node transmitting data via LoRaWAN every 10 minutes. IC Role / Device Role / Timing Role: Low-power system manager handling sensor reads, sleep scheduling, and packet assembly. Use Value: Deep power-down mode draws <1 µA; WAKEUP pin and self-wake timer ensure accurate wake intervals; 4 kB SRAM retains context across sleep cycles. |
| Industrial Motor Starter | Consumer Appliance UI |
Use Scenario: Compact 3-phase BLDC starter board with overcurrent protection and soft-start sequencing. IC Role / Device Role / Timing Role: Real-time motor commutation controller with fault monitoring and status reporting. Use Value: SCTimer captures hall sensor edges and generates synchronized PWM outputs; comparator monitors current sense voltage for fast shutdown. | Use Scenario: Touchless control panel for HVAC with capacitive buttons and display backlight dimming. IC Role / Device Role / Timing Role: Dedicated UI processor managing button debounce, LED feedback, and serial display interface. Use Value: GPIO interrupt with pattern-matching detects multi-button press sequences; high-current sink pins drive RGB indicator LEDs directly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC812M101JDH16 | TSSOP16 package (4.4 mm width); same core/peripherals but larger footprint and different thermal profile. | Better suited for prototyping or manual soldering; less suitable for ultra-thin consumer enclosures. | Select when board assembly process favors gull-wing leads or thermal dissipation exceeds XSON16 limits. |
| LPC824M201JHI33 | Enhanced variant: 32 kB flash, 8 kB SRAM, additional USART and GPIO; same XSON33 package (not pin-compatible). | Required for applications needing larger code space or extra serial channels without redesigning PCB layout. | Choose when future firmware growth or added peripherals justify migration to higher-density variant. |
Compared with LPC812M101JDH16, the LPC812M101JTB16X saves 40% board area and improves thermal resistance in sealed enclosures; versus LPC824M201JHI33, it offers lower cost and simpler qualification for established designs with unchanged memory/peripheral needs.
Availability
LPC812M101JTB16X is available at Aetrix Electronics and suitable for lighting control, smart sensor nodes, industrial motor starters, and consumer appliance UIs requiring stable component supply and long-term industrial-grade availability.
Supply support for LPC812M101JTB16X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC81xM product line targets cost-sensitive, space-constrained embedded control applications - delivering ARM Cortex-M0+ performance with integrated analog, programmable timers, and flexible I/O routing in minimal packages.
FAQ
What is the maximum operating frequency of the LPC812M101JTB16X?
The LPC812M101JTB16X operates at a maximum CPU frequency of 30 MHz using its ARM Cortex-M0+ core. This speed is achievable with the internal 12 MHz RC oscillator (trimmed to ±1.5%), external crystal (1–25 MHz), or PLL - all supported without external components. The core's two-stage pipeline and single-cycle I/O ensure deterministic timing for real-time tasks.
Does the LPC812M101JTB16X support in-system programming (ISP)?
Yes, the LPC812M101JTB16X supports ISP via its built-in ROM bootloader. Programming is performed through USART0 using the ISP entry pin (PIO0_12 for chip revision 4C+ or PIO0_1 for earlier revisions) during reset. The 8 kB ROM includes validated ISP and IAP APIs, eliminating the need for external programming hardware in production or field updates.
How many GPIO pins does the LPC812M101JTB16X have, and what special I/O features are supported?
The LPC812M101JTB16X provides 14 general-purpose I/O pins in its XSON16 package. Each supports configurable pull-up/down resistors, programmable open-drain mode, input inverter, and glitch filtering. Four pins deliver 20 mA source current; two (PIO0_10/PIO0_11) are true open-drain with 20 mA sink capability - enabling direct LED driving and I²C Fast-mode Plus compliance.
Can the LPC812M101JTB16X wake up from Deep power-down mode, and how is this triggered?
Yes, the LPC812M101JTB16X can wake up from Deep power-down mode using the PIO0_4 pin. A LOW-going pulse as short as 50 ns on this pin forces exit from Deep power-down and resumes execution. External pull-up is required before entering Deep power-down mode. Alternatively, the self wake-up timer (WKT) clocked by the 10 kHz low-power oscillator can provide timed wake-up without external signals.
What debug interface does the LPC812M101JTB16X use, and is JTAG supported?
The LPC812M101JTB16X uses Serial Wire Debug (SWD) as its primary debug interface, accessible via SWCLK (pin 5) and SWDIO (pin 6). JTAG boundary scan is supported in test mode only, where TDO/TDI/TCK/TMS functions appear on PIO0_0–PIO0_4. SWD is recommended for development due to its 2-pin efficiency and full debug capability including breakpoints and watchpoints.
LPC812M101JTB16X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-XFDFN
- Series:
- LPC81xM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 30MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 14
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC812M101JTB16X FAQ
1.How can I place an order for LPC812M101JTB16X through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC812M101JTB16X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC812M101JTB16X reliable?
The price and inventory of LPC812M101JTB16X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC812M101JTB16X is usually 5 days.
3.What payment methods are accepted for LPC812M101JTB16X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC812M101JTB16X transactions.
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4.How is shipping managed for LPC812M101JTB16X?
LPC812M101JTB16X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC812M101JTB16X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC812M101JTB16X?
For technical support, including LPC812M101JTB16X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC812M101JTB16X requirements.
6.How does Aetrix verify that LPC812M101JTB16X is sourced from the original manufacturer or authorized distributors?
All LPC812M101JTB16X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC812M101JTB16X meets industry standards.
7.What is the process for return or replacement of LPC812M101JTB16X?
All LPC812M101JTB16X units undergo pre-shipment inspection (PSI). If there is an issue with LPC812M101JTB16X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC812M101JTB16X part is unused and in its original packaging.
Return procedure for LPC812M101JTB16X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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