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Analog Devices Inc. LTC5553IUDB#TRPBF
- Part No.:
- LTC5553IUDB#TRPBF
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-VFQFN Exposed Pad
- Datasheet:
-
LTC5553IUDB#TRPBF.pdf
- Description:
- IC MIXR 3GHZ TO 20GHZ 12-QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,400
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Product details
Overview
LTC5553IUDB#TRPBF from Analog Devices is a high-performance 3GHz–20GHz double-balanced passive microwave mixer with integrated RF/IF baluns and LO buffer amplifier. It delivers 9dB conversion loss, +24.3dBm IIP3 at 10GHz, and +16dBm input P1dB - enabling high-linearity upconversion or downconversion in 5G wireless backhaul and phased-array radar front-ends.
For engineers reviewing the LTC5553IUDB#TRPBF datasheet, LTC5553IUDB#TRPBF pinout, LTC5553IUDB#TRPBF application, or LTC5553IUDB#TRPBF equivalent, key selection criteria include its 0dBm LO drive requirement, 50Ω matched 3–20GHz RF port, 500MHz–9GHz IF bandwidth, fast 0.2μs turn-on time for TDD systems, and thermal performance in the –40°C to 105°C operating range.
Technical Context
The LTC5553IUDB#TRPBF integrates a passive double-balanced mixer core with on-die RF and IF transformers, eliminating external baluns. Its LO amplifier supports 1–20GHz operation with only 0dBm drive, while internal biasing enables fast enable/disable control via the EN pin.
It operates in both high-side and low-side LO injection modes, delivering consistent conversion loss (8.2–11.6dB) and IIP3 (21.5–27.6dBm) across 3–20GHz RF frequencies - validated over full temperature range with <0.006dB/°C drift in conversion loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 3GHz to 20GHz - supports C/X/Ku-band radar, 5G mmWave backhaul, and satellite modem IF translation without external tuning. |
| LO Frequency Range | 1GHz to 20GHz - enables flexible local oscillator planning with minimal external amplification required. |
| IF Frequency Range | 500MHz to 9GHz - accommodates wideband baseband or intermediate frequency processing in software-defined radios. |
| Conversion Loss (Typ) | 9.0dB at 10GHz RF - defines signal path attenuation; lower than competing mixers in same band, reducing downstream gain requirements. |
| IIP3 (Typ) | +24.3dBm at 10GHz - indicates strong third-order intermodulation suppression for dense multi-carrier 5G signals. |
| Input P1dB | +16dBm at 10GHz - defines compression point where gain drops 1dB; enables handling of high-power RF inputs before distortion. |
| LO Drive Requirement | 0dBm - eliminates need for LO buffer stages, simplifying system-level RF chain design and power budgeting. |
| Supply Voltage / Current | 3.3V / 132mA - fixed rail operation compatible with standard LDOs; current draw stable across temperature (±10mA variation). |
Pinout & Package
Package: 12-lead (3mm × 2mm) plastic QFN (UDB), exposed thermal pad (Pin 13) soldered to PCB ground for electrical and thermal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1,3,4,6,8,10,13) | Ground reference and thermal path | All GND pins must be connected to low-inductance RF ground plane; exposed pad (Pin 13) is mandatory for thermal dissipation and signal integrity. |
| IF (Pin 2) | Single-ended IF port | 50Ω matched from 500MHz–9GHz; requires DC blocking capacitor due to internal transformer's ~6.2Ω DC resistance. |
| RF (Pin 5) | Single-ended RF port | 50Ω matched from 3GHz–20GHz; requires DC blocking capacitor due to internal transformer's ~2.5Ω DC resistance. |
| EN (Pin 7) | Enable control input | Logic-high (>1.2V) activates mixer; internal 376kΩ pull-down ensures safe default-off state when floating. |
| VCC (Pin 9) | Power supply input | 3.3V regulated supply; bypass capacitor required adjacent to pin to suppress switching noise from LO amplifier. |
| LO (Pin 11) | Local oscillator input | 50Ω matched from 1GHz–20GHz; DC voltage ~1.6V; requires series DC blocking capacitor to prevent transformer damage. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated RF and IF baluns | Eliminates discrete balun components and layout sensitivity, reducing board area and matching complexity across 3–20GHz. |
| 0dBm LO drive requirement | Reduces LO chain power consumption and component count - no external LO amplifier needed for most synthesizer outputs. |
| Fast enable/disable timing | 0.2μs turn-on and 0.1μs turn-off support time-division duplex (TDD) architectures in 5G and radar applications. |
| High isolation performance | LO-to-RF leakage <–25dBm and RF-to-LO isolation >40dB minimize self-interference in transceiver designs. |
| Wideband 50Ω port matching | RF, LO, and IF ports are internally matched to 50Ω without external tuning - simplifies impedance matching network design. |
| Thermal robustness | Junction temperature rating of 150°C with θJC = 25°C/W enables reliable operation in compact, thermally constrained RF modules. |
Applications
| 5G Broadband Wireless Access | Phased-Array Radar |
|---|---|
Use Scenario: High-capacity fixed wireless access (FWA) base stations operating in 24–28GHz bands using wideband OFDM modulation. IC Role / Device Role / Timing Role: Downconverting received mmWave signals to 1–4GHz IF for digitization and beamforming processing. Use Value: +24.3dBm IIP3 and 9dB conversion loss preserve EVM and ACLR performance under multi-tone interference conditions. | Use Scenario: Active electronically scanned array (AESA) radar transceivers requiring rapid frequency agility and low spurious emissions. IC Role / Device Role / Timing Role: Upconverting baseband waveforms to Ku-band (12–18GHz) for transmission with precise phase coherence. Use Value: Fast 0.2μs enable response synchronizes with T/R module switching; low LO-to-RF leakage (<–25dBm) prevents receiver desensitization. |
| Wireless Backhaul | Satellite Modems |
Use Scenario: Point-to-point microwave links (E-band, 71–76GHz) using dual-conversion architecture with first IF at 10–15GHz. IC Role / Device Role / Timing Role: First-stage downconverter translating RF to high IF, followed by second-stage conversion to baseband. Use Value: 3–20GHz RF bandwidth and 500MHz–9GHz IF range support flexible IF planning; 132mA supply current enables efficient thermal management in outdoor units. | Use Scenario: LEO satellite user terminals requiring low-noise, high-dynamic-range signal translation between S-band uplink and Ka-band downlink paths. IC Role / Device Role / Timing Role: Dual-role mixer supporting both upconversion (IF→RF) and downconversion (RF→IF) in half-duplex mode. Use Value: Identical RF/LO/IF port matching and symmetric IIP3 performance (25.6dBm upmix / 24.3dBm downmix at 10GHz) simplify dual-path calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microwave mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LTC5548 | 2–14GHz RF range; 7.1dB conversion loss; 24dBm IIP3; DC–6GHz IF | Better low-frequency IF support but limited to 14GHz RF max - unsuitable for Ku-band radar above 15GHz. | Select LTC5548 for sub-14GHz systems needing wider IF bandwidth down to DC, but not for 17–20GHz operation. |
| LTC5576 | 3–8GHz RF range; active upconverter; –0.6dB gain; 25dBm OIP3 | Active architecture provides gain instead of loss, but narrower RF bandwidth and higher power consumption (220mA). | Choose LTC5576 when system gain budget is constrained and RF band is ≤8GHz; avoid for 10–20GHz passive downconversion. |
Compared with LTC5548 and LTC5576, the LTC5553IUDB#TRPBF uniquely supports full 3–20GHz RF coverage with passive architecture, 0dBm LO drive, and thermal-rated operation to 105°C - making it optimal for wideband Ku-band radar and 5G mmWave infrastructure where frequency agility and power efficiency are critical.
Availability
LTC5553IUDB#TRPBF is available at Aetrix Electronics and suitable for 5G wireless backhaul, phased-array radar, satellite modems, and microwave transceiver designs requiring stable component supply across extended temperature ranges and high-volume production cycles.
Supply support for LTC5553IUDB#TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and aerospace markets with precision signal processing solutions.
The LTC5553IUDB#TRPBF belongs to Analog Devices' high-frequency microwave mixer product line, designed specifically for wideband, high-linearity frequency translation in next-generation wireless infrastructure and defense electronics.
FAQ
What is the recommended LO drive level for optimal performance of the LTC5553IUDB#TRPBF?
The LTC5553IUDB#TRPBF is optimized for 0dBm LO drive across its 1–20GHz range, delivering best-in-class conversion loss and IIP3. Performance remains robust within ±6dBm, but deviation beyond this range increases conversion loss and degrades linearity. The internal LO amplifier eliminates need for external buffering, simplifying RF chain design.
Does the LTC5553IUDB#TRPBF support both upconversion and downconversion?
Yes, the LTC5553IUDB#TRPBF supports bidirectional operation: RF port serves as input for downconversion (RF→IF), and as output for upconversion (IF→RF). Both modes are validated across 3–20GHz RF, with documented conversion loss, IIP3, and isolation specs for each configuration in the datasheet.
What is the function of the EN pin on the LTC5553IUDB#TRPBF, and what voltage thresholds activate it?
The EN pin on the LTC5553IUDB#TRPBF controls power-state activation. A voltage ≥1.2V enables the mixer; ≤0.3V disables it. Internal 376kΩ pull-down ensures safe default-off state if left unconnected. Turn-on/off times are 0.2μs and 0.1μs respectively - critical for TDD and pulsed radar timing.
How should the exposed thermal pad (Pin 13) of the LTC5553IUDB#TRPBF be handled in PCB layout?
The exposed pad (Pin 13) of the LTC5553IUDB#TRPBF must be soldered directly to a solid, low-thermal-resistance PCB ground plane. It serves dual roles: primary electrical ground return and thermal conduction path. Thermal resistance θJC is specified at 25°C/W; insufficient soldering or thermal via count will exceed junction temperature limits at 132mA supply current.
Is external DC blocking required on the RF, LO, and IF ports of the LTC5553IUDB#TRPBF?
Yes - external DC blocking capacitors are mandatory on RF (Pin 5), LO (Pin 11), and IF (Pin 2) ports. Each port connects internally to transformer primaries with low DC resistance (2.5Ω RF, 6.2Ω IF, ~1.6V DC bias on LO), so DC voltage presence risks transformer saturation or damage. Standard 18pF 0402 capacitors are used in the evaluation circuit.
LTC5553IUDB#TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- -
- Frequency:
- -
- Number of Mixers:
- -
- Gain:
- -
- Noise Figure:
- 12.8dB
- Secondary Attributes:
- -
- Current - Supply:
- 132mA
- Voltage - Supply:
- 3.3V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-QFN (3x2)
LTC5553IUDB#TRPBF FAQ
1.How can I place an order for LTC5553IUDB#TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for LTC5553IUDB#TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LTC5553IUDB#TRPBF reliable?
The price and inventory of LTC5553IUDB#TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LTC5553IUDB#TRPBF is usually 5 days.
3.What payment methods are accepted for LTC5553IUDB#TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LTC5553IUDB#TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LTC5553IUDB#TRPBF?
LTC5553IUDB#TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LTC5553IUDB#TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LTC5553IUDB#TRPBF?
For technical support, including LTC5553IUDB#TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LTC5553IUDB#TRPBF requirements.
6.How does Aetrix verify that LTC5553IUDB#TRPBF is sourced from the original manufacturer or authorized distributors?
All LTC5553IUDB#TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LTC5553IUDB#TRPBF meets industry standards.
7.What is the process for return or replacement of LTC5553IUDB#TRPBF?
All LTC5553IUDB#TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with LTC5553IUDB#TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LTC5553IUDB#TRPBF part is unused and in its original packaging.
Return procedure for LTC5553IUDB#TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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