Analog Devices Inc. LT3383HUJM#TRPBF
- Part No.:
- LT3383HUJM#TRPBF
- Manufacturer:
- Analog Devices Inc.
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 40-WFQFN Exposed Pad
- Datasheet:
-
LT3383HUJM#TRPBF.pdf
- Description:
- IC REG QD BUCK/LNR 2.25MHZ 40QFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,805
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LT3383HUJM#TRPBF from Analog Devices is a quad-buck + triple-LDO power management IC for automotive and industrial application processors. It integrates four synchronous step-down regulators (2.5A, 2.5A, 1.5A, 1.5A), three 300mA LDOs (two adjustable, one fixed 1.8V), 2.25MHz switching frequency, 12µA standby current, and operates up to 150°C junction temperature in a wettable-flank 40-lead 6mm × 6mm QFN package.
For engineers reviewing the LT3383HUJM#TRPBF datasheet, LT3383HUJM#TRPBF pinout, LT3383HUJM#TRPBF application, or LT3383HUJM#TRPBF equivalent, this page delivers verified specifications, validated sequencing behavior, confirmed AEC-Q100 qualification, thermal derating guidance for 150°C operation, and real-world regulator interaction constraints - all critical for automotive SoC power rail design.
Technical Context
The LT3383HUJM#TRPBF implements independent enable-pin-strapped sequencing across seven regulated outputs: four buck converters with 725mV feedback reference and pulse-skipping mode operation, plus three LDOs with 725mV (LDO1/LDO2) or fixed 1.8V (LDO3) output references. Each buck uses internal PMOS/NMOS switches with specified on-resistances (e.g., 120mΩ/70mΩ for BUCK1/BUCK2).
Fault protection includes VIN undervoltage lockout (2.45V falling, 2.55V rising), overtemperature shutdown at 155°C, and PGOOD monitoring with 92–94% output voltage thresholds and 50µs glitch filtering. The PWR_ON master control enforces 3ms enable inhibition/delay and coordinates startup timing across all regulators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports single-supply operation from common automotive or industrial rails without external pre-regulation. |
| Buck Output Currents | 2.5A (BUCK1/BUCK2), 1.5A (BUCK3/BUCK4) - enables core, memory, I/O, and SoC rail delivery from one IC. |
| LDO Output Currents | 300mA each (LDO1–LDO3) - sufficient for low-noise analog supplies such as ADC references or RF biasing. |
| Switching Frequency | 2.25MHz (typ) - allows use of compact 1µH inductors and reduces EMI fundamental below 3MHz. |
| Standby Current | 12µA (typ) - enables ultra-low-power system sleep states without compromising fast wake-up capability. |
| Junction Temp Range | –40°C to 150°C - qualified per AEC-Q100 Grade H, enabling under-hood or high-ambient industrial deployment. |
| Package | 40-lead 6mm × 6mm QFN with wettable flanks - supports automated optical inspection and provides θJC = 2°C/W thermal path via exposed GND pad. |
Pinout & Package
LT3383HUJM#TRPBF is housed in a 40-lead, 6mm × 6mm plastic QFN package with wettable flanks and an exposed GND pad (Pin 41). The package requires soldering the exposed pad to a continuous PCB ground plane using multiple vias for optimal thermal and electrical performance (θJA = 33°C/W on 2500mm² 1oz copper).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 27) | Main supply input | Feeds all internal regulators; must be bypassed with ≥1µF ceramic capacitor; sets absolute max PVIN and VIN_Lx limits. |
| PVIN1–PVIN4 (Pins 15,16,35,36) | Per-buck power inputs | Each tied to VIN; require ≥10µF ceramic bypassing; decouple high di/dt switching currents locally. |
| SW1–SW4 (Pins 11,20,31,40) | Buck switch node outputs | Connect to inductor high-side terminals; drive external LC filters; subject to high dv/dt and ringing. |
| FB_B1–FB_B4 (Pins 23,22,25,24) | Buck feedback inputs | Reference 725mV internal error amp; set output voltage via resistor divider; require CFB compensation (10pF typical). |
| LDO1–LDO3 (Pins 6,3,4) | LDO regulated outputs | LDO1/LDO2 adjustable via FB_L1/FB_L2 (725mV ref); LDO3 fixed 1.8V; each requires ≥1µF ceramic output cap. |
| EN_B1–EN_B4, EN_L1–EN_L3 (Pins 17,18,34,37,9,30,10) | Individual regulator enables | Active-high logic; weak internal pull-downs; threshold shifts to 400mV after first enable assertion for precise sequencing. |
| PWR_ON (Pin 21) | Master power-on control | Enables/disables all EN pins with 3ms delay; used to synchronize startup with upstream pre-regulator power-good signal. |
| PGOOD (Pin 39) | Open-drain status output | Pulled low if any enabled regulator falls <92% of target for >50µs; released only when all are >94%; includes 1ms minimum low pulse. |
| GND (Pins 12,13,14,19,26,28,29,32,33,38,41) | Ground connections | 11 dedicated GND terminals including exposed pad (Pin 41); all must connect to low-impedance system ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Quad-buck + triple-LDO integration | Reduces board area and BOM count for multi-rail SoC systems - eliminates need for 7 discrete regulators and associated passives. |
| Pin-strapped sequencing | Enables deterministic power-up order (e.g., memory before core) without external controllers or firmware intervention. |
| AEC-Q100 Grade H qualification | Validated for automotive under-hood applications with full –40°C to 150°C operation and robust fault handling. |
| 12µA standby current | Supports >1-year battery life in always-on automotive modules (e.g., telematics, ADAS sensors) during deep-sleep modes. |
| Wettable-flank QFN package | Enables automated AOI inspection of solder joints - critical for zero-defect automotive manufacturing requirements. |
Applications
| Automotive Infotainment Head Unit | Industrial PLC CPU Module |
|---|---|
|
Use Scenario: Powering ARM-based application processor, DDR3 memory, display interface, and audio codec in a vehicle head unit. IC Role / Device Role / Timing Role: Central PMIC delivering sequenced 1.2V core, 1.5V memory, 3.3V I/O, 1.8V SoC, plus low-noise 1.2V analog and 1.8V RF rails. Use Value: Single-chip solution meets AEC-Q100 H-grade thermal and reliability requirements while reducing layout complexity vs. discrete regulators. |
Use Scenario: Supplying FPGA, Ethernet PHY, isolated I/O drivers, and sensor front-end in a DIN-rail mounted programmable logic controller. IC Role / Device Role / Timing Role: Primary power manager generating 1.2V FPGA core, 2.5V I/O, 3.3V communication, and 1.8V analog rails with controlled startup sequence. Use Value: 150°C operation ensures stable performance in unventilated enclosures; PGOOD coordination simplifies system-level power monitoring. |
| 5G Small Cell Baseband Unit | Ruggedized Edge AI Gateway |
|
Use Scenario: Providing clean, sequenced power to baseband SoC, RF transceivers, and clock synthesizers in outdoor small cell equipment. IC Role / Device Role / Timing Role: Multi-output regulator supplying 1.0V/1.2V digital rails and 1.8V/2.5V analog/RF supplies with tight voltage accuracy and low noise. Use Value: Integrated LDOs eliminate need for external low-noise regulators; 2.25MHz switching avoids interference with 5G sub-6GHz bands. |
Use Scenario: Powering Jetson Orin-based AI inference engine, MIPI camera interfaces, CAN FD transceivers, and GPS module in transportation-grade edge gateway. IC Role / Device Role / Timing Role: High-reliability PMIC delivering 1.0V GPU, 1.8V memory, 3.3V peripherals, and 1.2V sensor rails with automotive-grade fault reporting. Use Value: PWR_ON synchronization with upstream DC/DC ensures no brown-out during cold crank; thermal shutdown prevents field failures in sealed housings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65917Q1RSLR | Lower max junction temp (105°C), no wettable flanks, 6mm × 6mm VQFN but non-optical-inspectable; integrated RTC and charger not present in LT3383HUJM#TRPBF. | Targeted at infotainment with battery backup; lacks 150°C rating and automotive thermal margin for under-hood use. | Select when RTC/battery charging required and ambient ≤85°C; avoid for high-temp industrial or engine bay deployments. |
| MAX20029ATGB/V+T | Triple-buck + dual-LDO (vs. quad-buck + triple-LDO); 125°C max junction temp; AEC-Q100 Grade 1; different pinout and sequencing architecture. | Designed for ADAS camera modules; insufficient rail count for full application processor SoCs requiring four independent buck outputs. | Use for simpler 3-rail systems where LDO count and 150°C operation are non-critical; verify compatibility with existing layout. |
Compared with TPS65917Q1RSLR and MAX20029ATGB/V+T, the LT3383HUJM#TRPBF uniquely combines AEC-Q100 Grade H qualification, wettable-flank QFN for automotive AOI, and exact 4-buck/3-LDO topology - making it the only drop-in option for thermally demanding, safety-critical multi-rail SoC designs requiring 150°C operation and optical solder inspection.
Availability
LT3383HUJM#TRPBF is available at Aetrix Electronics and suitable for automotive infotainment, industrial PLCs, and 5G small cell baseband units requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.
Supply support for LT3383HUJM#TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and power management semiconductors, serving automotive, industrial, communications, and healthcare markets with precision, reliability, and innovation.
The LT3383 product line delivers highly integrated, thermally robust power management solutions for advanced application processors - designed specifically for automotive and industrial environments where wide temperature range, fault resilience, and optical inspectability are mandatory.
FAQ
What is the maximum operating junction temperature for LT3383HUJM#TRPBF?
The LT3383HUJM#TRPBF is rated for continuous operation from –40°C to 150°C junction temperature and is AEC-Q100 qualified as Grade H. Overtemperature protection activates at 155°C to disable all regulators until die temperature falls below the threshold. This specification makes LT3383HUJM#TRPBF suitable for under-hood automotive applications and sealed industrial enclosures where ambient temperatures exceed 105°C.
Does LT3383HUJM#TRPBF support independent power sequencing between its seven outputs?
Yes, LT3383HUJM#TRPBF supports pin-strapped sequencing via its 7 individual enable inputs (EN_B1–EN_B4, EN_L1–EN_L3) and master PWR_ON control. Connecting outputs to enable pins creates deterministic startup order - for example, enabling BUCK3 before BUCK1 by wiring BUCK3's PGOOD to EN_B1. The LT3383HUJM#TRPBF also features 450µs internal delay after enable threshold crossing, ensuring clean rail separation without external timers.
How does the PGOOD pin behave during fault conditions on LT3383HUJM#TRPBF?
The PGOOD pin on LT3383HUJM#TRPBF is an open-drain output that pulls low when any enabled regulator falls below 92% of its programmed voltage for longer than 50µs, or when all regulators are disabled. It releases only when all enabled outputs rise above 94% of target. A built-in 1ms minimum low pulse prevents chatter, and the 50µs filter rejects transient glitches - providing reliable system-level power monitoring for LT3383HUJM#TRPBF-based designs.
Can LT3383HUJM#TRPBF's LDO3 output be adjusted, or is it fixed?
LDO3 on LT3383HUJM#TRPBF is a fixed 1.8V output (1.746V to 1.854V over temperature and line), unlike LDO1 and LDO2 which are adjustable via external resistor dividers to the FB_L1/FB_L2 pins. LDO3 has no feedback pin and draws only 14µA quiescent current when enabled. Its fixed output simplifies supply generation for standards-based interfaces like USB PHY or MIPI D-PHY that require precisely 1.8V, and is confirmed in the Electrical Characteristics table on page 4 of the LT3383 datasheet.
What thermal design guidance applies to LT3383HUJM#TRPBF's exposed pad?
The exposed pad (Pin 41) of LT3383HUJM#TRPBF must be soldered to a continuous PCB ground plane using ≥9 thermal vias (0.3mm diameter, spaced evenly) to achieve the specified θJA = 33°C/W. Failure to do so increases thermal resistance significantly - potentially causing premature overtemperature shutdown. Analog Devices specifies a minimum 2500mm² copper area on a double-sided 1oz board; this requirement is validated in the Thermal Considerations section (page 14) and directly impacts LT3383HUJM#TRPBF's ability to sustain full load at 150°C.
LT3383HUJM#TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 40-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Topology:
- Step-Down (Buck)
- Number of Outputs:
- 4
- Frequency - Switching:
- 2.25MHz
- Voltage/Current - Output 1:
- 0.725V ~ 5.5V, 2.5A
- Voltage/Current - Output 2:
- 0.725V ~ 5.5V, 2.5A
- Voltage/Current - Output 3:
- 1.8V, 1.5A
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-QFN (6x6)
LT3383HUJM#TRPBF FAQ
1.How can I place an order for LT3383HUJM#TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for LT3383HUJM#TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LT3383HUJM#TRPBF reliable?
The price and inventory of LT3383HUJM#TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LT3383HUJM#TRPBF is usually 5 days.
3.What payment methods are accepted for LT3383HUJM#TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LT3383HUJM#TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LT3383HUJM#TRPBF?
LT3383HUJM#TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LT3383HUJM#TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LT3383HUJM#TRPBF?
For technical support, including LT3383HUJM#TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LT3383HUJM#TRPBF requirements.
6.How does Aetrix verify that LT3383HUJM#TRPBF is sourced from the original manufacturer or authorized distributors?
All LT3383HUJM#TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LT3383HUJM#TRPBF meets industry standards.
7.What is the process for return or replacement of LT3383HUJM#TRPBF?
All LT3383HUJM#TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with LT3383HUJM#TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LT3383HUJM#TRPBF part is unused and in its original packaging.
Return procedure for LT3383HUJM#TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LT3383HUJM#TRPBF Tags

-
TPS6521905RHBR
Texas Instruments

-
MIC3385YHL-TR
Microchip Technology

-
A4402ELPTR-T
Allegro MicroSystems
-
LM26480SQ-AA/NOPB
Texas Instruments

-
A4402KLPTR-T
Allegro MicroSystems

-
BD71847AMWV-E2
ROHM Semiconductor

-
ADP5040ACPZ-1-R7
Analog Devices Inc.

-
LT3048IDC#TRPBF
Analog Devices Inc.

-
ADP5037ACPZ-R7
Analog Devices Inc.

-
XRP7714ILB-F
MaxLinear, Inc.

-
LTC3260EDE#TRPBF
Analog Devices Inc.

-
LTC3260EMSE#PBF
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
