Analog Devices Inc. LTC2310IMSE-14#TRPBF

Overview

LTC2310IMSE-14#TRPBF from Analog Devices (formerly Linear Technology) is a 14-bit + sign successive approximation register (SAR) analog-to-digital converter with differential inputs, 2 Msps throughput, ±2.5 LSB INL guaranteed over –40°C to 85°C, and integrated 4.096 V temperature-compensated reference. It operates from single 3.3 V or 5 V supply, delivers 82 dB SNR at 500 kHz input, and targets high-speed data acquisition in industrial and automotive systems.

For engineers reviewing the LTC2310IMSE-14#TRPBF datasheet, LTC2310IMSE-14#TRPBF pinout, LTC2310IMSE-14#TRPBF application, or LTC2310IMSE-14#TRPBF equivalent, key selection criteria include guaranteed no-missing-codes performance at 14 bits, LVDS/CMOS configurable serial interface, wide 0 V to VDD common-mode input range, low 35 mW power at 5 V, and MSOP-16 package compatibility with space-constrained PCB layouts.

Technical Context

The LTC2310IMSE-14#TRPBF implements a 15-bit SAR architecture with internal CDAC and differential comparator, enabling precise digitization of AIN+–AIN– voltage differences without configuration. Its acquisition phase samples via 15 Ω R_ON switches and 10 pF C_IN, while conversion uses binary-weighted fractions of REFOUT (e.g., REFOUT/2, REFOUT/4) for successive approximation.

It supports dual I/O modes: CMOS (single-ended SDO+/SCK+) or LVDS (differential SDO±/SCK±), selected by CMOS/LVDS pin logic level. Internal reference buffer provides 4.096 V ±0.014 V (max 20 ppm/°C drift), and external 1.25 V reference can be applied via REFIN to override REFOUT.

Key Specifications

Pinout & Package

Package: 16-lead plastic MSOP (4 mm × 5 mm), exposed pad (Pin 17) soldered to ground plane for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed SAR ADC applications.

Compared with AD7980BRMZ-REEL and ADS8860IDRCT, the LTC2310IMSE-14#TRPBF uniquely combines 2 Msps speed, integrated 4.096 V reference, LVDS/CMOS flexibility, and 5 V operation - making it optimal for industrial DAQ and automotive subsystems requiring deterministic timing and reduced BOM complexity.

Availability

LTC2310IMSE-14#TRPBF is available at Aetrix Electronics and suitable for high-speed data acquisition systems, optical networking telemetry, and automotive motor control applications requiring stable component supply, extended temperature qualification, and long-term production continuity.

Supply support for LTC2310IMSE-14#TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets.

The LTC2310-14 product line was designed for high-speed, high-accuracy data acquisition in thermally demanding environments - emphasizing low-noise SAR architecture, integrated precision references, and flexible digital interfaces to simplify system-level design.

FAQ

What is the guaranteed INL specification for LTC2310IMSE-14#TRPBF over its operating temperature range?

The LTC2310IMSE-14#TRPBF guarantees ±2.5 LSB integral nonlinearity over its full –40°C to +85°C operating temperature range. This specification is tested and ensured across all production units, supporting precision applications such as closed-loop motor control and medical instrumentation where end-point accuracy is critical. The LTC2310IMSE-14#TRPBF achieves this using laser-trimmed internal components and a robust SAR architecture that minimizes process- and temperature-induced errors.

Does LTC2310IMSE-14#TRPBF support both CMOS and LVDS digital interfaces simultaneously?

No, the LTC2310IMSE-14#TRPBF supports either CMOS or LVDS interface mode - not both simultaneously. Interface selection is controlled by the CMOS/LVDS pin (Pin 10): grounded for CMOS, tied to OVDD for LVDS, or left floating for low-power LVDS. In CMOS mode, only SDO+ and SCK+ are active; SDO– and SCK– must remain unconnected. In LVDS mode, differential termination with 100 Ω at the receiver is required for both data and clock lines. The LTC2310IMSE-14#TRPBF does not allow runtime switching between modes.

Can LTC2310IMSE-14#TRPBF operate with an external reference, and how is it configured?

Yes, the LTC2310IMSE-14#TRPBF supports external reference operation. To enable it, ground the REFIN pin (Pin 2), which disables the internal REFOUT buffer and allows an external 1.25 V to VDD reference to drive the REFOUT pin (Pin 3). The device accepts external references from 1.25 V to VDD, and the REFIN pin's 60 kΩ input resistance and 350 µA input current ensure stable biasing. This configuration preserves the LTC2310IMSE-14#TRPBF's full 14-bit + sign performance while enabling system-level reference sharing or higher-accuracy external sources.

What is the power consumption of LTC2310IMSE-14#TRPBF in nap mode at 5 V supply?

In nap mode at VDD = 5 V, the LTC2310IMSE-14#TRPBF draws 14–20 mA total supply current (IVDD + IOVDD), resulting in approximately 14–20 mW power dissipation. Nap mode activates automatically after conversion completion and maintains the reference and internal logic in a low-power ready state, enabling sub-microsecond wake-up to full-speed operation. This behavior is fully specified in the LTC2310IMSE-14#TRPBF datasheet and applies across its –40°C to +85°C temperature range.

Is the exposed pad (Pin 17) on LTC2310IMSE-14#TRPBF required to be connected to ground?

Yes, the exposed pad (Pin 17) on the LTC2310IMSE-14#TRPBF must be soldered directly to a solid ground plane. It is internally connected to GND and serves dual purposes: thermal dissipation (θ_JA = 40°C/W) and reduction of ground impedance for improved analog performance. Leaving the pad unconnected or floating degrades SNR, increases thermal resistance, and may cause instability in the internal reference buffer. The LTC2310IMSE-14#TRPBF datasheet explicitly states "EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB" as a mandatory layout requirement.