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onsemi LV5809MX-TLM-H

Part No.:
LV5809MX-TLM-H
Manufacturer:
onsemi
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
8-SOIC (0.173", 4.40mm Width) Exposed Pad
Datasheet:
AetrixLV5809MX-TLM-H.pdf
Description:
IC REG BUCK ADJ 2.5A 8MFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,016

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Product details

Overview

LV5809MX-TLM-H from SANYO Semiconductor is a 1-channel current-mode step-down switching regulator with integrated 0.2 Ω high-side MOSFET, 330 kHz fixed-frequency operation, 0.8 V reference voltage, and soft-start functionality. It delivers up to 2.5 A output current across 4.5–18 V input range and supports standby mode with ≤40 µA quiescent current-used in industrial power supplies and embedded DC/DC conversion.

For engineers reviewing the LV5809MX-TLM-H datasheet, pinout, applications, or equivalent options, key selection considerations include its MFP8 (200mil) exposed-pad package, pulse-by-pulse over-current protection, thermal shutdown at 160 °C, and FB-based output voltage setting requiring external resistor divider.

Technical Context

This Bi-CMOS IC implements current-mode control for fast load transient response and simplified loop compensation. Its internal 5 V regulator powers gate drivers and analog circuitry, while bootstrapped high-side drive enables efficient synchronous-like operation without external high-side FET.

The device integrates UVLO, soft-start current source (10 µA), and three-tier current-limit thresholds (2.7–5.9 A depending on VOUT), plus short-circuit oscillation reduction (33 kHz). Thermal shutdown includes 40 °C hysteresis for reliable recovery after fault clearance.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range4.5 V to 18 V - supports 12 V rail systems and wide automotive/industrial inputs
Output CurrentUp to 2.5 A - sufficient for powering microcontrollers, sensors, and interface ICs
Switching Frequency330 kHz (typ) - balances EMI, inductor size, and efficiency for compact designs
Reference Voltage0.8 V ±2% - enables precise FB-based output setting from 1.2 V to 15 V
High-Side RDS(on)0.2 Ω - reduces conduction loss and improves full-load efficiency to 90% @ 1 A
Standby Current≤40 µA - meets low-power system sleep requirements
Thermal Shutdown160 °C with 40 °C hysteresis - prevents permanent junction damage during overload

Pinout & Package

MFP8 (200mil) package with exposed thermal pad - 5.0 mm × 4.4 mm footprint, 1.7 mm max height, optimized for board-level heat dissipation on specified 46.4 mm × 31.8 mm glass-epoxy PCB.

Pin/TerminalCircuit RoleDesign Meaning
1: BOOTBootstrap capacitor connectionDrives high-side FET gate above VIN; requires 0.022 µF ceramic cap + ~100 Ω series resistor
2: VINMain input supplyAccepts 4.5–18 V; requires ≥10 µF bulk capacitance to GND for stability
3: SWPower switch nodeConnects to inductor and boot cap; handles pulsed high dv/dt and peak currents
4: GNDPower and signal groundCommon return for IC core, feedback, and thermal pad; must be low-impedance
5: FBFeedback inputSenses output via resistor divider; regulates VOUT = 0.8 V × (1 + R1/R3)
6: COMPLoop compensationConnects RC network to stabilize control loop; sets phase margin and bandwidth
7: ENEnable controlActive-high logic input; 2.1 V threshold enables converter, <0.8 V disables it
8: SSSoft-start timing10 µA internal current charges external capacitor to ramp output voltage linearly

Key Features

FeatureDesign Value
Pulse-by-pulse over-current protectionThree programmable current-limit thresholds (Ic1–Ic3) adapt to different output voltages and inductor values
Thermal shutdown with hysteresis160 °C trip + 40 °C hysteresis ensures safe restart after cooling without oscillation
Integrated 0.2 Ω high-side FETEliminates need for external high-side switch and associated gate driver complexity
Fixed 330 kHz oscillatorEnables predictable EMI filtering and consistent inductor sizing across production units
Soft-start current source10 µA precision current enables accurate, capacitor-set startup timing without external bias

Applications

Industrial PLC I/O ModulesAutomotive Body Control Units

Use Scenario: Powering isolated digital I/O drivers and analog sensor interfaces in DIN-rail mounted controllers.

IC Role / Device Role / Timing Role: Primary 5 V or 3.3 V DC/DC regulator delivering stable, noise-immune supply under variable load transients.

Use Value: High-efficiency 90% operation at 1 A reduces thermal stress in enclosed enclosures; MFP8 package fits dense PCB layouts.

Use Scenario: Generating 3.3 V for CAN transceivers and microcontroller peripherals in non-safety-critical vehicle subsystems.

IC Role / Device Role / Timing Role: Input-regulated buck converter accepting 12 V battery rail with load dump tolerance up to 18 V.

Use Value: Built-in over-current and thermal protection prevent field failures due to wiring faults or ambient temperature rise.

Point-of-Load Converters for FPGAsSmart Home Hub Power Management

Use Scenario: Providing 1.2 V core supply to low-power FPGA configuration logic with tight voltage tolerance.

IC Role / Device Role / Timing Role: Adjustable-output buck regulator using FB divider; soft-start prevents inrush into downstream capacitors.

Use Value: 0.8 V reference enables accurate low-VOUT regulation; current-mode control ensures stability with ceramic output caps.

Use Scenario: Dual-rail power solution (5 V + 3.3 V) for Wi-Fi/BLE SoCs, memory, and USB peripherals in compact consumer enclosures.

IC Role / Device Role / Timing Role: Standby-capable primary regulator enabling <40 µA system sleep current when host MCU asserts EN low.

Use Value: Exposed-pad MFP8 package enhances thermal performance in thermally constrained plastic housings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar step-down regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Texas Instruments TPS54202DRCT4.5–17 V input, 2 A, 500 kHz, integrated FET, 2.5 µA IQ in sleep modeLower IQ and higher frequency; lacks thermal hysteresis and multi-threshold OCPPreferred where ultra-low standby power is critical and thermal margin is ample
Rohm BD9G201EFJ-ME24.5–32 V input, 2 A, 340 kHz, 0.15 Ω RDS(on), 25 µA IQWider VIN range and lower RDS(on); no soft-start current source (requires external circuit)Preferred for higher-input industrial rails and where layout space allows external soft-start

Compared with TPS54202DRCT and BD9G201EFJ-ME2, LV5809MX-TLM-H offers superior thermal hysteresis behavior and built-in soft-start timing control, but trades off slightly higher quiescent current and narrower input range-making it optimal for cost-sensitive, thermally constrained 12 V-fed applications requiring robust fault handling.

Availability

LV5809MX-TLM-H is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive body control units, and smart home hub power management requiring stable component supply and long-term lifecycle support.

Supply support for LV5809MX-TLM-H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

SANYO Semiconductor Co., Ltd. was a Japanese semiconductor manufacturer specializing in power management, analog, and discrete devices before its acquisition by ON Semiconductor in 2011.

The LV5809MX-TLM-H belongs to SANYO's Bi-CMOS step-down regulator product line, designed specifically for compact, high-efficiency DC/DC conversion in cost-sensitive industrial and consumer equipment.

FAQ

What is the maximum input voltage rating for LV5809MX-TLM-H?

The LV5809MX-TLM-H has an absolute maximum input voltage of 20 V on the VIN pin. Operation beyond this rating-even momentarily-may cause permanent damage. Designers must account for voltage spikes and inductive kickback from external components like inductors and diodes to ensure the VIN pin never exceeds 20 V in actual use. The recommended operating range remains 4.5–18 V per specification.

How does the soft-start function work on LV5809MX-TLM-H?

The LV5809MX-TLM-H provides a dedicated SS pin with an internal 10 µA current source that charges an external capacitor to control output voltage ramp rate. The soft-start time Tss is calculated as Tss = (C6 × 0.8 V) / 10 µA, where C6 is the capacitor value. For example, a 0.015 µF capacitor yields ~1.2 ms soft-start. This prevents inrush current and stabilizes startup sequencing in multi-rail systems using LV5809MX-TLM-H.

What package type and thermal characteristics apply to LV5809MX-TLM-H?

LV5809MX-TLM-H uses the MFP8 (200mil) package with exposed thermal pad, measuring 5.0 mm × 4.4 mm and 1.7 mm max height. On the specified test board (46.4 mm × 31.8 mm × 1.7 mm glass epoxy), its maximum allowable power dissipation is 2.05 W at 25 °C ambient. Thermal resistance θJA is derived from the Pd max vs. Ta curve, supporting continuous 2.5 A operation within -20°C to 80°C ambient when properly heatsinked via the exposed pad.

Can LV5809MX-TLM-H be used in automotive applications?

LV5809MX-TLM-H is rated for operation from -20°C to +80°C ambient and supports input voltages up to 18 V, making it suitable for non-safety-critical automotive body electronics such as lighting controls, HVAC actuators, and infotainment peripherals. However, it is not qualified for ASIL-B/C safety applications, nor intended for direct engine-bay use without derating. SANYO explicitly excludes medical, aerospace, nuclear, and life-sustaining systems-including automotive safety systems-from standard application coverage.

What is the purpose of the BOOT pin on LV5809MX-TLM-H?

The BOOT pin on LV5809MX-TLM-H connects to an external bootstrap capacitor (typically 0.022 µF) between BOOT and SW pins to generate gate drive voltage above VIN for the integrated high-side MOSFET. This enables efficient high-side switching without requiring a separate charge pump. A ~100 Ω series resistor (Rb) is recommended to damp ringing and protect the SW pin's absolute maximum rating, ensuring stable operation and reduced EMI in LV5809MX-TLM-H designs.

LV5809MX-TLM-H Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Series:
-
Package/Case:
8-SOIC (0.173", 4.40mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Function:
Step-Down
Output Configuration:
Positive
Topology:
Buck
Output Type:
Adjustable
Number of Outputs:
1
Voltage - Input (Min):
4.5V
Voltage - Input (Max):
18V
Voltage - Output (Min/Fixed):
0.8V
Voltage - Output (Max):
14.4V
Current - Output:
2.5A
Frequency - Switching:
330kHz
Synchronous Rectifier:
No
Operating Temperature:
-20°C ~ 80°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-MFP

LV5809MX-TLM-H FAQ

1.How can I place an order for LV5809MX-TLM-H through Aetrix?

Please submit a Request for Quotation (RFQ) for LV5809MX-TLM-H on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LV5809MX-TLM-H reliable?

The price and inventory of LV5809MX-TLM-H are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LV5809MX-TLM-H is usually 5 days.

3.What payment methods are accepted for LV5809MX-TLM-H?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LV5809MX-TLM-H transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LV5809MX-TLM-H?

LV5809MX-TLM-H orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LV5809MX-TLM-H order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LV5809MX-TLM-H?

For technical support, including LV5809MX-TLM-H datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LV5809MX-TLM-H requirements.

6.How does Aetrix verify that LV5809MX-TLM-H is sourced from the original manufacturer or authorized distributors?

All LV5809MX-TLM-H products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LV5809MX-TLM-H meets industry standards.

7.What is the process for return or replacement of LV5809MX-TLM-H?

All LV5809MX-TLM-H units undergo pre-shipment inspection (PSI). If there is an issue with LV5809MX-TLM-H, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LV5809MX-TLM-H part is unused and in its original packaging.

Return procedure for LV5809MX-TLM-H:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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