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NXP Semiconductors LX2160SE72232B

Part No.:
LX2160SE72232B
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixLX2160SE72232B.pdf
Description:
IC MPU QORLQ 2.2GHZ 1517FCPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,369

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Product details

Overview

LX2160SE72232B from NXP is a 16-core Arm Cortex-A72 network processor operating up to 2.2 GHz, featuring 8 MB L3 cache with ECC, dual 72-bit DDR4-3200 memory controllers with ECC, and DPAA2 datapath acceleration delivering 50 Gbps crypto and 100 Gbps compression throughput. It serves as the control and packet-processing engine in high-end 5G baseband units, carrier-grade routers, and secure edge gateways.

For engineers reviewing the LX2160SE72232B datasheet, LX2160SE72232B pinout, LX2160SE72232B application, or LX2160SE72232B equivalent, key selection criteria include DDR4 ECC interface timing compliance, SerDes lane allocation for 100G CAUI-4/25G-AUI, IEEE 1588 timestamping accuracy, and SEC/DCE acceleration bandwidth allocation across virtualized network functions.

Technical Context

The LX2160SE72232B implements a cache-coherent interconnect fabric running at up to 1500 MHz, integrating 16× A72 cores each with 48KB L1 instruction and 32KB L1 data cache, plus shared 8 MB L3 cache with ECC and on-chip memory (OCM) mode. Its DPAA2 architecture includes WRIOP for packet parsing/classification, QDMA for zero-copy transfers, and Management Complex (MC) for hardware resource orchestration.

It supports 24 SerDes lanes configurable for PCIe Gen3, SATA 3.0, SGMII, XFI, USXGMII, CAUI-4 (100G), CAUI-2 (50G), and 25G-AUI, with two 72-bit DDR4 interfaces operating at 3.2 GT/s and full ECC protection. Ethernet subsystem delivers up to 18 MACs with IEEE 1588 v2 precision time protocol support across RGMII, SFI, XLAUI4, and 10GBase-KR physical layers.

Key Specifications

Parameter Value and Actual Design Meaning
Core Count & Architecture 16× Arm Cortex-A72 cores, single-threaded, enabling parallel real-time packet processing and virtualized control plane execution.
Max Clock Frequency 2.2 GHz - determines worst-case instruction throughput and deterministic latency for time-critical forwarding paths.
DDR Interface Dual 72-bit DDR4 with ECC at 3.2 GT/s - provides 51.2 GB/s aggregate memory bandwidth with fault-tolerant data integrity for large routing tables and session state.
Crypto Acceleration SEC engine up to 50 Gbps - offloads IPsec/AES-GCM encryption/decryption from CPU cores, preserving headroom for control-plane tasks.
Compression Throughput DCE engine up to 100 Gbps - enables line-rate LZ4/DEFLATE decompression for HTTP/HTTPS payload optimization in service chaining.
Ethernet Capacity Up to 114 Gbps L2 switching + 18 MACs supporting 1G/2.5G/10G/25G/40G/50G/100G PHYs - meets multi-tenant infrastructure port density and speed requirements.
SerDes Lanes 24 lanes configurable up to 25 Gbps per lane - allows flexible partitioning between PCIe, SATA, and Ethernet PHYs without external retimers.

Pinout & Package

Package: FC-PBGA with 1517 balls, 37 mm × 37 mm footprint, 0.8 mm ball pitch, RoHS-compliant, thermal lid-equipped.

Pin/Terminal Circuit Role Design Meaning
D1_MCK0 / D1_MCK0_B DDR4 Clock (differential) Primary clock pair for first DDR4 channel; requires matched trace length and controlled impedance (100 Ω diff) for setup/hold compliance at 1600 MHz.
SD3_RX0_P / SD3_RX0_N SerDes Lane 3 Receiver High-speed differential input supporting 25G-AUI/CAUI-4; connects directly to optical module CDR or retimer without AC coupling.
EC1_TXD0–EC1_TXD3 EC1 Ethernet Controller Data Out Four-lane RGMII TX interface driving external PHY; operates at 2.5 V with 1.6 ns skew tolerance across all four data lines.
IIC1_SDA / IIC1_SCL I²C Bus 1 Configurable 100 kHz / 400 kHz bus for PMIC, temperature sensor, and EEPROM communication; pulled up externally to 3.3 V.
RESET_REQ_B Warm Reset Request Active-low asynchronous input triggering full system reset while preserving DDR self-refresh state during firmware updates.

Key Features

Feature Design Value
Hardware Virtualization Support ARM MMU-500 and GIC-500 enable strict partitioning of CPU, memory, and I/O resources across multiple guest OS instances for NFV workloads.
IEEE 1588 Precision Time Protocol Hardware timestamping with sub-50 ns resolution on all 18 MACs ensures deterministic synchronization for fronthaul and industrial TSN applications.
Secure Boot & Trust Architecture QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip RAM for trusted code execution and immutable root-of-trust chain verification.
Flexible CAN-FD Interfaces Two CAN modules supporting ISO 11898-1:2015 Flexible Data-Rate up to 5 Mbps - used for chassis management and hardware monitoring in telecom shelf systems.
USB 3.0 Host Controllers Dual USB 3.0 controllers with integrated PHY support boot-from-USB and out-of-band firmware recovery without external transceivers.

Applications

5G Radio Unit (RU) Carrier-Grade Edge Router

Use Scenario: Real-time Layer 1/2 processing in Open RAN distributed units with CPRI/eCPRI front-haul termination.

IC Role / Device Role / Timing Role: Baseband controller executing DU software stack, managing eCPRI packet classification, FEC offload, and precise 1588-based fronthaul synchronization.

Use Value: 100 Gbps DCE acceleration enables real-time LDPC decoding; 24 SerDes lanes support dual 25G eCPRI links without retimers.

Use Scenario: Multi-service aggregation node handling BGP routing, IPsec tunneling, and subscriber QoS enforcement.

IC Role / Device Role / Timing Role: Control-plane processor and packet-forwarding engine with hardware-accelerated crypto and deep packet inspection via DPAA2 WRIOP.

Use Value: 50 Gbps SEC engine sustains 100K concurrent IPsec tunnels; 18 MACs allow 4× 25G uplinks + 12× 10G access ports.

Secure Industrial Gateway Military/Aerospace Communications Hub

Use Scenario: OT/IT convergence gateway enforcing TLS 1.3, Modbus/TCP firewalling, and OPC UA security policies in smart factories.

IC Role / Device Role / Timing Role: Trusted execution environment host using ARM TrustZone and NXP's 256 KB secure RAM for isolated key management and certificate validation.

Use Value: Hardware-enforced isolation prevents lateral movement between OT protocols; CAN-FD interfaces monitor fieldbus health in real time.

Use Scenario: SWaP-constrained airborne communications system requiring DO-254/DO-178C certifiable partitioning and radiation-tolerant operation.

IC Role / Device Role / Timing Role: Mission-critical processing unit executing encrypted SATCOM waveform stacks with deterministic interrupt latency under GIC-500 arbitration.

Use Value: Dual DDR4 ECC channels ensure memory resilience against single-event upsets; 8 MB L3 ECC protects cached routing state.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore network processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
LX2160A Same silicon die; LX2160SE72232B is a specific ordering variant with defined speed grade (2.2 GHz), thermal spec, and Pb-free packaging. No functional difference; LX2160SE72232B is the production-qualified part number for the 2.2 GHz speed bin with extended temperature range (-40°C to +105°C). Select LX2160SE72232B when guaranteed 2.2 GHz operation across industrial temperature and full qualification documentation are required.
LX2120A 12-core variant with 6 MB L2 cache; identical DPAA2, SerDes, DDR, and peripheral IP blocks but lower core count and reduced L3 bandwidth. Targeted at mid-tier edge routers and SD-WAN appliances where 12 cores meet control-plane demands but cost and power are constrained. Choose LX2120A only if application workload fits within 12 cores and 6 MB L2; not drop-in compatible due to different cfg_svr[0:1] strap configuration and thermal profile.

Compared with LX2160A (base die), LX2160SE72232B guarantees 2.2 GHz operation across extended temperature and includes full industrial qualification evidence; versus LX2120A, it delivers 33% more cores and 33% higher L3 bandwidth, enabling denser virtualized network function deployment without increasing board area.

Availability

LX2160SE72232B is available at Aetrix Electronics and suitable for 5G infrastructure, carrier-edge routing, and secure industrial gateway designs requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for LX2160SE72232B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and networking markets, with deep expertise in Arm-based SoCs and hardware-accelerated datapath architectures.

The LX2160SE72232B belongs to NXP's QorIQ LX series, designed specifically for high-performance, software-defined networking and edge computing applications demanding scalable acceleration, hardware-enforced security, and deterministic real-time performance.

FAQ

What is the maximum DDR4 data rate supported by the LX2160SE72232B?

The LX2160SE72232B supports DDR4-3200 operation, delivering 3.2 GT/s per pin across dual 72-bit interfaces. This translates to 51.2 GB/s aggregate bandwidth with full ECC protection. The device requires strict PCB layout adherence to JEDEC DDR4 specifications, including fly-by topology and on-die termination calibration sequences executed during boot.

Does the LX2160SE72232B support IEEE 1588 hardware timestamping on all Ethernet MACs?

Yes, the LX2160SE72232B provides full hardware timestamping capability on all 18 integrated Ethernet MACs, with sub-50 ns resolution and support for IEEE 1588-2008 (v2) profiles. Timestamp registers are accessible via memory-mapped I/O, and the PTP clock domain is synchronized to the system reference clock with jitter below 1 ps RMS.

How many PCIe Gen3 lanes does the LX2160SE72232B provide, and how are they allocated?

The LX2160SE72232B offers five PCIe Gen3 controllers: one x8 and four x4 configurations, totaling 24 lanes. These are drawn from its 24 SerDes lanes and can be dynamically allocated via strap pins and firmware configuration. No external switch is needed for common topologies like dual 10G NICs + NVMe storage + FPGA co-processor.

Is the LX2160SE72232B pin-compatible with other QorIQ LX family members like the LX2120A?

No, the LX2160SE72232B is not pin-compatible with the LX2120A or LX2080A. Although all share the same 1517-ball FC-PBGA package, ball assignments differ significantly-especially for DDR, SerDes, and power domains-to accommodate the LX2160A's higher core count, larger cache, and enhanced I/O bandwidth.

What security features are implemented in hardware on the LX2160SE72232B?

The LX2160SE72232B integrates QorIQ Platform Trust Architecture 3.0, including a 256 KB on-chip secure RAM, hardware root-of-trust with immutable boot ROM, secure boot flow with SHA-256/ECDSA verification, TrustZone-enabled memory isolation, and tamper-resistant key storage. All cryptographic operations execute inside the SEC engine without exposing keys to main memory.

LX2160SE72232B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
1517-BBGA, FCBGA
Series:
QorlQ LX2
Packaging:
Bulk
Product Status:
Obsolete
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
16 Core, 64-Bit
Speed:
2.2GHz
Co-Processors/DSP:
-
RAM Controllers:
DDR4 SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
-
Ethernet:
100Gbps (2)
SATA:
SATA 3.0 (4)
USB:
USB 3.0 (2) + PHY (2)
Voltage - I/O:
1.2V, 1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Supplier Device Package:
1517-FCPBGA (40x40)
Additional Interfaces:
CANbus, I2C, MMC/SD, SPI, UART

LX2160SE72232B FAQ

1.How can I place an order for LX2160SE72232B through Aetrix?

Please submit a Request for Quotation (RFQ) for LX2160SE72232B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LX2160SE72232B reliable?

The price and inventory of LX2160SE72232B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2160SE72232B is usually 5 days.

3.What payment methods are accepted for LX2160SE72232B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2160SE72232B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LX2160SE72232B?

LX2160SE72232B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LX2160SE72232B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LX2160SE72232B?

For technical support, including LX2160SE72232B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2160SE72232B requirements.

6.How does Aetrix verify that LX2160SE72232B is sourced from the original manufacturer or authorized distributors?

All LX2160SE72232B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2160SE72232B meets industry standards.

7.What is the process for return or replacement of LX2160SE72232B?

All LX2160SE72232B units undergo pre-shipment inspection (PSI). If there is an issue with LX2160SE72232B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LX2160SE72232B part is unused and in its original packaging.

Return procedure for LX2160SE72232B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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