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NXP Semiconductors LS1017AXN7PQA
- Part No.:
- LS1017AXN7PQA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 448-BFBGA
- Datasheet:
-
LS1017AXN7PQA.pdf
- Description:
- LAYERSCAPE 64-BIT ARM CORTEX-A72
- Quantity:
- Payment:
- Shipping:
Inventory:3,609
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Product details
Overview
LS1017AXN7PQA from NXP Semiconductors is a single-core 64-bit ARM Cortex-A72 system-on-chip (SoC) operating up to 1.5 GHz, featuring 48KB L1 instruction cache, 32KB L1 data cache with ECC, and 1MB shared L2 cache with ECC. It integrates a DDR3L/DDR4 memory controller (1.6 GT/s), TSN-capable Ethernet switch, dual CAN-FD modules, and SerDes lanes supporting PCIe 3.0, SATA 3, and multiple SGMII/2.5G-SGMII interfaces for industrial gateway applications.
For engineers reviewing the LS1017AXN7PQA datasheet, LS1017AXN7PQA pinout, LS1017AXN7PQA application, or LS1017AXN7PQA equivalent, key selection considerations include its FC-PBGA 448-ball package, 1.5 GHz single-core performance, DDR4/ECC memory support, TSN Ethernet timing precision, and compatibility with Linux-based real-time industrial control stacks.
Technical Context
The LS1017AXN7PQA implements a single ARM Cortex-A72 core with coherent interconnect (CCI-400) operating at up to 400 MHz, enabling cache coherency across subsystems. Its memory subsystem supports 16/32-bit DDR3L/DDR4 with on-die ECC and 1.6 GT/s data rates, while the integrated SerDes engine delivers four configurable high-speed lanes for mixed-interface use - including two PCIe 3.0 controllers, one SATA 6 Gbit/s controller, and up to four 2.5G-SGMII ports.
Networking functionality centers on a TSN-capable Ethernet switch with four external ports and an ENETC controller supporting IEEE 1588 v2 and IEEE 1722, plus RGMII and SerDes-based 1G/2.5G interfaces. Peripheral integration includes two eSDHC controllers (eMMC 5.1), eight I²C buses, six LPUARTs, two CAN-FD modules, FlexSPI, and qDMA/eDMA engines - all managed via a Generic Interrupt Controller (GIC) and Thermal Monitor Unit (TMU).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single 64-bit ARM Cortex-A72 core, up to 1.5 GHz clock speed |
| L1 Cache | 48KB instruction + 32KB data cache, both with ECC protection |
| L2 Cache | 1MB unified cache with ECC, shared across core and subsystems |
| Memory Interface | 16/32-bit DDR3L/DDR4 controller with ECC, 1.6 GT/s data rate |
| SerDes Capabilities | Four lanes supporting PCIe 3.0 ×2, SATA 3, SGMII ×4, 2.5G-SGMII ×4, QSGMII, and 10G-SXGMII |
| Ethernet | TSN-switch with four external ports + ENETC controller supporting IEEE 1588 v2 and IEEE 1722 |
| Peripheral Integration | Dual CAN-FD, two eSDHC (eMMC 5.1), eight I²C, six LPUART, FlexSPI, qDMA/eDMA, GIC, TMU |
Pinout & Package
LS1017AXN7PQA uses a 448-ball Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) package measuring 17 mm × 17 mm with 0.8 mm ball pitch. The package supports thermal dissipation via exposed thermal pad and is designed for industrial temperature range operation (–40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1_MA00–D1_MA13 | DDR Address Bus | 14-bit address lines for DDR3L/DDR4 memory addressing |
| D1_MDQ00–D1_MDQ31 | DDR Data Bus | 32-bit bidirectional data path with ECC parity bits D1_MECC0–D1_MECC3 |
| D1_MCK0/D1_MCK0_B | DDR Clock Pair | Differential clock input driving DDR interface timing at up to 800 MHz |
| IIC1_SCL/IIC1_SDA | I²C Bus 1 | Open-drain serial interface for system configuration and PMIC communication |
| SDHC1_CLK/SDHC1_CMD | eSDHC1 Interface | Command/data/control signals for SD/eMMC 5.1 storage with clock synchronization support |
| EC1_RXD0–EC1_TXD3 | Ethernet Controller Port | Four-lane RGMII-compatible interface for 1G/2.5G TSN Ethernet connectivity |
Key Features
| Feature | Design Value |
|---|---|
| ARM TrustZone Security | Hardware-enforced isolation between secure and non-secure worlds for firmware authentication and key management |
| ECC Protection | End-to-end error correction on L1/L2 caches and DDR interface, enabling reliable operation in industrial environments |
| TSN Support | IEEE 802.1AS time synchronization, 802.1Qbv time-aware shaping, and 802.1Qci ingress policing for deterministic networking |
| FlexSPI Interface | Configurable octal/xSPI interface supporting XIP execution from external flash without CPU intervention |
| Thermal Monitoring | On-die temperature diode and TMU providing real-time thermal feedback for dynamic frequency scaling and fan control |
Applications
| Industrial Gateway | Time-Sensitive Networking Node |
|---|---|
Use Scenario: Edge device aggregating Modbus TCP, PROFINET, and EtherCAT fieldbus traffic into unified IP backbone. IC Role / Device Role / Timing Role: Central SoC executing real-time Linux, managing protocol translation, and synchronizing multi-vendor devices via IEEE 1588. Use Value: Single-chip integration eliminates external switch/FPGA, while TSN hardware offloads timing-critical packet scheduling from CPU. | Use Scenario: Deterministic Ethernet node in automotive test bench or power substation automation. IC Role / Device Role / Timing Role: ENETC controller and TSN switch provide sub-microsecond timestamping and scheduled traffic shaping per IEEE 802.1Qbv. Use Value: Hardware-accelerated time-aware shaper ensures guaranteed latency for safety-critical control loops without software jitter. |
| Secure Embedded Appliance | Multi-Protocol Industrial Router |
Use Scenario: Firewall/NAT appliance for factory floor networks requiring secure boot and runtime integrity verification. IC Role / Device Role / Timing Role: ARM TrustZone isolates secure monitor, bootloader, and crypto engine; Secure Boot validates signed firmware images. Use Value: Tamper-resistant root of trust prevents unauthorized firmware updates and protects cryptographic keys in SRAM-based security engine. | Use Scenario: DIN-rail mounted router connecting legacy RS-485 sensors, wireless LoRaWAN gateways, and cloud MQTT brokers. IC Role / Device Role / Timing Role: Dual CAN-FD interfaces handle fieldbus bridging; eSDHC2 manages local logging; USB 3.0 enables high-speed diagnostics. Use Value: Integrated CAN-FD + USB 3.0 + eMMC 5.1 eliminates discrete transceivers and external storage, reducing BOM count by 7 components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LS1027AXN7PQA | Dual-core Cortex-A72, identical peripheral set, higher thermal envelope (12 W vs. 9 W) | Better multi-threaded throughput for containerized edge AI inference workloads | Select when >1.2 GHz sustained dual-core performance and additional cache bandwidth are required |
| i.MX8M Mini (NXP) | Quad-core Cortex-A53, no TSN switch, no SerDes, lower DDR bandwidth (1.2 GT/s), no CAN-FD | Cost-sensitive HMI/media applications where deterministic networking is not needed | Choose for multimedia-rich UIs with GPU acceleration but no industrial real-time requirements |
Compared with LS1027AXN7PQA, the LS1017AXN7PQA offers optimized single-core efficiency and lower power for deterministic control tasks, while the i.MX8M Mini trades TSN and SerDes capability for multimedia features - making LS1017AXN7PQA the only option supporting hardware-synchronized industrial Ethernet without external PHYs or switches.
Availability
LS1017AXN7PQA is available at Aetrix Electronics and suitable for industrial gateways, TSN-enabled automation systems, and secure embedded routers requiring stable component supply over extended product lifecycles.
Supply support for LS1017AXN7PQA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based processing and real-time networking.
The LS1017A product line targets cost-optimized, power-efficient industrial edge computing, delivering deterministic networking, functional safety readiness, and long-term availability for mission-critical infrastructure.
FAQ
What is the maximum operating frequency of the LS1017AXN7PQA processor core?
The LS1017AXN7PQA features a single ARM Cortex-A72 core rated for up to 1.5 GHz operation under specified thermal and voltage conditions. This frequency is achievable with proper PCB layout, thermal management, and power delivery design per NXP's recommended operating conditions in the LS1027A/LS1017A datasheet Rev. 0.
Does the LS1017AXN7PQA support DDR4 memory with ECC?
Yes, the LS1017AXN7PQA integrates a 16/32-bit DDR3L/DDR4 memory controller with full ECC support on both data and address paths. ECC operates transparently for single-bit error correction and double-bit error detection, validated per JEDEC standards and documented in Section 3.9 of the LS1027A/LS1017A datasheet.
How many CAN-FD interfaces does the LS1017AXN7PQA include?
The LS1017AXN7PQA includes two Controller Area Network (CAN) modules, both supporting Flexible Data-Rate (CAN-FD) per ISO 11898-1:2015. These are implemented as dedicated peripherals with independent message RAM, filtering, and bit-rate configuration - confirmed in the "Additional peripheral interfaces" section of the LS1027A/LS1017A datasheet.
Is the LS1017AXN7PQA pin-compatible with the LS1027AXN7PQA?
No, the LS1017AXN7PQA and LS1027AXN7PQA share the same FC-PBGA 448-ball package and mechanical footprint, but they are not pin-compatible due to differences in SerDes lane allocation, power domain routing, and certain peripheral signal assignments. Board redesign is required when migrating between the two, as detailed in NXP's migration advisory documentation.
What Ethernet standards does the LS1017AXN7PQA TSN switch support?
The LS1017AXN7PQA TSN switch supports IEEE 802.1AS (time synchronization), 802.1Qbv (time-aware shaper), 802.1Qci (per-stream filtering and policing), and 802.1Qbu (frame preemption). These capabilities are implemented in hardware and verified in the ENETC controller block, enabling sub-microsecond timing accuracy for industrial control applications.
LS1017AXN7PQA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 448-BFBGA
- Series:
- QorIQ® Layerscape
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A72
- Number of Cores/Bus Width:
- 1 Core, 64-Bit
- Speed:
- 1.5GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- -
- Ethernet:
- 1Gbps (1), 2.5Gbps (5)
- SATA:
- SATA 6Gbps (1)
- USB:
- USB 3.0 (2)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Secure Boot, TrustZone®
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 448-FBGA (17x17)
- Additional Interfaces:
- CANbus, I2C, SPI, UART
LS1017AXN7PQA FAQ
1.How can I place an order for LS1017AXN7PQA through Aetrix?
Please submit a Request for Quotation (RFQ) for LS1017AXN7PQA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LS1017AXN7PQA reliable?
The price and inventory of LS1017AXN7PQA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LS1017AXN7PQA is usually 5 days.
3.What payment methods are accepted for LS1017AXN7PQA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LS1017AXN7PQA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LS1017AXN7PQA?
LS1017AXN7PQA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LS1017AXN7PQA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LS1017AXN7PQA?
For technical support, including LS1017AXN7PQA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LS1017AXN7PQA requirements.
6.How does Aetrix verify that LS1017AXN7PQA is sourced from the original manufacturer or authorized distributors?
All LS1017AXN7PQA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LS1017AXN7PQA meets industry standards.
7.What is the process for return or replacement of LS1017AXN7PQA?
All LS1017AXN7PQA units undergo pre-shipment inspection (PSI). If there is an issue with LS1017AXN7PQA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LS1017AXN7PQA part is unused and in its original packaging.
Return procedure for LS1017AXN7PQA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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