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NXP Semiconductors LS1024ASN7MLA
- Part No.:
- LS1024ASN7MLA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 625-BFBGA, FCBGA
- Datasheet:
-
LS1024ASN7MLA.pdf
- Description:
- IC MPU QORIQ 1.2GHZ 625FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,717
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Product details
Overview
LS1024ASN7MLA from NXP is a dual-core ARM Cortex-A9 communications processor operating up to 1.2 GHz, featuring ECC-protected L1/L2 cache, integrated SATA 2.0, USB 3.0 + PHY, dual GbE MACs, PCIe 2.0, and hardware-accelerated packet processing for network edge applications including SMB security appliances and VoIP gateways.
For engineers reviewing the LS1024ASN7MLA datasheet, LS1024ASN7MLA pinout, LS1024ASN7MLA application, or LS1024ASN7MLA equivalent, key selection criteria include its sub-2 W typical power at 900 MHz, DDR3 memory controller support, TrustZone-enabled secure boot, and DECT/DECT-ULE baseband integration for voice-enabled edge devices.
Technical Context
The LS1024ASN7MLA implements a coherent dual-core ARM Cortex-A9 subsystem with 32 KB L1-I/D per core and 256 KB shared L2 cache, coupled with a multilayer AMBA AXI/AHB crossbar enabling non-blocking concurrent transactions across all I/O interfaces including SATA, PCIe, and GbE.
It integrates dedicated accelerators: DPIE (Deep Packet Inspection Engine), PPFE (Packet Processing Forwarding Engine), and hardware IPsec/SSL encryption engines - all accessible via Linux kernel drivers and supported by NXP's QorIQ SDK for real-time packet classification and policy enforcement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual ARM Cortex-A9 @ up to 1.2 GHz with L1/L2 cache coherency and ECC protection on instruction/data paths |
| Memory Interface | 32-bit DDR3 SDRAM controller supporting up to 1600 MT/s, enabling 6.4 GB/s peak bandwidth for real-time packet buffering |
| Networking Interfaces | Dual 10/100/1000 Mbps Ethernet MACs with RGMII/SGMII support, plus PCIe 2.0 x1 and SATA 2.0 for storage expansion |
| Security Features | Secure Boot with OTP fusing, ARM TrustZone, JTAG blocking, and hardware AES/SHA/DES acceleration for IPsec/SSL offload |
| USB & Serial | One USB 3.0 + PHY and one USB 2.0 + PHY; two UARTs, two SPIs, one I²C, one I²S, and TDM interface for VoIP codec interfacing |
| Power Consumption | Typical <2 W at 900 MHz under full load, validated per LS1024AFS REV 4 thermal characterization |
Pinout & Package
LS1024ASN7MLA is housed in a 23x23 mm, 621-pin FC-BGA package (RoHS-compliant, Pb-free) with 1.0 mm ball pitch and standard JEDEC MO-270AB mechanical outline.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_DQ[0:31] | DDR3 data bus | 32-bit bidirectional data path for synchronous access to external DDR3 memory with DQS strobing and ODT control |
| GBE0_TXD[0:3]/RXD[0:3] | Gigabit Ethernet MAC 0 interface | RGMII-compliant 4-bit transmit/receive data lanes supporting 10/100/1000 Mbps operation with clock forwarding |
| PCIe_CLKREQ_N | PCIe power management request | Active-low signal used to request PCIe link entry into L1/L2 low-power states per PCI Express Base Spec 2.0 |
| SATA0_TXP/N, SATA0_RXP/N | SATA 2.0 differential pair | Full-duplex 1.5/3.0 Gbps serial ATA interface compliant with SATA Revision 2.6 electrical specifications |
| USB3_DP/DM | USB 3.0 SuperSpeed differential pair | 5 Gbps high-speed signaling path with integrated PHY termination and SSC (Spread Spectrum Clocking) support |
Key Features
| Feature | Design Value |
|---|---|
| Hardware DPI Engine | Enables real-time Layer 7 packet inspection and content-aware filtering without CPU intervention, reducing latency for IDS/IPS deployments |
| Integrated DECT Baseband | Supports DECT and DECT-ULE protocols directly on-die, eliminating need for external baseband IC in cordless phone or smart home hubs |
| TrustZone + Secure Boot | Ensures immutable root-of-trust chain from ROM bootloader through OS image verification using fused OTP keys and SHA-256 hashing |
| PPFE Acceleration | Offloads forwarding decisions (ACL, NAT, QoS) from CPU cores, sustaining >1 Gbps wire-rate packet processing under Linux |
| DDR3 + NAND + SATA Coexistence | Simultaneous support for DDR3 main memory, NAND flash boot storage, and SATA 2.0 mass storage enables flexible BOM architecture for NAS and gateway designs |
Applications
| VoIP Home Gateway | SMB Security Appliance |
|---|---|
Use Scenario: Residential broadband gateway handling SIP-based VoIP for up to 16 concurrent channels with echo cancellation and jitter buffering. IC Role / Device Role / Timing Role: Main application processor executing Linux-based VoIP stack (e.g., Asterisk), managing dual GbE WAN/LAN, USB 3.0 storage, and DECT baseband for cordless handsets. Use Value: Integrated DECT baseband and hardware-accelerated audio DSP offload eliminate external codecs and reduce BOM cost by ~$1.80/unit. | Use Scenario: Firewall/UTM appliance for small offices with stateful packet inspection, SSL decryption, and intrusion prevention. IC Role / Device Role / Timing Role: Dual-core application processor running OPNsense or pfSense, leveraging DPIE and PPFE to sustain 800 Mbps firewall throughput at <2 W. Use Value: Hardware IPsec/SSL acceleration delivers 4× faster encrypted throughput vs. software-only ARM A9 implementations, meeting SMB SLA requirements. |
| Consumer NAS | Enterprise Wi-Fi AP |
Use Scenario: 2-bay network-attached storage with DLNA media serving, Samba file sharing, and automated backup to USB/SATA drives. IC Role / Device Role / Timing Role: Central SoC managing RAID 1 over dual SATA 2.0 ports, DDR3 memory, USB 3.0 host for external HDDs, and dual GbE for LAN/WAN traffic separation. Use Value: Integrated SATA 2.0 controllers with hardware RAID support enable zero-CPU-overhead disk mirroring and hot-swap readiness. | Use Scenario: 802.11n dual-band enterprise access point with VLAN segmentation, captive portal, and QoS per SSID. IC Role / Device Role / Timing Role: Control plane processor handling 802.1X authentication, TR-69 management, and RF calibration coordination via SPI/I²C to Wi-Fi radio ICs. Use Value: Dual GbE MACs with RGMII allow independent backhaul (WAN) and client-facing (LAN) traffic paths, eliminating internal switch bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LS1023ASN7QQB | Single-core Cortex-A9 @ 1.2 GHz; no SATA or DECT baseband; identical DDR3, PCIe, GbE, and security engine set | Targeted at lower-throughput routing/firewall use cases where dual-core headroom and storage/baseband are unnecessary | Select LS1023ASN7QQB when BOM cost reduction is prioritized over future-proofing for VoIP or NAS features |
| LS1043ASN7MQB | Quad-core Cortex-A53 @ 1.6 GHz; adds DPAA2, 10Gbps Ethernet, and enhanced crypto; larger 27x27 mm package | Designed for carrier-grade CPE and higher-tier UTM appliances requiring >1.5 Gbps throughput and virtualization support | Choose LS1043ASN7MQB only if application demands >1 Gbps sustained encrypted throughput or DPAA2-based flow steering |
Compared with LS1023ASN7QQB and LS1043ASN7MQB, the LS1024ASN7MLA uniquely balances dual-core A9 performance, integrated SATA/DECT, and sub-2 W power - making it optimal for cost-sensitive, feature-rich edge gateways where quad-core overhead or single-core limitations are unacceptable.
Availability
LS1024ASN7MLA is available at Aetrix Electronics and suitable for SMB security appliances, VoIP home gateways, consumer NAS systems, and enterprise Wi-Fi access points requiring stable component supply and long-term industrial availability.
Supply support for LS1024ASN7MLA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The QorIQ LS1024A product line was designed specifically for cost-optimized, low-power edge networking applications - delivering enterprise-class packet processing, security, and voice capabilities in a sub-2 W envelope.
FAQ
What is the maximum DDR3 speed supported by LS1024ASN7MLA?
The LS1024ASN7MLA supports DDR3-1600 MT/s (800 MHz clock) with 32-bit bus width and on-die termination. This delivers up to 6.4 GB/s peak bandwidth, validated in NXP's LS1024AFS REV 4 documentation and confirmed across reference designs like the LS1024A-RDB. The LS1024ASN7MLA DDR3 controller includes programmable timing parameters and automatic calibration sequences for robust operation across temperature and voltage corners.
Does LS1024ASN7MLA include hardware support for Secure Boot?
Yes, the LS1024ASN7MLA implements a multi-stage Secure Boot process beginning in ROM code, verifying signed bootloader images using SHA-256 and RSA-2048. It leverages OTP fuses for root key storage and supports TrustZone-enforced execution environments. This capability is documented in Section 4.2 of the LS1024A Security Reference Manual and is enabled by default in production silicon variants like LS1024ASN7MLA.
Can LS1024ASN7MLA operate without external flash memory?
No - the LS1024ASN7MLA requires external non-volatile storage (NOR/NAND flash or SD card) for boot image storage, as it lacks on-chip ROM large enough to host full boot firmware. Its Flash Controller supports Quad SPI NOR, ONFI 2.3 NAND, and eMMC 4.51, but boot initialization always begins by loading from an external device mapped to CS0. This dependency is specified in the LS1024A Reset Configuration Word (RCW) programming guide.
What thermal design power (TDP) rating applies to LS1024ASN7MLA?
The LS1024ASN7MLA has a typical power consumption of <2 W at 900 MHz under full load, with a maximum junction temperature of 105°C. Its thermal design is validated per JEDEC JESD51-2 standards using the 23x23 mm FC-BGA package. NXP specifies a θJA of 22.5°C/W for the standard evaluation board layout - meaning a 4.5°C rise above ambient at 200 mW dissipation, confirming suitability for fanless SMB gateway enclosures.
Is LS1024ASN7MLA pin-compatible with other LS102x series processors?
No - LS1024ASN7MLA uses a unique 621-ball FC-BGA footprint incompatible with LS1021A (484-ball), LS1022A (521-ball), or LS1023A (521-ball) packages. While functional blocks overlap, ball assignment, power rail grouping, and signal multiplexing differ significantly. Migration between LS102x variants requires PCB redesign; NXP explicitly states "no pin-to-pin compatibility" in the LS1024A Hardware Design Guide.
LS1024ASN7MLA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 625-BFBGA, FCBGA
- Series:
- QorIQ® Layerscape
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.2GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR3
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- GbE (3)
- SATA:
- SATA 3Gbps (2)
- USB:
- USB 2.0 + PHY (1), USB 3.0 + PHY
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Secure Boot, TrustZone®
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 625-FCPBGA (21x21)
- Additional Interfaces:
- -
LS1024ASN7MLA FAQ
1.How can I place an order for LS1024ASN7MLA through Aetrix?
Please submit a Request for Quotation (RFQ) for LS1024ASN7MLA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LS1024ASN7MLA reliable?
The price and inventory of LS1024ASN7MLA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LS1024ASN7MLA is usually 5 days.
3.What payment methods are accepted for LS1024ASN7MLA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LS1024ASN7MLA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LS1024ASN7MLA?
LS1024ASN7MLA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LS1024ASN7MLA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LS1024ASN7MLA?
For technical support, including LS1024ASN7MLA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LS1024ASN7MLA requirements.
6.How does Aetrix verify that LS1024ASN7MLA is sourced from the original manufacturer or authorized distributors?
All LS1024ASN7MLA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LS1024ASN7MLA meets industry standards.
7.What is the process for return or replacement of LS1024ASN7MLA?
All LS1024ASN7MLA units undergo pre-shipment inspection (PSI). If there is an issue with LS1024ASN7MLA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LS1024ASN7MLA part is unused and in its original packaging.
Return procedure for LS1024ASN7MLA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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