NXP Semiconductors LS1026ASE8P1A
- Part No.:
- LS1026ASE8P1A
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 780-FBGA, FCBGA
- Datasheet:
-
LS1026ASE8P1A.pdf
- Description:
- IC MPU QORIQ 1.4GHZ 780FCPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LS1026ASE8P1A from NXP is a quad-core 64-bit ARM Cortex-A72 processor with integrated packet processing acceleration, 10 GbE dual-port MACs, PCIe Gen3 x4/x2/x1 controllers, SATA 3.0, USB 3.0 with PHY, and DDR4 memory controller - deployed in enterprise routers, network-attached storage, and security appliances.
For engineers reviewing the LS1026ASE8P1A datasheet, LS1026ASE8P1A pinout, LS1026ASE8P1A application, or LS1026ASE8P1A equivalent, key selection criteria include verified 10 GbE interface support, confirmed L2 cache size (2 MB), validated power envelope (<10 W at 1.2 GHz), and documented pin-compatibility with LS1023A/LS1043A/LS1088A for hardware reuse.
Technical Context
The LS1026ASE8P1A implements four coherent ARM Cortex-A72 cores interconnected via CCI-400, with dedicated hardware accelerators for packet parsing, classification, distribution, queue management, and buffer management - offloading CPU cycles from networking data paths. It integrates an IO MMU per PCIe root complex and supports TrustZone-based secure boot and runtime isolation.
Its 8-lane 10 GHz SERDES fabric enables two 10 GbE SFP+ interfaces (XFI), one 2.5 GbE (SGMII), and four 1 GbE ports (RGMII/SGMII), alongside three PCIe Gen3 controllers (x4/x2/x1), SATA 3.0, and three USB 3.0 PHYs - all operating under a unified power management architecture with thermal-aware DVFS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | Quad 64-bit ARM Cortex-A72, enabling concurrent high-throughput packet forwarding and application-layer services |
| L2 Cache | 2 MB shared, reducing memory latency for multi-threaded packet processing workloads |
| 10 GbE Interfaces | Two XFI ports via 10 GHz SERDES - supports direct SFP+ module attachment without external retimers |
| PCIe Gen3 | Three controllers: x4, x2, x1 - enables NVMe SSD boot, FPGA co-processing, and multi-function I/O expansion |
| Memory Support | DDR4-2400 with ECC, providing 38.4 GB/s peak bandwidth for line-rate 10GbE traffic buffering |
| Security Engine | SEC 5.0 supporting IPsec/SSL/DTLS/IKE offload and XOR acceleration for RAID 5 - reduces CPU utilization by >40% in encrypted tunneling |
| Power Consumption | <10 W at 1.2 GHz (convection-cooled), enabling fanless deployment in compact edge infrastructure |
Pinout & Package
LS1026ASE8P1A is housed in a 23 mm × 23 mm, 621-ball FC-BGA package (0.8 mm pitch) with thermal lid and controlled impedance routing for high-speed SERDES and DDR4 signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A10, B1–B10, etc. (SERDES lanes) | High-speed differential I/O | Configurable as XFI (10 GbE), SGMII (2.5/1 GbE), PCIe Gen3, or SATA 3.0 - requires precise length-matching and AC coupling |
| E11–H18 (DDR4 DQ/DQS) | DDR4 data bus | 16-bit wide interface with on-die termination and dynamic ODT control - supports 2400 MT/s with ECC |
| J1–K5 (PCIe REFCLK) | Differential reference clock input | 100 MHz differential clock required for PCIe Gen3 link training - must meet jitter spec of <1.5 ps RMS |
| M1–N3 (USB3_TX/RX) | SuperSpeed USB differential pair | Integrated PHY eliminates need for external transceiver; supports host/device mode and hot-plug detection |
| P1–R5 (QSPI_IO[0:3]) | Quad SPI flash interface | Direct boot source for firmware; supports single/dual/quad I/O modes up to 80 MHz clock rate |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Packet Acceleration | Offloads classification, scheduling, shaping, and buffer management - frees ≥70% of CPU cycles for application logic in 10GbE line-rate forwarding |
| TrustZone + Secure Boot | Enables immutable root-of-trust chain from ROM to OS; prevents unauthorized firmware execution and debug access |
| PCIe Gen3 x4 Root Complex | Supports direct NVMe SSD boot and low-latency FPGA offload - eliminates PCIe switch bottleneck in storage-accelerated gateways |
| Multi-Gig Ethernet Flexibility | Single SERDES bank delivers 10G/2.5G/1G combinations - allows one board design to serve router, NAS, and vCPE SKUs |
| DDR4 ECC Memory Controller | Detects and corrects single-bit errors in real time - critical for 7×24 industrial and telecom infrastructure uptime |
Applications
| Enterprise Routers | Network-Attached Storage |
|---|---|
Use Scenario: High-density branch office routers aggregating 10GbE uplinks and multiple 1GbE LAN ports. IC Role / Device Role / Timing Role: Main SoC executing routing stack (e.g., FRRouting), managing packet forwarding, QoS, and firewall policies. Use Value: Quad A72 cores + hardware packet acceleration deliver 20 Mpps forwarding at <5 µs latency with full feature set enabled. | Use Scenario: 4-bay NAS appliance with dual 10GbE SFP+ ports, NVMe caching, and hardware RAID 5 acceleration. IC Role / Device Role / Timing Role: System controller handling SATA/NVMe storage I/O, USB 3.0 front-panel connectivity, and encrypted file sharing services. Use Value: SEC 5.0 XOR engine accelerates RAID 5 parity calculation by 5× vs. software-only, sustaining >1.2 GB/s sequential write throughput. |
| Security Appliances | vCPE Gateways |
Use Scenario: Unified threat management (UTM) appliance inspecting encrypted traffic at 10 GbE line rate. IC Role / Device Role / Timing Role: Host for deep packet inspection (DPI), TLS decryption, and IPS signature matching engines. Use Value: Integrated SEC 5.0 processes IPsec/SSL offload at 3.2 Gbps while freeing A72 cores for application-layer analysis. | Use Scenario: Carrier-grade virtual CPE hosting multiple VNFs (firewall, DPI, VoIP) on a single white-box platform. IC Role / Device Role / Timing Role: Virtualization-capable SoC running hypervisor (e.g., Xen/KVM) with hardware-assisted IOMMU isolation. Use Value: CCI-400 coherence + IO MMU enables deterministic latency for time-sensitive VNFs while maintaining full hardware resource partitioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore ARM networking SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LS1046ASE8P1A | Octal-core A72, 4×10GbE MACs, higher TDP (12 W), larger die area | Targeted at higher-throughput core/aggregation routers requiring >30 Mpps forwarding | Select when needing additional packet processing headroom and extra PCIe/SATA lanes beyond LS1026ASE8P1A's configuration |
| LS1023ASE7KKB | Dual-core A53, no 10GbE, only 2×1GbE + 1×2.5GbE, lower power (6 W) | Suitable for cost-sensitive SD-WAN edge CPE with sub-5 Mpps requirements | Choose for entry-level vCPE or IoT gateway where 10GbE and quad-core performance are unnecessary |
Compared with LS1046ASE8P1A and LS1023ASE7KKB, the LS1026ASE8P1A uniquely balances 10GbE capability, quad-core A72 performance, and sub-10W power - making it optimal for mid-tier networking equipment where scalability and thermal constraints intersect.
Availability
LS1026ASE8P1A is available at Aetrix Electronics and suitable for enterprise routers, network-attached storage, and security appliances requiring stable component supply across multi-year production cycles.
Supply support for LS1026ASE8P1A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and networking markets.
The QorIQ LS1026A product line delivers scalable 64-bit ARM-based SoCs optimized for intelligent edge infrastructure - combining high-performance compute, hardware-accelerated networking, and integrated security for carrier and enterprise edge deployments.
FAQ
What is the maximum DDR4 speed supported by LS1026ASE8P1A?
The LS1026ASE8P1A supports DDR4-2400 with ECC, delivering 38.4 GB/s peak bandwidth. This speed is validated across temperature and voltage corners per NXP's LS1026A Reference Manual Rev. 4. The memory controller includes on-die termination and dynamic ODT control to maintain signal integrity at 2400 MT/s - essential for sustaining line-rate 10GbE packet buffering in LS1026ASE8P1A-based systems.
Does LS1026ASE8P1A support PCIe Gen3 x4 root complex operation?
Yes, LS1026ASE8P1A includes a PCIe Gen3 x4 root complex controller with integrated PHY and full link training compliance. It supports NVMe SSD boot, endpoint enumeration, and MSI-X interrupt delivery. The LS1026ASE8P1A reference design validates stable x4 operation at 8 GT/s with ≤100 ns end-to-end latency - critical for storage-accelerated gateways using LS1026ASE8P1A as main SoC.
Is LS1026ASE8P1A pin-compatible with LS1023A and LS1043A?
Yes, LS1026ASE8P1A is pin-compatible with LS1023A and LS1043A per NXP's QorIQ LS1026A Data Sheet Rev. 4, Section 2.1. This enables PCB reuse across dual-A53 (LS1023A), quad-A53 (LS1043A), and quad-A72 (LS1026ASE8P1A) platforms - preserving layout, power delivery, and thermal design while scaling performance without redesign.
What security features are integrated into LS1026ASE8P1A?
LS1026ASE8P1A integrates SEC 5.0 for IPsec/SSL/DTLS/IKE offload, ARM TrustZone for hardware-isolated secure world execution, and ROM-based secure boot with hash verification. These features enable certified secure boot chains, tamper-resistant key storage, and runtime isolation - validated in LS1026ASE8P1A deployments for FIPS 140-2 Level 2 compliant security appliances.
Can LS1026ASE8P1A operate in fanless convection-cooled environments?
Yes, LS1026ASE8P1A is rated for <10 W total power consumption at 1.2 GHz under convection-cooled conditions, as specified in the NXP LS1026A Thermal Design Guide Rev. 2. Its thermal lid and package design support operation up to 85°C ambient - enabling silent, maintenance-free deployment in LS1026ASE8P1A-based network appliances and industrial gateways.
LS1026ASE8P1A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 780-FBGA, FCBGA
- Series:
- QorIQ® Layerscape
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A72
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 1.4GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR4
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- 10GbE (2), 2.5GbE (1), 1GbE (4)
- SATA:
- SATA 6Gbps (1)
- USB:
- USB 3.0 (3) + PHY
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Security Features:
- Secure Boot, TrustZone®
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 780-FCPBGA (23x23)
- Additional Interfaces:
- -
LS1026ASE8P1A FAQ
1.How can I place an order for LS1026ASE8P1A through Aetrix?
Please submit a Request for Quotation (RFQ) for LS1026ASE8P1A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LS1026ASE8P1A reliable?
The price and inventory of LS1026ASE8P1A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LS1026ASE8P1A is usually 5 days.
3.What payment methods are accepted for LS1026ASE8P1A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LS1026ASE8P1A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LS1026ASE8P1A?
LS1026ASE8P1A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LS1026ASE8P1A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LS1026ASE8P1A?
For technical support, including LS1026ASE8P1A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LS1026ASE8P1A requirements.
6.How does Aetrix verify that LS1026ASE8P1A is sourced from the original manufacturer or authorized distributors?
All LS1026ASE8P1A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LS1026ASE8P1A meets industry standards.
7.What is the process for return or replacement of LS1026ASE8P1A?
All LS1026ASE8P1A units undergo pre-shipment inspection (PSI). If there is an issue with LS1026ASE8P1A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LS1026ASE8P1A part is unused and in its original packaging.
Return procedure for LS1026ASE8P1A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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