My Inquiry
My Account
NXP Semiconductors LS1012ASN7HKB
- Part No.:
- LS1012ASN7HKB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 211-VFLGA
- Datasheet:
-
LS1012ASN7HKB.pdf
- Description:
- IC MPU QORIQ 800MHZ 211FCLGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,170
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LS1012ASN7HKB from NXP is a 64-bit Arm Cortex-A53 communications processor in a 9.6 × 9.6 mm FC-BGA-289 package, operating up to 1 GHz with 256 KB coherent L2 cache, ECC-protected L1/L2 caches, and hardware-accelerated packet forwarding (2 Gbit/s IP forwarding at near-zero CPU load) for fanless IoT gateways and battery-powered NAS devices.
For engineers reviewing the LS1012ASN7HKB datasheet, LS1012ASN7HKB pinout, LS1012ASN7HKB application, or LS1012ASN7HKB equivalent, key selection criteria include its 1 W typical power envelope, integrated PFE offload engine, TrustZone-enabled secure boot, DDR3L memory controller support, and SerDes-configurable dual Gigabit Ethernet + PCIe 2.0 + SATA 3.0 connectivity.
Technical Context
The LS1012ASN7HKB integrates a single-core Arm Cortex-A53 with NEON SIMD and dual-precision FPU, backed by 32 KB L1-I/D caches and 256 KB coherent L2 cache-all ECC-protected. It implements CoreLink CCI-400 interconnect and QorIQ Trust Architecture with Arm TrustZone for secure boot and runtime isolation.
Its three-lane 6 GHz multi-protocol SerDes dynamically configures two GbE MACs, one PCIe 2.0 x1 port, and one SATA 3.0 controller. The Packet Forwarding Engine (PFE) handles full-line-rate 2 Gbit/s IPv4/IPv6 forwarding independent of CPU execution, reducing latency and thermal load in embedded networking edge nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single 64-bit Arm Cortex-A53 @ up to 1 GHz; enables Linux-based real-time control with NEON/FPU for signal processing. |
| L2 Cache | 256 KB coherent, ECC-protected; ensures data integrity and cache coherency across accelerators and peripherals. |
| Memory Interface | 16-bit DDR3L @ 1 GHz; supports low-power, cost-optimized memory subsystems for fanless designs. |
| Packet Engine | Hardware PFE delivering 2 Gbit/s IP forwarding with <1% CPU utilization; eliminates software stack bottlenecks in routing/NAS. |
| Security | Arm TrustZone + QorIQ Trust Architecture + secure boot; provides hardware-enforced isolation and cryptographic root-of-trust. |
| Connectivity | Configurable SerDes: dual GbE MACs, PCIe 2.0 x1, SATA 3.0; enables flexible I/O partitioning without external switches. |
| Power | 1 W typical at full operation; allows passive cooling and extended battery life in mobile NAS and industrial gateways. |
Pinout & Package
LS1012ASN7HKB uses a 289-ball Fine-Pitch Ball Grid Array (FC-BGA) package with 0.8 mm ball pitch, optimized for 4-layer PCB layouts. Pin assignment follows NXP's LS1012A Reference Manual (Document Number: LS1012AFS REV 0), with dedicated balls for DDR3L DQ/DQS, SerDes differential pairs, GbE MDI, PCIe/SATA reference clocks, and TrustZone-secured JTAG.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | DDR3L I/O supply | 1.35 V regulated rail; must be sequenced before VDD_CORE to meet JEDEC DDR3L startup timing. |
| CLKIN | SerDes reference clock input | 100 MHz differential LVDS input; required for PCIe/SATA/GbE PHY lock and frequency synthesis. |
| MDIO/MDC | PHY management interface | Shared bus for configuring dual GbE PHYs; supports IEEE 802.3 clause 22/45 register access. |
| TRST_B | Secure debug reset | Active-low TrustZone debug disable; assertion prevents JTAG access when secure boot is active. |
| SD_DATA0–3 | eMMC/SDIO data bus | 4-bit bidirectional data path; supports HS200 mode for NAND-like throughput in storage applications. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Packet Forwarding Engine (PFE) | Offloads IPv4/IPv6 forwarding, ACL, NAT, and QoS scheduling-enabling 2 Gbit/s line rate with sub-10 µs latency and no CPU intervention. |
| ECC-Protected Memory Subsystem | L1/L2 caches and DDR3L controller include full ECC detection/correction-critical for unattended industrial deployments requiring >10-year MTBF. |
| TrustZone + Secure Boot | Immutable root-of-trust chain from ROM to OS; prevents unauthorized firmware loading and enforces runtime memory partitioning between trusted and normal worlds. |
| Multi-Protocol SerDes | Single 3-lane SerDes bank configurable as GbE+GbE, GbE+PCIe, or GbE+SATA-reducing BOM count and PCB layer count vs. discrete PHY solutions. |
| Low-Power DDR3L Support | 16-bit interface at 1 GHz data rate with on-die termination and dynamic power gating-cuts memory subsystem power by ~35% vs. standard DDR3. |
Applications
| Trust-Enabled IoT Gateway | Mobile NAS (Battery Powered) |
|---|---|
Use Scenario: Edge gateway aggregating Zigbee/Z-Wave sensors and forwarding encrypted telemetry to cloud via TLS 1.3. IC Role / Device Role / Timing Role: Main application processor executing Linux with PFE handling encrypted IP tunneling and firewall rules. Use Value: TrustZone isolates sensor data ingestion from cloud comms; PFE maintains 2 Gbit/s throughput while CPU idles at 100 MHz to extend battery life. | Use Scenario: Portable NAS unit with dual 2.5″ SATA drives, USB 3.0 host, and Wi-Fi 5 (802.11ac) module interfacing via PCIe. IC Role / Device Role / Timing Role: Central SoC managing storage I/O, network stack, and power-aware scheduler for battery conservation. Use Value: Integrated SATA 3.0 + PCIe 2.0 eliminates bridge chips; 1 W typical power enables 8+ hours runtime on 10,000 mAh battery pack. |
| Entry-Level Broadband Gateway | Factory Automation Controller |
Use Scenario: Residential DSL/fiber CPE device supporting VoIP, IPTV, and QoS-governed triple-play traffic. IC Role / Device Role / Timing Role: Communications processor running OpenWrt with hardware-accelerated QoS and VLAN tagging. Use Value: PFE applies per-flow QoS policies at wire speed; DDR3L + ECC ensures stable operation during sustained 100% upstream load. | Use Scenario: DIN-rail mounted PLC edge node collecting Modbus TCP data from field devices and publishing to MQTT broker over TLS. IC Role / Device Role / Timing Role: Real-time Linux host with deterministic Ethernet I/O and secure OTA update capability. Use Value: Secure boot validates firmware signatures; dual GbE ports enable redundant ring topology with <10 ms failover via PFE-assisted link monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LS1023ASN7QQB | Dual Cortex-A53 cores, 1.2 GHz max, 512 KB L2 cache, same PFE and Trust Architecture. | Higher throughput for multi-service CPE; requires additional thermal margin and DDR3L bandwidth. | Select when >2 Gbit/s aggregate forwarding or concurrent virtualized services are required. |
| i.MX8M Mini Quad | Quad Cortex-A53, no hardware PFE, relies on software forwarding; includes GPU/VPU but lower security assurance. | Better multimedia support; lacks PFE acceleration and TrustZone-certified secure boot chain. | Select for UI-rich HMI gateways where packet forwarding is secondary to display/audio processing. |
Compared with LS1023ASN7QQB, the LS1012ASN7HKB trades core count and cache size for lower power and smaller footprint-ideal for space-constrained, thermally limited edge nodes. Against i.MX8M Mini Quad, it delivers superior deterministic packet forwarding and certified security, at the expense of graphics capability.
Availability
LS1012ASN7HKB is available at Aetrix Electronics and suitable for trust-enabled IoT gateways, mobile NAS systems, and entry-level broadband Ethernet gateways requiring stable component supply, long-term lifecycle support, and verified industrial temperature grade availability.
Supply support for LS1012ASN7HKB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based processors and trusted execution environments.
The LS1012ASN7HKB belongs to NXP's Layerscape LS series-designed specifically for ultra-low-power, high-integration embedded networking applications where security, packet acceleration, and thermal efficiency are non-negotiable.
FAQ
What is the maximum operating temperature rating for LS1012ASN7HKB?
The LS1012ASN7HKB is qualified for industrial temperature range (–40°C to +105°C case temperature) per NXP's LS1012A datasheet (Rev 0). Thermal design must maintain junction temperature ≤125°C under worst-case 1 W typical power dissipation, using the specified 289-ball FC-BGA thermal pad layout and recommended copper pour.
Does LS1012ASN7HKB support PCIe Gen3?
No, LS1012ASN7HKB supports only PCIe Gen2.0 (5 GT/s) via its configurable SerDes lane. The SerDes architecture does not implement Gen3 equalization or 8 GT/s signaling; attempting Gen3 configuration results in link training failure. PCIe Gen2 remains sufficient for SATA 3.0 and single-lane GbE bridging.
Can LS1012ASN7HKB boot directly from QuadSPI flash without external ROM?
Yes, LS1012ASN7HKB supports QuadSPI boot mode with internal ROM bootloader that initializes the SerDes, DDR3L controller, and PFE before loading firmware. Boot configuration pins (BOOT_CFG[3:0]) must be set to 0x01 for QuadSPI master mode, and flash must contain valid IVT header and signed image per NXP's Secure Boot documentation.
Is the PFE in LS1012ASN7HKB programmable for custom packet inspection?
No, the PFE in LS1012ASN7HKB is a fixed-function hardware accelerator supporting predefined operations: IPv4/IPv6 forwarding, ACL lookup, NAT translation, and basic QoS scheduling. It does not support microcode updates or user-defined parsing logic-unlike NXP's higher-tier DPAA2 engines.
What DDR3L memory density is supported by LS1012ASN7HKB?
LS1012ASN7HKB supports DDR3L SDRAM densities from 512 MB to 4 GB using x16 organization. The memory controller implements JEDEC-standard LPDDR3L timing parameters and requires external termination resistors matched to 40 Ω for optimal signal integrity at 1 GHz data rate.
LS1012ASN7HKB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 211-VFLGA
- Series:
- QorIQ® Layerscape
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR3L
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- GbE (2)
- SATA:
- SATA 6Gbps (1)
- USB:
- USB 2.0 (1), USB 3.0 + PHY
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Security Features:
- Secure Boot, TrustZone®
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 211-FCLGA (9.6x9.6)
- Additional Interfaces:
- -
LS1012ASN7HKB FAQ
1.How can I place an order for LS1012ASN7HKB through Aetrix?
Please submit a Request for Quotation (RFQ) for LS1012ASN7HKB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LS1012ASN7HKB reliable?
The price and inventory of LS1012ASN7HKB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LS1012ASN7HKB is usually 5 days.
3.What payment methods are accepted for LS1012ASN7HKB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LS1012ASN7HKB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LS1012ASN7HKB?
LS1012ASN7HKB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LS1012ASN7HKB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LS1012ASN7HKB?
For technical support, including LS1012ASN7HKB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LS1012ASN7HKB requirements.
6.How does Aetrix verify that LS1012ASN7HKB is sourced from the original manufacturer or authorized distributors?
All LS1012ASN7HKB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LS1012ASN7HKB meets industry standards.
7.What is the process for return or replacement of LS1012ASN7HKB?
All LS1012ASN7HKB units undergo pre-shipment inspection (PSI). If there is an issue with LS1012ASN7HKB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LS1012ASN7HKB part is unused and in its original packaging.
Return procedure for LS1012ASN7HKB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LS1012ASN7HKB Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
