Analog Devices Inc. LTC3310SEV#TRPBF
- Part No.:
- LTC3310SEV#TRPBF
- Manufacturer:
- Analog Devices Inc.
- Package:
- 18-TFQFN Exposed Pad
- Datasheet:
-
LTC3310SEV#TRPBF.pdf
- Description:
- IC REG BUCK ADJ 10A 18LQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,955
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LTC3310SEV#TRPBF from Analog Devices is a monolithic, Silent Switcher 2 synchronous step-down DC/DC converter delivering up to 10A output current from a 2.25V–5.5V input, featuring 500mV feedback reference, 35ns minimum on-time, and ±1% VOUT accuracy with remote sense. It operates in pulse-skip or forced continuous mode and is used in FPGA core supplies requiring low-noise, high-efficiency POL conversion.
For engineers reviewing the LTC3310SEV#TRPBF datasheet, LTC3310SEV#TRPBF pinout, LTC3310SEV#TRPBF application, or LTC3310SEV#TRPBF equivalent, key selection criteria include its 3mm × 3mm LQFN thermal performance, AEC-Q100 qualification for automotive use, programmable 0.5–5MHz switching frequency, and integrated hot-loop bypass capacitors enabling ultralow EMI without external layout constraints.
Technical Context
The LTC3310SEV#TRPBF employs constant-frequency peak current mode control with internal 400µS error amplifier transconductance and 18A top-switch current limit, enabling fast transient response under dynamic load steps. Its Silent Switcher 2 architecture integrates VIN-to-PGND and VIN-to-AGND bypass capacitors, eliminating external high-frequency ceramic placement sensitivity while maintaining <30mVpp output ripple at 10A.
It supports multiphase parallel operation via MODE/SYNC pin synchronization and includes active voltage positioning (AVP) only in -1 variants; this part (LTC3310S) uses adjustable output via external FB divider. Thermal shutdown, output overvoltage protection, and die temperature monitoring via SSTT pin provide system-level fault resilience.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.25V to 5.5V - supports single-cell Li-ion, USB PD, and intermediate bus rails without pre-regulation. |
| VOUT Accuracy | ±1% with remote sense - ensures stable core voltage under PCB trace IR drop up to ±100mV. |
| Max Output Current | 10A continuous - delivered in thermally enhanced 3mm × 3mm LQFN with θJCbottom = 9°C/W. |
| Switching Frequency | Programmable 0.5–5MHz via RT resistor - enables compact magnetics and avoids AM radio band interference. |
| Min On-Time | 35ns - supports high VIN-to-VOUT ratios (e.g., 5V→0.5V) without pulse skipping at light loads. |
| Shutdown Current | 1µA - preserves battery life in always-on systems during deep sleep states. |
| Enable Threshold | Precision 400mV with 60mV hysteresis - allows accurate power sequencing using simple resistor dividers. |
Pinout & Package
Package: 18-lead 3mm × 3mm LQFN with exposed PGND pad (Pin 19), rated for –40°C to 125°C junction temperature and qualified per AEC-Q100 Grade 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EN (1) | Enable control input | Precision 400mV threshold with hysteresis; direct tie to VIN enables operation, pull below 375mV disables regulator. |
| AGND (2) | Remote sense ground | Kelvin connection point for FB divider low-side; rejects PCB ground bounce up to ±100mV vs local PGND. |
| VIN (3,4,11,12) | Main power input | Four parallel pins reduce impedance; must be shorted and bypassed locally to PGND with low-ESR ceramics. |
| PGND (5,10,19) | Power ground return | Primary thermal path; exposed pad (Pin 19) must be soldered to large PCB ground plane with ≥6 thermal vias. |
| SW (6–9) | Switch node output | Four paralleled switch outputs drive external inductor; requires shortest possible trace to minimize ringing and EMI. |
| MODE/SYNC (13) | Frequency control interface | Accepts external clock (0.5–2.25MHz) or outputs synchronized clock; selects pulse-skip vs forced continuous mode. |
| PGOOD (14) | Power status indicator | Open-drain output pulled low if VOUT deviates >3% from regulation or during startup/fault; 100µs delay filters transients. |
| RT (15) | Oscillator programming | Resistor to AGND sets switching frequency (e.g., 274kΩ → 2MHz); also configures phase offset in multiphase setups. |
| SSTT (16) | Soft-start/track/temp monitor | 10µA current charges external capacitor for controlled VOUT ramp; transitions to 4mV/°C temp readout after startup. |
| ITH (17) | Loop compensation node | Connects Type II/III compensation network (R-C-RC) referenced to AGND for stability across load/line variations. |
| FB (18) | Voltage feedback input | Regulated to 500mV; external resistor divider sets VOUT = 0.5V × (1 + RA/RB); supports remote sensing via AGND. |
Key Features
| Feature | Design Value |
|---|---|
| Silent Switcher 2 Architecture | Integrated VIN-to-PGND and VIN-to-AGND bypass capacitors eliminate layout-sensitive high-frequency loop area, reducing radiated EMI by >30dB vs SS1. |
| 100% Duty Cycle Operation | Enables dropout operation down to VIN = VOUT + IOUT × RDS(ON)_PMOS (16mΩ), supporting ultra-low input scenarios like 2.5V→2.2V. |
| Configurable Multiphase Support | MODE/SYNC pin enables precise phase alignment of up to 6 parallel LTC3310S units, doubling/tripling output current without derating. |
| Dual-Mode Control Logic | Hardware-selectable pulse-skip (high efficiency at light loads) or forced continuous (low noise, fixed frequency) via MODE/SYNC pin voltage level. |
| Dedicated Temperature Monitoring | SSTT pin provides calibrated 4mV/°C analog output post-soft-start, enabling real-time die temperature tracking without external sensors. |
Applications
| Automotive ADAS Power Rail | FPGA Core Supply |
|---|---|
Use Scenario: Powering vision processor SoCs in camera modules with strict CISPR25 Class 5 EMI limits. IC Role / Device Role / Timing Role: Primary POL converter delivering 1.2V/10A with ultralow radiated emissions due to Silent Switcher 2 layout-invariant design. Use Value: Eliminates need for external EMI filters and shielding cans, reducing BOM cost and board area by >40% versus SS1 alternatives. |
Use Scenario: Supplying configurable logic core voltage in Xilinx Kintex Ultrascale+ FPGAs requiring tight regulation and fast load transient response. IC Role / Device Role / Timing Role: Adjustable-output buck regulator with 35ns min on-time and peak current mode control for sub-100ns recovery from 1A→9A load steps. Use Value: Maintains <±15mV output deviation during 1A/µs slew-rate transients, reducing required bulk capacitance by 30%. |
| Industrial PLC I/O Module | 5G Small Cell Baseband |
Use Scenario: Providing isolated 3.3V/5A rail for analog front-end ADCs and DACs in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability DC/DC with AEC-Q100 Grade 1 qualification, thermal shutdown, and output short-circuit recovery. Use Value: Survives 150°C junction temperature excursions during overload and recovers autonomously via SSTT-triggered soft-start. |
Use Scenario: Generating 0.85V/8A supply for massive MIMO RF transceivers with stringent thermal and noise requirements. IC Role / Device Role / Timing Role: Thermally optimized 3mm × 3mm LQFN converter operating at 4MHz to shrink filter size and avoid baseband interference bands. Use Value: Achieves 92% efficiency at 8A/0.85V with 2.2µH inductor, cutting power loss by 1.8W versus 2MHz operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous step-down converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPM3695-100 | Fixed 10A output, no remote sense, 2.7–6V input, 4mm × 4mm QFN, no AVP or SSTT temp monitor | Lacks Kelvin sensing and die temperature reporting; suited for cost-sensitive non-automotive designs | Select when remote sensing and thermal telemetry are unnecessary and board space allows larger package |
| TPS546D24 | 6–18V input, 40A max, PMBus interface, 5mm × 7mm HotRod QFN, no Silent Switcher EMI mitigation | Targets higher-input industrial servers; requires complex layout for EMI compliance | Choose for wide-input, digital-control systems where telemetry and margining outweigh EMI design effort |
Compared with MPM3695-100 and TPS546D24, the LTC3310SEV#TRPBF uniquely combines automotive-grade reliability, ultralow EMI without layout dependency, and integrated thermal monitoring in a 3mm × 3mm footprint-making it optimal for space-constrained, noise-sensitive, and thermally monitored applications.
Availability
LTC3310SEV#TRPBF is available at Aetrix Electronics and suitable for automotive ADAS modules, FPGA core supplies, industrial PLC I/O, and 5G small cell baseband designs requiring stable component supply, AEC-Q100 compliance, and long-term production continuity.
Supply support for LTC3310SEV#TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and automotive markets since 1965.
The LTC3310S product line delivers ultralow-noise, high-current POL converters for mission-critical applications where EMI, thermal density, and reliability are non-negotiable-designed specifically for next-generation compute, sensing, and wireless infrastructure.
FAQ
What is the maximum output current capability of the LTC3310SEV#TRPBF?
The LTC3310SEV#TRPBF delivers up to 10A continuous output current in its specified thermal environment. This rating assumes proper PCB layout with the exposed PGND pad soldered to a 4-layer board having ≥6 thermal vias to an internal ground plane, ambient temperature ≤65°C, and airflow ≥200LFM. Derating applies above 85°C ambient or with reduced copper area.
Does the LTC3310SEV#TRPBF support remote voltage sensing?
Yes, the LTC3310SEV#TRPBF supports true remote voltage sensing via dedicated AGND and FB pins. The AGND pin must be connected directly to the load-side ground of the output capacitor, and the FB divider's low-side resistor tied to AGND-not PGND-to reject up to ±100mV ground potential difference and maintain ±1% regulation accuracy at the point of load.
How does the Silent Switcher 2 architecture improve EMI performance in the LTC3310SEV#TRPBF?
The LTC3310SEV#TRPBF integrates internal hot-loop bypass capacitors between VIN and PGND, and VIN and AGND, minimizing high-di/dt loop area independent of PCB layout. This reduces common-mode EMI by >30dB versus Silent Switcher 1, enabling compliance with CISPR25 Class 5 radiated emissions limits without external ferrite beads or shielded inductors-even on 2-layer boards.
Can the LTC3310SEV#TRPBF be synchronized to an external clock source?
Yes, the MODE/SYNC pin of the LTC3310SEV#TRPBF accepts an external square-wave clock (0.5–2.25MHz) to synchronize switching frequency and phase. Upon detection, the internal PLL locks within microseconds, automatically adapting slope compensation. External clock removal triggers graceful reversion to the default RT-set frequency within ~20µs, ensuring seamless transition.
What thermal protection features are included in the LTC3310SEV#TRPBF?
The LTC3310SEV#TRPBF includes overtemperature protection that disables switching when junction temperature exceeds ~150°C, plus a dedicated die temperature monitor accessible via the SSTT pin (4mV/°C). Unlike basic thermal shutdown, this allows predictive thermal management-system firmware can read SSTT voltage to throttle loads before protection activates, improving uptime and reliability.
LTC3310SEV#TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Silent Switcher®2
- Package/Case:
- 18-TFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.25V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.5V
- Voltage - Output (Max):
- 5.5V
- Current - Output:
- 10A
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-LQFN (3x3)
LTC3310SEV#TRPBF FAQ
1.How can I place an order for LTC3310SEV#TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for LTC3310SEV#TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LTC3310SEV#TRPBF reliable?
The price and inventory of LTC3310SEV#TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LTC3310SEV#TRPBF is usually 5 days.
3.What payment methods are accepted for LTC3310SEV#TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LTC3310SEV#TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LTC3310SEV#TRPBF?
LTC3310SEV#TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LTC3310SEV#TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LTC3310SEV#TRPBF?
For technical support, including LTC3310SEV#TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LTC3310SEV#TRPBF requirements.
6.How does Aetrix verify that LTC3310SEV#TRPBF is sourced from the original manufacturer or authorized distributors?
All LTC3310SEV#TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LTC3310SEV#TRPBF meets industry standards.
7.What is the process for return or replacement of LTC3310SEV#TRPBF?
All LTC3310SEV#TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with LTC3310SEV#TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LTC3310SEV#TRPBF part is unused and in its original packaging.
Return procedure for LTC3310SEV#TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LTC3310SEV#TRPBF Tags

-
TPS562201DDCR
Texas Instruments

-
MC34063ABD-TR
STMicroelectronics

-
TPS561201DDCR
Texas Instruments

-
MC33063ADR
Texas Instruments

-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments

-
AP3012KTR-G1
Diodes Incorporated

-
TLV61048DBVR
Texas Instruments

-
AZ34063UMTR-G1
Diodes Incorporated

-
TPS562200DDCR
Texas Instruments

-
AP62300TWU-7
Diodes Incorporated

-
MC34063EBD-TR
STMicroelectronics
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

