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NXP Semiconductors LX2120CA72232B

Part No.:
LX2120CA72232B
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixLX2120CA72232B.pdf
Description:
LAYERSCAPE 64-BIT ARM CORTEX-A72
Quantity:
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Payment
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Shipping

Inventory:2,032

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Product details

Overview

LX2120CA72232B from NXP is a 12-core Arm Cortex-A72 network processor with 6 MB L2 cache, dual 72-bit DDR4-3200 controllers with ECC, and integrated DPAA2 datapath acceleration delivering up to 50 Gbps crypto and 100 Gbps compression throughput. It serves as the central control and packet-processing engine in high-throughput networking equipment including 5G baseband units and enterprise edge routers.

For engineers reviewing the LX2120CA72232B datasheet, LX2120CA72232B pinout, LX2120CA72232B application, or LX2120CA72232B equivalent, key selection criteria include its 12-core A72 cluster frequency (up to 2.2 GHz), 24 SerDes lanes supporting 25 Gbps per lane, IEEE 1588-aware multi-gigabit Ethernet MAC count (up to 18), and hardware virtualization support via Arm MMU-500.

Technical Context

The LX2120CA72232B implements a cache-coherent interconnect fabric operating at up to 1500 MHz, backed by 8 MB Level 3 cache with ECC and On-Chip Memory (OCM) mode. Its Datapath Acceleration Architecture 2.0 (DPAA2) integrates WRIOP for packet parsing/classification, QDMA for zero-copy transfers, and dedicated SEC and DCE engines.

It supports heterogeneous interface concurrency: two PCIe Gen3 x8 controllers with SR-IOV, four PCIe Gen3 x4 controllers, four SATA 3.0 ports, dual USB 3.0 + PHY, dual CAN-FD, eight I²C, four UARTs, and FlexSPI - all managed under unified QorIQ platform trust architecture 3.0 with 256 KB secure on-chip RAM.

Key Specifications

Parameter Value and Actual Design Meaning
Core Count & Type 12× Arm Cortex-A72 cores, each with 48 KB L1 instruction + 32 KB L1 data cache; enables parallel real-time packet processing and OS-level workload distribution.
Max Core Frequency 2.2 GHz; determines single-threaded instruction throughput and latency-critical control-plane performance.
L2 Cache 6 MB shared L2 cache with ECC; reduces memory access latency for inter-core communication and DPAA2 buffer metadata handling.
DDR Interface Dual 72-bit (64+8 ECC) DDR4 SDRAM controllers at 3.2 GT/s; delivers >51 GB/s aggregate memory bandwidth for line-rate 100G packet buffering.
Crypto Acceleration SEC engine at up to 50 Gbps AES-GCM/SHA; offloads IPsec/TLS encryption from CPU cores, preserving A72 cycles for routing and signaling tasks.
Ethernet MAC Count Up to 18 IEEE 1588-compliant MACs supporting USXGMII, CAUI-4, 50GAUI-2, and 25G-AUI; enables flexible port aggregation and multi-rate optical/electrical PHY interfacing.
SerDes Lanes 24 lanes configurable up to 25 Gbps each; provides physical layer flexibility for PCIe, SATA, SFI/XFI, and Ethernet interfaces without external retimers.

Pinout & Package

The LX2120CA72232B is housed in a 1517-ball Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) package with 0.8 mm ball pitch and 37 mm × 37 mm body size, optimized for high-density server and telecom board layouts with controlled impedance routing.

Pin/Terminal Circuit Role Design Meaning
D1_MDQ00–D1_MDQ63 DDR1 Data Bus (x72) 64-bit data + 8-bit ECC signals for first DDR4 channel; requires matched-length routing and termination for 3.2 GT/s operation.
D1_MCK0–D1_MCK3 DDR1 Clock (differential) Four differential clock pairs for DDR4 address/command/data strobing; critical for timing closure and jitter tolerance.
EC1_RXD0–EC1_TXD3 Ethernet Controller 1 (RGMII) Eight-lane RGMII interface supporting two 1 Gbps ports; enables low-pin-count PHY connectivity with precise 2 ns skew control.
PCIe_RX[0:7]_P/N (x8) PCIe Gen3 x8 Receiver Differential SerDes input pair for primary PCIe root complex; supports SR-IOV virtual function enumeration and DMA coherency.
USB1_RX_P/USB1_TX_P USB 3.0 SuperSpeed Lane Full-duplex 5 Gbps differential pair with integrated PHY; eliminates need for external transceivers in host-mode applications.
JTAG_TCK/TMS/TDO/TDI IEEE 1149.1 Debug Interface Standard boundary-scan and core debug access; required for boot firmware validation and post-silicon failure analysis.

Key Features

Feature Design Value
Hardware Virtualization Arm MMU-500 enforcement enables secure partitioning of Linux containers and real-time RTOS domains on shared memory and peripherals.
Trust Architecture QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip secure RAM supports measured boot, secure key storage, and tamper detection.
DPAA2 Packet Engine WRIOP + QDMA + 2 MB packet express buffer enables stateless load balancing across 12 A72 cores without software intervention.
IEEE 1588 Precision Timing Hardware timestamping in all 18 Ethernet MACs supports sub-100 ns time synchronization for 5G fronthaul and industrial TSN deployments.
Voltage ID (VID) Support Dynamically adjusts core voltage during operation to optimize power efficiency across process/voltage/temperature corners.

Applications

5G Radio Unit (RU) Enterprise SD-WAN Edge Appliance

Use Scenario: Real-time Layer 1/2 processing of CPRI/eCPRI baseband traffic between DU and RU in Open RAN deployments.

IC Role / Device Role / Timing Role: Central packet classifier, fronthaul scheduler, and IEEE 1588 grandmaster clock distributor.

Use Value: 24×25 Gbps SerDes lanes directly interface with eCPRI optical modules; DPAA2 WRIOP handles deterministic packet reordering with <1 µs latency.

Use Scenario: Multi-WAN failover, encrypted tunnel termination (IPsec/IKEv2), and application-aware traffic steering in branch offices.

IC Role / Device Role / Timing Role: Control-plane processor for routing stack and data-plane accelerator for crypto/compression offload.

Use Value: SEC engine delivers 50 Gbps IPsec throughput; dual DDR4 channels sustain concurrent 10 GbE WAN/LAN + 2.5 GbE management traffic.

Time-Sensitive Networking (TSN) Switch Industrial IoT Gateway

Use Scenario: Deterministic switching of synchronized audio/video streams and motion control commands in factory automation networks.

IC Role / Device Role / Timing Role: TSN-aware Ethernet switch controller with hardware timestamping and time-aware shaper (TAS) scheduling.

Use Value: 18× IEEE 1588 MACs enable precise cross-port synchronization; 8 MB L3 cache buffers time-critical frame metadata with ECC protection.

Use Scenario: Protocol translation between Modbus TCP, CAN-FD field buses, and MQTT/HTTPS cloud uplinks in smart manufacturing nodes.

IC Role / Device Role / Timing Role: Dual-CAN-FD interface controller, secure TLS endpoint, and real-time Linux host for edge AI inference.

Use Value: Integrated CAN-FD modules eliminate external transceivers; QorIQ trust architecture secures OTA firmware updates over cellular links.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore network processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
LX2160A 16-core A72, 8 MB L2 cache, identical DPAA2 and SerDes capability; higher thermal envelope (30 W vs. 25 W). Targeted at full 100G line cards and carrier-grade control planes requiring maximum core density. Select LX2160A when >12 cores or >6 MB L2 are required for control-plane VM consolidation.
LX2080A 8-core A72, 8 MB L2 cache, same I/O peripheral set but reduced SerDes lane count (16 vs. 24) and no PCIe x8 support. Suitable for cost-sensitive 25G/40G access switches and compact SD-WAN CPE with lower packet-per-second requirements. Choose LX2080A where thermal budget is tighter and 12-core throughput is unnecessary.

Compared with LX2160A, LX2120CA72232B trades 4 cores and 2 MB L2 for lower power and identical DPAA2 acceleration, while LX2080A further reduces SerDes and PCIe scalability to meet entry-level edge gateway needs.

Availability

LX2120CA72232B is available at Aetrix Electronics and suitable for 5G infrastructure, enterprise SD-WAN appliances, and industrial TSN switch designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from NXP's qualified production lots.

Supply support for LX2120CA72232B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with deep expertise in Arm-based processing and hardware-accelerated datapaths.

The LX2120CA72232B belongs to NXP's Layerscape LX series, designed specifically for scalable, software-defined networking infrastructure where deterministic packet processing, hardware security, and multi-gigabit I/O concurrency are mandatory.

FAQ

What is the maximum DDR4 speed supported by the LX2120CA72232B?

The LX2120CA72232B supports DDR4 SDRAM at up to 3.2 GT/s across two independent 72-bit channels (64-bit data + 8-bit ECC). This translates to a theoretical peak bandwidth of 51.2 GB/s per channel, validated under JEDEC DDR4-3200 specifications with on-die termination and write leveling calibration sequences implemented in the LX2120CA72232B's DDR PHY.

Does the LX2120CA72232B support PCIe Gen4?

No, the LX2120CA72232B supports only PCIe Gen3 - with two x8 controllers and four x4 controllers. Its SerDes lanes are rated for up to 25 Gbps, which aligns with PCIe Gen3 (8 GT/s) and higher-speed protocols like 25G Ethernet and SATA 3.2, but not PCIe Gen4 (16 GT/s). The reference design and timing models in the LX2120CA72232B datasheet do not include Gen4 compliance testing or equalization settings.

How many CAN-FD interfaces does the LX2120CA72232B integrate?

The LX2120CA72232B integrates two Controller Area Network (CAN) modules, both supporting CAN Flexible Data Rate (CAN-FD) per ISO 11898-1:2015. Each module includes dedicated message RAM, bit-rate switching logic, and error confinement circuitry - enabling simultaneous operation at up to 5 Mbps data phase and 1 Mbps arbitration phase without CPU intervention.

Is hardware virtualization support built into the LX2120CA72232B?

Yes, the LX2120CA72232B includes Arm MMU-500 for hardware-enforced memory virtualization and partitioning. This allows simultaneous execution of multiple OS instances (e.g., Linux for control plane and FreeRTOS for real-time packet forwarding) with strict isolation of memory regions, interrupt vectors, and peripheral access - verified in NXP's QorIQ SDK v3.x hypervisor reference implementation.

What is the package type and ball count of the LX2120CA72232B?

The LX2120CA72232B uses a 1517-ball Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) package with 0.8 mm ball pitch and 37 mm × 37 mm body dimensions. Pin assignments follow the standardized LX21xxA BGA map documented in Section 2 of the NXP Layerscape LX2160A/LX2120A/LX2080A Data Sheet Rev. 3, including dedicated DDR, SerDes, PCIe, and debug signal groupings.

LX2120CA72232B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
1517-BBGA, FCBGA
Series:
-
Packaging:
Tray
Product Status:
Active
Core Processor:
-
Number of Cores/Bus Width:
-
Speed:
-
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
-
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1517-FCPBGA (40x40)
Additional Interfaces:
-

LX2120CA72232B FAQ

1.How can I place an order for LX2120CA72232B through Aetrix?

Please submit a Request for Quotation (RFQ) for LX2120CA72232B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LX2120CA72232B reliable?

The price and inventory of LX2120CA72232B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2120CA72232B is usually 5 days.

3.What payment methods are accepted for LX2120CA72232B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2120CA72232B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LX2120CA72232B?

LX2120CA72232B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LX2120CA72232B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LX2120CA72232B?

For technical support, including LX2120CA72232B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2120CA72232B requirements.

6.How does Aetrix verify that LX2120CA72232B is sourced from the original manufacturer or authorized distributors?

All LX2120CA72232B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2120CA72232B meets industry standards.

7.What is the process for return or replacement of LX2120CA72232B?

All LX2120CA72232B units undergo pre-shipment inspection (PSI). If there is an issue with LX2120CA72232B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LX2120CA72232B part is unused and in its original packaging.

Return procedure for LX2120CA72232B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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