NXP Semiconductors LPC834M101FHI33Y

Overview

LPC834M101FHI33Y from NXP Semiconductors is a 32-bit ARM Cortex-M0+ microcontroller operating at up to 30 MHz, featuring 32 KB flash, 4 KB SRAM, a 12-bit ADC with 12 input channels, and 29 GPIO pins. It integrates SCTimer/PWM, dual SPI, USART, I²C (Fast-mode Plus), DMA, and a switch matrix for flexible peripheral pin assignment - deployed in sensor gateways, portable devices, and industrial control systems.

For engineers reviewing the LPC834M101FHI33Y datasheet, LPC834M101FHI33Y pinout, LPC834M101FHI33Y application, or LPC834M101FHI33Y equivalent, key selection considerations include its HVQFN33 package, 1.8–3.6 V supply range, -40 °C to +85 °C operation, self-wake-up timer support, and configurable open-drain I²C pins with 1 Mbit/s capability.

Technical Context

The LPC834M101FHI33Y implements an ARM Cortex-M0+ core (r0p1) with single-cycle I/O access and a two-stage pipeline, tightly coupled to a 32-interrupt NVIC supporting four priority levels. Its clock system includes a 12 MHz ±1.5% internal RC oscillator, programmable PLL, and selectable external crystal (1–25 MHz) or watchdog oscillator (9.4 kHz–2.3 MHz).

Peripheral routing is managed by a hardware switch matrix enabling dynamic assignment of USART, SPI, I²C, SCTimer/PWM, and ADC trigger functions to any non-power/non-ground GPIO pin (PIO0_0 to PIO0_28), while fixed functions like XTALIN/XTALOUT, RESET, SWDIO/SWCLK, and WAKEUP remain bound to dedicated terminals.

Key Specifications

Pinout & Package

HVQFN33 package: 5 mm × 5 mm body, 0.85 mm height, 33-terminal layout with exposed thermal pad (pin 33 = VSS). Pin 1 index located at top-left corner per JEDEC MO-220.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC832M101FDH20, the LPC834M101FHI33Y delivers 100% more flash, +81% GPIO count, and full 12-channel ADC support in a smaller HVQFN33 package; versus STM32G031K8T6, it trades flash size for unique switch-matrix flexibility that reduces PCB complexity in multi-interface designs.

Availability

LPC834M101FHI33Y is available at Aetrix Electronics and suitable for sensor gateways, portable wearables, and industrial control panels requiring stable component supply across long-lifecycle deployments.

Supply support for LPC834M101FHI33Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The LPC83x product line delivers cost-optimized, low-power ARM Cortex-M0+ MCUs with advanced peripheral routing and power management - designed specifically for resource-constrained edge nodes and smart peripherals.

FAQ

What is the maximum operating frequency of the LPC834M101FHI33Y?

The LPC834M101FHI33Y operates at a maximum CPU frequency of 30 MHz using its ARM Cortex-M0+ core. This speed is achievable with the internal 12 MHz RC oscillator (via PLL), external crystal (1–25 MHz), or external clock source. The core's two-stage pipeline and single-cycle multiplier ensure deterministic real-time performance at this rate.

Does the LPC834M101FHI33Y support in-application programming (IAP)?

Yes, the LPC834M101FHI33Y supports Flash In-Application Programming (IAP) through its on-chip ROM API. This allows firmware updates without halting execution, enabling field upgrades and bootloader implementations. IAP commands include page erase and program operations, fully compatible with the 32 KB flash memory's 64-byte page architecture.

How many ADC channels does the LPC834M101FHI33Y have, and what is its sampling rate?

The LPC834M101FHI33Y integrates a 12-bit ADC with up to 12 input channels and a maximum sampling rate of 1.2 Msamples/s. It supports two independent conversion sequences and multiple trigger sources, including internal timers and external GPIO pins - making it suitable for synchronized multi-sensor acquisition in industrial monitoring.

What package type is used for the LPC834M101FHI33Y?

The LPC834M101FHI33Y uses the HVQFN33 package: a 5 mm × 5 mm, 0.85 mm-thick plastic thermal-enhanced quad flat no-lead package with 33 terminals and an exposed thermal pad (pin 33 = VSS). This package offers superior thermal performance and board density compared to TSSOP alternatives.

Can the LPC834M101FHI33Y wake up from Deep power-down mode using an external signal?

Yes, the LPC834M101FHI33Y can wake up from Deep power-down mode via a LOW-going pulse on PIO0_4 (WAKEUP pin), with minimum pulse width of 50 ns. This pin remains active in Deep power-down mode and must be externally pulled HIGH before entering the mode. Alternatively, an external clock applied to PIO0_28 (WKTCLKIN) also triggers wake-up.