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NXP Semiconductors LPC822M101JHI33E

Part No.:
LPC822M101JHI33E
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixLPC822M101JHI33E.pdf
Description:
IC MCU 32BIT 16KB FLASH 33HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,251

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Product details

Overview

LPC822M101JHI33E from NXP Semiconductors is a 32-bit ARM Cortex-M0+ microcontroller operating at up to 30 MHz, featuring 16 KB flash, 4 KB SRAM, a 12-bit ADC with 12 input channels, one analog comparator, and three USART interfaces. It serves as a low-cost, low-power control core in compact embedded systems requiring mixed-signal I/O and flexible peripheral routing via its switch matrix.

For engineers reviewing the LPC822M101JHI33E datasheet, LPC822M101JHI33E pinout, LPC822M101JHI33E application, or LPC822M101JHI33E equivalent, key selection considerations include its HVQFN33 package with 29 GPIOs, self-wake-up timer support for deep power-down recovery, I2C Fast-mode Plus capability on dedicated pins, and ROM-based APIs for ADC, SPI, and IAP firmware updates.

Technical Context

The LPC822M101JHI33E implements an ARM Cortex-M0+ core (r0p1) with single-cycle I/O, NVIC, and SysTick - all tightly integrated with a multi-layer AHB bus and APB peripherals. Its switch matrix enables dynamic assignment of USART, SPI, I2C, SCTimer, and ADC trigger functions to any non-power GPIO pin.

Peripheral subsystems include a 12-bit ADC sampling at up to 1.2 Msamples/s with dual conversion sequences, a state-configurable timer (SCTimer/PWM) supporting capture/match and PWM generation, four-channel MRT for fixed-rate interrupts, and a self-wake-up timer (WKT) operable from deep power-down using internal or external clock sources.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M0+ (r0p1), 30 MHz max - enables deterministic real-time control with low gate count and energy efficiency.
Memory 16 KB flash / 4 KB SRAM - sufficient for compact firmware with real-time ISR handling and sensor data buffering.
ADC 12-bit resolution, 12 input channels, 1.2 Msamples/s - supports high-fidelity analog sensing across multiple sensors without external muxing.
Timers SCTimer/PWM + 4-channel MRT + WKT + WWDT - provides flexible timing: event-triggered PWM, periodic interrupts, ultra-low-power wake-up, and safety-critical reset supervision.
I/O & Connectivity 29 GPIOs, 4× I2C (1× Fast-mode Plus), 3× USART, 2× SPI - enables rich peripheral interfacing with pin-function remapping via switch matrix.
Power 1.8–3.6 V supply, 90 µA/MHz active current (IRC clock), Deep power-down with wake-up on PIO0_4 or WKTCLKIN - optimized for battery-powered operation.
Package HVQFN33 (5 × 5 × 0.85 mm, 33-terminal) - surface-mount thermal-enhanced package suitable for space-constrained industrial and portable designs.

Pinout & Package

HVQFN33 package: plastic thermal-enhanced very thin quad flat package, no leads, 33 terminals, body size 5 × 5 × 0.85 mm. Pin 1 index area marked per Fig 5; exposed thermal pad (not electrically connected) recommended for PCB thermal relief.

Pin/Terminal Circuit Role Design Meaning
VDD (Pin 19) Core & I/O supply Primary 1.8–3.6 V power input; powers digital logic, analog peripherals, and I/O pad ring.
VSS (Pin 33) Digital ground Reference return path for core, peripherals, and GPIO; must be low-impedance connection to system GND plane.
PIO0_0/ACMP_I1/TDO Multi-function I/O Default GPIO; configurable as analog comparator input 1 or JTAG test data out (boundary scan only).
SWDIO/PIO0_2/TMS Debug interface Serial Wire Debug bidirectional I/O; default SWD mode enables programming and debug without JTAG overhead.
SWCLK/PIO0_3/TCK Debug clock Serial Wire Clock input; required for SWD communication and flash programming during development.
RESET/PIO0_5 Reset control Active-low external reset; 50 ns pulse triggers full device reset; can serve as GPIO if external reset not used.
PIO0_4/ADC_11/TRST/WAKEUP Wake-up trigger Dual-role pin: ADC input 11 or deep power-down wake-up source; LOW pulse ≥50 ns exits deep power-down.
PIO0_10/I2C0_SCL I2C clock True open-drain output; supports Fast-mode Plus (1 Mbit/s); requires external pull-up; high-current sink when enabled.
PIO0_11/I2C0_SDA I2C data True open-drain output; complements PIO0_10 for I2C0 bus; same electrical requirements and drive capability.
VREFP / VREFN (Pins 21/20) ADC reference Differential reference inputs for 12-bit ADC; VREFP ≤ VDD; enables precise ratiometric or absolute voltage measurements.

Key Features

Feature Design Value
Switch matrix I/O routing Dynamic assignment of USART/SPI/I2C/SCTimer/ADC trigger functions to any of 29 GPIO pins - eliminates fixed pin conflicts and simplifies PCB layout.
State Configurable Timer (SCTimer/PWM) Hardware-state-machine-based timer supporting complex PWM waveforms, input capture, match outputs, and event chaining - reduces CPU load in motor or lighting control.
ROM-based peripheral APIs Pre-validated drivers for ADC, SPI, I2C, USART, and integer division stored in on-chip ROM - accelerates firmware development and ensures consistent peripheral initialization.
Deep power-down wake-up Wakes from <1 µA retention state via PIO0_4 (external pin) or WKTCLKIN (external clock) - enables years-long battery life in sensor nodes.
High-current GPIO drivers 20 mA source on four pins, 20 mA sink on two true open-drain pins - directly drives LEDs, small relays, or logic-level MOSFETs without external buffers.

Applications

Smart Sensor Node Industrial Control Panel

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and CO₂ via analog and digital sensors.

IC Role / Device Role / Timing Role: Central MCU managing sensor polling, ADC conversions, I2C sensor reads, UART logging, and low-power sleep/wake cycles.

Use Value: 12-bit ADC with 12 channels and dual conversion sequences enables simultaneous multi-sensor acquisition; deep power-down with pin-triggered wake-up extends battery life beyond 5 years.

Use Scenario: Local HMI controller for HVAC or PLC sub-system with pushbuttons, LED indicators, and RS-485 communication.

IC Role / Device Role / Timing Role: Real-time I/O coordinator handling button debouncing, LED PWM dimming, and USART-to-RS485 translation.

Use Value: SCTimer/PWM generates flicker-free LED dimming waveforms; switch matrix routes USART to isolated transceiver pins; 29 GPIOs accommodate dense front-panel I/O.

Portable Medical Device Lighting Driver Module

Use Scenario: Handheld pulse oximeter with analog front-end, OLED display, and USB-C charging interface.

IC Role / Device Role / Timing Role: Signal acquisition MCU digitizing photodiode signals via ADC, computing SpO₂, driving display via SPI, and managing power states.

Use Value: On-chip comparator validates sensor signal integrity pre-ADC; ROM-based ADC API ensures repeatable sampling timing; 1.8–3.6 V operation matches Li-ion battery discharge curve.

Use Scenario: DALI-compliant LED driver with thermal monitoring, current regulation, and group dimming control.

IC Role / Device Role / Timing Role: DALI slave controller executing command parsing, PWM current control, and analog temperature feedback loop.

Use Value: Three USARTs support DALI physical layer, debug console, and optional secondary comms; high-current GPIOs drive MOSFET gates directly; I2C Fast-mode Plus interfaces with thermal sensors at 1 Mbit/s.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC824M201JHI33 32 KB flash / 8 KB SRAM / 29 GPIO / identical HVQFN33 package - doubles memory and retains all peripherals. Preferred where firmware complexity or data logging requires >16 KB code space or >4 KB RAM buffer. Select LPC824M201JHI33 when future firmware expansion or larger protocol stacks (e.g., BLE host stack) are anticipated.
LPC812M101JDH20 TSSOP20 package (20-pin), 16 KB flash / 4 KB SRAM, 16 GPIO, no WKTCLKIN pin, reduced I2C count (2×), 5-channel ADC. Suitable for cost-optimized, lower-I/O designs where thermal performance and pin count are less critical. Choose LPC812M101JDH20 only for space-tolerant, low-complexity applications where HVQFN33 assembly or 29 GPIOs are unnecessary.

Compared with LPC822M101JHI33E, LPC824M201JHI33 offers scalable memory headroom without layout change, while LPC812M101JDH20 trades pin count, timer flexibility, and ADC channel depth for lower unit cost and simpler packaging - making LPC822M101JHI33E the optimal balance of density, low-power capability, and peripheral richness in HVQFN33 form factor.

Availability

LPC822M101JHI33E is available at Aetrix Electronics and suitable for industrial control panels, portable medical devices, smart sensor nodes, and lighting driver modules requiring stable component supply across long production lifecycles.

Supply support for LPC822M101JHI33E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and mixed-signal integration.

The LPC800 series - including LPC822M101JHI33E - was designed for cost-sensitive, low-power embedded control applications demanding flexible I/O, robust analog peripherals, and simplified firmware development through ROM-based drivers.

FAQ

What is the maximum operating frequency of the LPC822M101JHI33E?

The LPC822M101JHI33E operates at a maximum CPU frequency of 30 MHz using its ARM Cortex-M0+ core. This speed is achievable with the internal 12 MHz RC oscillator (trimmed to ±1.5 %), external crystal (1–25 MHz), or PLL-locked system clock. The core's two-stage pipeline and single-cycle I/O ensure deterministic real-time response at this rate.

Does the LPC822M101JHI33E support in-application programming (IAP)?

Yes, the LPC822M101JHI33E supports In-Application Programming via on-chip ROM APIs. These validated routines enable safe flash page erasure and reprogramming while the application runs - essential for field firmware updates. The LPC822M101JHI33E also supports In-System Programming (ISP) via USART0 using the built-in boot loader.

How many ADC input channels does the LPC822M101JHI33E have, and what is its sampling rate?

The LPC822M101JHI33E integrates a 12-bit ADC with up to 12 input channels and supports sample rates of up to 1.2 Msamples/s. It features two independent conversion sequences, allowing concurrent acquisition of different channel groups - ideal for time-aligned sensor fusion in applications like motor control or environmental monitoring.

Can the LPC822M101JHI33E wake up from deep power-down mode using an external signal?

Yes, the LPC822M101JHI33E can wake from deep power-down mode via a LOW-going pulse ≥50 ns on PIO0_4 (labeled WAKEUP in pin description). This pin must be externally pulled HIGH before entering deep power-down. Alternatively, an external clock applied to PIO0_28 (WKTCLKIN) can trigger wake-up - both methods resume full operation within microseconds.

What debug interface does the LPC822M101JHI33E support, and are JTAG pins available?

The LPC822M101JHI33E supports Serial Wire Debug (SWD) by default on SWDIO (PIO0_2) and SWCLK (PIO0_3), enabling programming and real-time debugging with minimal pin count. JTAG signals (TDO, TDI, TCK, TMS, TRST) are only accessible in boundary scan mode and are not intended for standard debug use - SWD is the recommended and fully supported interface for development.

LPC822M101JHI33E Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VFQFN Exposed Pad
Series:
LPC82x
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
30MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC822M101JHI33E FAQ

1.How can I place an order for LPC822M101JHI33E through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC822M101JHI33E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC822M101JHI33E reliable?

The price and inventory of LPC822M101JHI33E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC822M101JHI33E is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC822M101JHI33E transactions.

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4.How is shipping managed for LPC822M101JHI33E?

LPC822M101JHI33E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC822M101JHI33E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC822M101JHI33E?

For technical support, including LPC822M101JHI33E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC822M101JHI33E requirements.

6.How does Aetrix verify that LPC822M101JHI33E is sourced from the original manufacturer or authorized distributors?

All LPC822M101JHI33E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC822M101JHI33E meets industry standards.

7.What is the process for return or replacement of LPC822M101JHI33E?

All LPC822M101JHI33E units undergo pre-shipment inspection (PSI). If there is an issue with LPC822M101JHI33E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC822M101JHI33E part is unused and in its original packaging.

Return procedure for LPC822M101JHI33E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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