NXP Semiconductors LS1023ACE9MQB

Overview

LS1023ACE9MQB from NXP Semiconductors is a dual-core 64-bit Arm® Cortex®-A53 system-on-chip (SoC) operating up to 1.2 GHz, featuring 1 MB L2 cache with ECC, DDR4/DDR3L memory controller supporting up to 1.6 GT/s, and integrated Data Path Acceleration Architecture (DPAA) for packet classification and crypto acceleration. It targets industrial gateways and secure edge networking appliances requiring deterministic real-time performance and hardware-enforced trust.

For engineers reviewing the LS1023ACE9MQB datasheet, LS1023ACE9MQB pinout, LS1023ACE9MQB application, or LS1023ACE9MQB equivalent, this page delivers verified technical context, validated pin functions, confirmed package mapping, and rigorously cross-checked alternative options - all derived exclusively from NXP's official LS1043A/LS1023A Rev. 5 datasheet and ordering documentation.

Technical Context

The LS1023ACE9MQB implements a hierarchical CCI-400™ coherency fabric enabling hardware-managed cache coherency across its two Cortex-A53 cores and DPAA accelerators (FMan, QMan, BMan, SEC). Its SerDes subsystem provides four lanes configurable as PCIe 2.0 x4, SATA 3.0, SGMII (1G/2.5G), or XFI (10G), while the DDR controller supports ECC, interleaving, and 32-bit bus width.

It integrates a QUICC Engine supporting TDM/HDLC, three USB 3.0 controllers with PHYs, eSDHC supporting SD 3.0/eMMC 4.5, and a comprehensive I/O set including six LPUARTs, four I²C, eight FlexTimers, and Trust Architecture for secure boot and runtime integrity - all mapped to a 621-ball FC-PBGA (21×21 mm) package with defined power domains (G1VDD, OVDD, DVDD, EVDD).

Key Specifications

Pinout & Package

LS1023ACE9MQB uses a 621-ball Fine-Pitch Ball Grid Array (FC-PBGA) package with 21×21 mm body size and 0.8 mm ball pitch. The package complies with JEDEC MO-270AB, features thermal lid, and is optimized for industrial temperature range (–40°C to +105°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar networking SoC applications.

Compared with LS1043ACE7MQB, LS1023ACE9MQB trades core count and peak bandwidth for lower power and smaller footprint - ideal for space-constrained, thermally limited industrial gateways. Versus i.MX 8M Plus, it delivers superior deterministic packet processing but lacks media acceleration, making it unsuitable for camera encoding without external ASICs.

Availability

LS1023ACE9MQB is available at Aetrix Electronics and suitable for industrial gateways, secure wireless access points, and smart energy concentrators requiring stable component supply across extended product lifecycles.

Supply support for LS1023ACE9MQB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with annual revenue exceeding $11 billion and operations in 30+ countries.

The LS1023A product line delivers cost-optimized, power-efficient Arm-based SoCs for edge networking - designed specifically for industrial gateways, secure routers, and protocol-converged infrastructure where reliability, security, and real-time determinism are non-negotiable.

FAQ

What is the maximum DDR4 data rate supported by LS1023ACE9MQB?

LS1023ACE9MQB supports DDR4/DDR3L memory at up to 1.6 GT/s, corresponding to DDR4-3200 (1600 MHz clock) with 32-bit bus width. This enables sustained memory bandwidth of 6.4 GB/s, sufficient for concurrent packet buffering, crypto operations, and application execution in edge networking workloads. The controller includes ECC, address parity, and on-die termination calibration for robust operation in industrial environments.

Does LS1023ACE9MQB include hardware cryptographic acceleration?

Yes, LS1023ACE9MQB integrates the Security Engine (SEC) block within its Data Path Acceleration Architecture (DPAA). This dedicated hardware accelerator supports AES-128/192/256 (ECB/CBC/CTR/GCM), SHA-1/224/256/384/512, RSA up to 4096-bit, and elliptic curve cryptography (NIST P-256/P-384). It delivers >1 Gbps IPsec throughput with zero CPU utilization, enabling wire-speed encrypted tunneling for industrial VPNs and secure cloud backhaul.

What package type and ball count does LS1023ACE9MQB use?

LS1023ACE9MQB uses a 621-ball Fine-Pitch Ball Grid Array (FC-PBGA) package with 21×21 mm body size and 0.8 mm ball pitch. This package is documented in NXP's LS1043A/LS1023A datasheet Rev. 5 (June 2021) and conforms to JEDEC MO-270AB. It includes thermal lid and is qualified for industrial temperature range (–40°C to +105°C), with explicit pinout definitions for DDR, SerDes, USB, and Ethernet interfaces.

Can LS1023ACE9MQB support IEEE 1588 Precision Time Protocol?

Yes, LS1023ACE9MQB supports IEEE 1588-2008 (PTPv2) through its integrated Ethernet controllers (EC1/EC2). Each RGMII interface includes timestamping logic for ingress/egress packet capture with sub-10 ns resolution, synchronized to the internal 125 MHz reference clock. The QUICC Engine also provides hardware-assisted PTP event message handling, enabling transparent clock and boundary clock implementations for industrial automation time synchronization.

What is the role of the QUICC Engine in LS1023ACE9MQB?

The QUICC Engine in LS1023ACE9MQB is a programmable RISC-based coprocessor dedicated to time-sensitive serial protocols. It natively supports TDM (E1/T1), HDLC, and UART framing with sub-microsecond jitter, enabling deterministic communication with legacy industrial fieldbus devices (e.g., PROFIBUS, Modbus RTU over RS-485). Unlike general-purpose CPU cores, it operates independently with guaranteed latency, freeing the Cortex-A53 cores for higher-layer protocol stacks and application logic.