NXP Semiconductors LS1023ACE9PQB
- Part No.:
- LS1023ACE9PQB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 780-BFBGA, FCBGA
- Datasheet:
-
LS1023ACE9PQB.pdf
- Description:
- LAYERSCAPE 64-BIT ARM CORTEX-A53
- Quantity:
- Payment:

- Shipping:

Inventory:1,740
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LS1023ACE9PQB from NXP Semiconductors is a dual-core 64-bit Arm® Cortex®-A53 communications processor operating up to 1.2 GHz, featuring 1 MB L2 cache with ECC, DDR3L/DDR4 memory controller (1.6 GT/s), Data Path Acceleration Architecture (DPAA), and integrated security engine (SEC). It delivers deterministic packet processing for industrial gateways and secure edge routers.
For engineers reviewing the LS1023ACE9PQB datasheet, LS1023ACE9PQB pinout, LS1023ACE9PQB application, or LS1023ACE9PQB equivalent, this page provides verified technical context, validated pin functions, real-world use cases in time-sensitive networking and secure IoT edge nodes, and confirmed alternative SoCs with documented interface compatibility.
Technical Context
The LS1023ACE9PQB implements a hierarchical CCI-400™ coherency fabric connecting two Cortex-A53 cores, L2 cache, DPAA accelerators (FMan, QMan, BMan, SEC), and peripheral controllers. Its SerDes lanes support configurable high-speed interfaces including SGMII (1 GbE/2.5 GbE), PCIe 2.0 x4, SATA 3.0, and QSGMII - all programmable via RCW configuration.
It integrates a 32-bit DDR3L/DDR4 memory controller with ECC, interleaving, and 1.6 GT/s data rate; dual DUARTs and six LPUARTs with hardware flow control; and TrustZone-enabled secure boot with fused key storage. IEEE 1588v2 timestamping is implemented in hardware across Ethernet MACs for sub-microsecond synchronization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 64-bit Arm Cortex-A53, up to 1.2 GHz - enables real-time Linux RTOS execution with low power envelope. |
| L2 Cache | 1 MB unified I/D cache with ECC - ensures data integrity in industrial environments with radiation-induced bit flips. |
| Memory Interface | 32-bit DDR3L/DDR4 controller, 1.6 GT/s, ECC & interleaving - supports 8 GB addressable RAM with error correction for mission-critical uptime. |
| DPAA Acceleration | FMan, QMan, BMan, SEC - offloads packet parsing, queue management, buffer allocation, and AES-GCM/SHA acceleration from CPU. |
| Ethernet Interfaces | Up to two RGMII + four SGMII (1 GbE) or two SGMII (2.5 GbE) - enables multi-port industrial switch or router with IEEE 1588v2 PTP support. |
| SerDes Configuration | Four-lane 10 GHz SerDes supporting PCIe 2.0 x4, SATA 3.0, QSGMII, or XFI - allows flexible expansion without external PHYs. |
| Security | Arm TrustZone, SEC v3.0, secure boot with OTP fuses - meets IEC 62443-3-3 SL2 requirements for embedded industrial security. |
Pinout & Package
LS1023ACE9PQB uses a 621-ball FC-PBGA package (21 mm × 21 mm, 0.8 mm pitch) with thermal lid. Ball map follows LS1023A 21×21 layout per NXP DS Rev. 5 (2021), compatible with LS1043A pinout family but with reduced core count and SerDes lane count.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1_MA00–D1_MA15 | DDR Address Bus | 16-bit row/column address lines for DDR3L/DDR4 SDRAM - requires matched trace length and controlled impedance routing. |
| D1_MDQ00–D1_MDQ31 | DDR Data Bus | 32-bit bidirectional data path with DQS strobes - supports burst transfers at 1.6 GT/s with on-die termination control. |
| IFC_AD00–IFC_AD15 | Flash Controller Data/Address | Multiplexed 16-bit bus for NAND/NOR flash or QuadSPI - enables boot-from-flash with hardware ECC and wear leveling. |
| EC1_TXD0–EC1_RXD3 | SGMII Ethernet PHY Interface | Four-lane differential pair for 1 GbE MAC-to-PHY connection - supports IEEE 802.3z with auto-negotiation and energy detection. |
| USB3_D_P / USB3_D_M | USB 3.0 Differential Data | SuperSpeed USB 3.0 interface with integrated PHY - enables high-bandwidth host/device connectivity without external transceivers. |
Key Features
| Feature | Design Value |
|---|---|
| DPAA Hardware Offload | FMan parses/classifies packets at line rate; QMan manages 8K queues with priority scheduling - reduces CPU load by >70% in firewall applications. |
| IEEE 1588v2 Hardware Timestamping | Sub-50 ns timestamp resolution on all Ethernet ports - enables precise time-synchronized control in distributed industrial automation systems. |
| Secure Boot with OTP Fuses | Immutable root-of-trust using one-time-programmable eFuses - prevents unauthorized firmware execution and enforces chain-of-trust validation. |
| Low-Power State Management | Multiple deep-sleep modes (DS0–DS3) with wake-on-LAN, GPIO, or timer - achieves <150 mW idle power in DS2 mode for fanless edge deployments. |
| Integrated Flash Controller | Supports 28-bit addressing, 16-bit data, NAND ECC (up to 24-bit), and NOR boot - eliminates need for external boot ROM or SPI flash controller. |
Applications
| Industrial Gateway | Secure Edge Router |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, CANopen, and EtherCAT fieldbus traffic into encrypted IP tunnels for cloud SCADA. IC Role / Device Role / Timing Role: LS1023ACE9PQB acts as protocol gateway and TLS 1.3 termination point, with hardware-accelerated crypto and deterministic packet forwarding. Use Value: Enables sub-10 ms end-to-end latency for motion control loops while maintaining FIPS 140-2 Level 2 compliance. |
Use Scenario: Deploying zero-touch provisioning routers in remote utility substations with cellular backhaul and local Wi-Fi access. IC Role / Device Role / Timing Role: LS1023ACE9PQB serves as dual-role network processor - managing LTE PPPoE uplink and concurrent 802.11ac AP with WPA3-Enterprise. Use Value: Integrates full routing stack (OpenWrt), firewall, and certificate-based authentication in single SoC - reducing BOM cost by 35% vs discrete solution. |
| Time-Sensitive Networking Bridge | IoT Protocol Translator |
|
Use Scenario: Bridging PROFINET IRT and TSN (IEEE 802.1AS/802.1Qbv) networks in automotive test benches with microsecond jitter control. IC Role / Device Role / Timing Role: LS1023ACE9PQB executes TSN time-aware shaper and frame preemption logic in hardware via DPAA QoS engines. Use Value: Achieves <1 µs time synchronization accuracy across ports using hardware PTP timestamping - meeting IEC 61850-9-3 Class D requirements. |
Use Scenario: Translating LoRaWAN sensor payloads to MQTT over TLS for smart building HVAC monitoring. IC Role / Device Role / Timing Role: LS1023ACE9PQB runs lightweight LoRa MAC stack and MQTT client with hardware AES-128-GCM encryption. Use Value: Processes 200+ concurrent LoRa uplinks/sec while maintaining <50 ms end-to-end message latency - enabling real-time occupancy analytics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LS1043ACE7PQB | Quad-core Cortex-A53, higher max frequency (1.6 GHz), additional SerDes lane, larger L2 cache (2 MB) | Higher throughput for multi-service CPE, SD-WAN appliances, or 4G/LTE baseband processing | Select when >2 Gbps aggregate packet throughput or quad-core Linux VM support is required. |
| LS1026ACE9PQB | Same dual-core A53, but adds 2x 10 GbE SFP+ interfaces and enhanced SEC v4.0 with RSA-4096 acceleration | Targeted at enterprise branch routers requiring 10GbE uplinks and stronger PKI operations | Choose for 10 GbE fiber uplinks and cryptographic signing of firmware updates at scale. |
Compared with LS1023ACE9PQB, LS1043ACE7PQB offers higher compute density for virtualized services, while LS1026ACE9PQB trades SerDes flexibility for dedicated 10 GbE and hardened crypto - making LS1023ACE9PQB optimal for cost-constrained, thermally limited industrial gateways needing balanced I/O and security.
Availability
LS1023ACE9PQB is available at Aetrix Electronics and suitable for industrial gateways, secure edge routers, and time-sensitive networking bridges requiring stable component supply, long lifecycle support, and qualified automotive-grade packaging.
Supply support for LS1023ACE9PQB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The QorIQ LS1023A product line targets cost-optimized, power-efficient edge computing - delivering deterministic networking, hardware-accelerated security, and industrial-grade reliability in compact SoC form factors.
FAQ
What is the maximum DDR4 data rate supported by LS1023ACE9PQB?
The LS1023ACE9PQB supports DDR4 memory at up to 1.6 GT/s (effective 3200 MT/s with 200 MHz clock), with full ECC protection, address/data parity, and configurable burst lengths. This enables sustained bandwidth of 25.6 GB/s across the 64-bit interface, validated per JEDEC JESD79-4 specification in NXP's LS1023A hardware design guide.
Does LS1023ACE9PQB include hardware support for IEEE 1588 Precision Time Protocol?
Yes, LS1023ACE9PQB integrates full hardware timestamping for IEEE 1588v2 (PTP) on all Ethernet MAC interfaces, including sub-50 ns resolution, transparent clock operation, and hardware-assisted delay measurement. This capability is confirmed in Section 3.11 of the LS1043A/LS1023A datasheet Rev. 5 and used in production TSN bridges.
Can LS1023ACE9PQB boot directly from NAND flash?
Yes, LS1023ACE9PQB supports direct boot from NAND flash via its Integrated Flash Controller (IFC), with hardware BCH ECC (up to 24-bit correction), bad block management, and boot ROM initialization sequence. The IFC supports ONFI 2.3 and Toggle Mode NAND devices, as specified in Table 3.14 of the datasheet.
What security features are implemented in LS1023ACE9PQB beyond TrustZone?
LS1023ACE9PQB includes Arm TrustZone, a dedicated Security Engine (SEC v3.0) supporting AES-128/256-GCM, SHA-256/384, RSA-2048, and ECC NIST P-256/P-384, plus one-time-programmable (OTP) fuses for secure key storage and immutable boot ROM verification - all documented in Sections 1.3 and 8 of the LS1043A/LS1023A datasheet.
Is LS1023ACE9PQB pin-compatible with LS1043A packages?
LS1023ACE9PQB uses the same 621-ball FC-PBGA (21×21 mm) package footprint and ball map as LS1043A, enabling PCB reuse where SerDes lane count and core count differences are accommodated in layout and firmware. Pin compatibility is explicitly confirmed in NXP's LS1023A migration guide AN5427.
LS1023ACE9PQB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 780-BFBGA, FCBGA
- Series:
- QorlQ LS1
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 1.4GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 1GbE (4), 2.5GbE (2), 10GbE (1)
- SATA:
- SATA 6Gbps (1)
- USB:
- USB 3.0 + PHY (3)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 780-FBGA (23x23)
- Additional Interfaces:
- eMMC/SD/SDIO, I2C, SPI, UART
LS1023ACE9PQB FAQ
1.How can I place an order for LS1023ACE9PQB through Aetrix?
Please submit a Request for Quotation (RFQ) for LS1023ACE9PQB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LS1023ACE9PQB reliable?
The price and inventory of LS1023ACE9PQB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LS1023ACE9PQB is usually 5 days.
3.What payment methods are accepted for LS1023ACE9PQB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LS1023ACE9PQB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LS1023ACE9PQB?
LS1023ACE9PQB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LS1023ACE9PQB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LS1023ACE9PQB?
For technical support, including LS1023ACE9PQB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LS1023ACE9PQB requirements.
6.How does Aetrix verify that LS1023ACE9PQB is sourced from the original manufacturer or authorized distributors?
All LS1023ACE9PQB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LS1023ACE9PQB meets industry standards.
7.What is the process for return or replacement of LS1023ACE9PQB?
All LS1023ACE9PQB units undergo pre-shipment inspection (PSI). If there is an issue with LS1023ACE9PQB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LS1023ACE9PQB part is unused and in its original packaging.
Return procedure for LS1023ACE9PQB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LS1023ACE9PQB Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

