NXP Semiconductors LX2160XC72232B
- Part No.:
- LX2160XC72232B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
LX2160XC72232B.pdf
- Description:
- IC MPU QORLQ 2.2GHZ 1517FCPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LX2160XC72232B from NXP is a 16-core Arm Cortex-A72 network processor operating up to 2.2 GHz, featuring dual 72-bit DDR4 controllers with ECC, 24 SerDes lanes at 25 Gbps, and DPAA2 datapath acceleration delivering 50 Gbps crypto and 100 Gbps compression throughput - deployed in carrier-grade edge routers and 5G baseband units.
For engineers reviewing the LX2160XC72232B datasheet, LX2160XC72232B pinout, LX2160XC72232B application, or LX2160XC72232B equivalent, key selection criteria include DDR4 ECC memory interface timing, SerDes lane mapping for 100G Ethernet CAUI-4/50GAUI-2, PCIe Gen3 x8/x4 configuration flexibility, and hardware virtualization support via Arm MMU-500.
Technical Context
The LX2160XC72232B implements a cache-coherent interconnect fabric running at up to 1500 MHz with 8 MB L3 cache and ECC-enabled on-chip memory mode. Its DPAA2 architecture integrates WRIOP packet parsing, SEC cryptography engine, DCE decompression unit, QDMA, and 2 MB packet express buffer - all synchronized under a unified management complex (MC).
It supports IEEE 1588 timestamping across 18 Ethernet MACs with multi-rate PHY interfaces including USXGMII, SFI, XFI, 100G CAUI-4, and 50G 50GAUI-2, while integrating Arm GIC-500 global interrupt controller, TrustZone security with 256 KB on-chip RAM, and dual CAN-FD controllers with flexible data-rate capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | 16× Arm Cortex-A72 @ up to 2.2 GHz; each with 48 KB L1 instruction + 32 KB L1 data cache |
| Memory Interface | Dual 72-bit DDR4 @ 3.2 GT/s with full ECC; supports error detection/correction for telecom-grade reliability |
| DPAA2 Acceleration | SEC crypto engine: 50 Gbps throughput; DCE compression/decompression: 100 Gbps peak |
| High-Speed I/O | 24 SerDes lanes configurable for 100G CAUI-4, 50G 50GAUI-2, 25G AUI, or PCIe Gen3 x8/x4 |
| Networking Interfaces | 18x Ethernet MACs supporting 1G/2.5G/10G/25G/40G/50G/100G rates; IEEE 1588 v2 precision time protocol |
| Security & Virtualization | Arm MMU-500 for hardware-enforced partitioning; QorIQ Trust Architecture 3.0 with 256 KB secure RAM |
Pinout & Package
Package: FC-PBGA, 1517-ball, 37 mm × 37 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1_MDQ00–D1_MDQ63 | DDR1 Data Bus (64-bit + 8-bit ECC) | 72-bit bidirectional data path for first DDR4 channel; requires matched-length routing for 3.2 GT/s signaling |
| D2_MDQ00–D2_MDQ59 | DDR2 Data Bus (64-bit + 8-bit ECC) | 72-bit bidirectional data path for second DDR4 channel; independent timing calibration from DDR1 |
| SD3_RX0_P/N – SD3_RX7_P/N | SerDes Lane 3 Receiver Differential Pairs | Eight 25 Gbps receive lanes supporting CAUI-4, 50GAUI-2, or PCIe Gen3; AC-coupled with internal termination |
| SD3_TX0_P/N – SD3_TX7_P/N | SerDes Lane 3 Transmitter Differential Pairs | Eight 25 Gbps transmit lanes; programmable pre-emphasis and swing for channel loss compensation |
| EC1_RXD0–EC1_RXD3 / EC1_TXD0–EC1_TXD3 | EC1 Ethernet Controller MDIO/MDC & RGMII Signals | First 4-lane RGMII interface supporting two 1 Gbps ports; 1.8 V I/O with internal delay calibration |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Virtualization | Arm MMU-500 enables secure, isolated VM execution with zero-software-overhead memory translation |
| Trust Architecture | 256 KB on-chip SRAM reserved for trusted firmware; tamper-detect circuitry with battery-backed monitoring |
| Flexible Clocking | Voltage ID (VID) support allows dynamic core voltage scaling for yield optimization and thermal management |
| Debug & Trace | High-speed trace port + run-control debug interface compliant with Arm CoreSight standards for real-time profiling |
| Peripheral Integration | Dual USB 3.0 + PHY, 8× I²C, 4× UART, FlexSPI, 3× SPI, 2× CAN-FD, and 2× eSDHC controllers reduce external component count |
Applications
| 5G Radio Unit (RU) | Multi-Service Edge Router |
|---|---|
Use Scenario: Real-time fronthaul processing in Open RAN deployments requiring deterministic latency and precise IEEE 1588 synchronization. IC Role / Device Role / Timing Role: Baseband processor handling CPRI/eCPRI packet processing, FEC offload, and time-sensitive networking (TSN) scheduling. Use Value: 24 SerDes lanes enable direct 25G/50G optical module interfacing; DPAA2 WRIOP delivers sub-100 ns packet classification latency. | Use Scenario: Aggregation of enterprise WAN links, SD-WAN tunnels, and encrypted traffic inspection at branch offices. IC Role / Device Role / Timing Role: Control-plane processor managing routing protocols and data-plane accelerator for IPsec/IKEv2 and TLS 1.3 decryption. Use Value: SEC crypto engine achieves 50 Gbps wire-speed encryption; dual DDR4 channels sustain >100 Gbps memory bandwidth for deep packet buffers. |
| Industrial Time-Sensitive Networking (TSN) | Secure Network Appliance |
Use Scenario: Deterministic industrial automation backbone synchronizing motion control, vision systems, and PLCs across distributed nodes. IC Role / Device Role / Timing Role: TSN-aware switch controller with IEEE 1588 timestamping, frame preemption, and cyclic queuing/shaping. Use Value: 18 integrated MACs support redundant ring topologies; hardware timestamping accuracy <±25 ns ensures sub-microsecond jitter. | Use Scenario: Next-generation firewall or UTM appliance performing concurrent threat inspection, DPI, and encrypted traffic analysis. IC Role / Device Role / Timing Role: Security enforcement point leveraging TrustZone isolation, secure boot, and hardware-accelerated decryption. Use Value: QorIQ Trust Architecture 3.0 isolates security monitor firmware; 256 KB secure RAM prevents side-channel leakage of keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore network processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP LX2120A | 12-core Cortex-A72; 6 MB L2 cache; identical DPAA2, SerDes, and peripheral set | Lower core count reduces software licensing cost and power envelope; suitable for mid-tier edge gateways | Select when 12 cores meet control-plane concurrency needs and thermal budget is constrained |
| NXP LX2080A | 8-core Cortex-A72; 8 MB L2 cache; same I/O and acceleration blocks but reduced SerDes lane count (16 lanes) | Targeted at compact SD-WAN CPE and secure IoT gateways where 100G connectivity is not required | Choose for space-constrained designs needing high L2 cache density and lower BOM cost |
Compared with LX2120A and LX2080A, the LX2160XC72232B provides maximum core count and SerDes bandwidth for full 100G line-card scalability, while retaining binary compatibility in toolchain, drivers, and DPAA2 software stack - enabling tiered product family development without architectural rework.
Availability
LX2160XC72232B is available at Aetrix Electronics and suitable for 5G infrastructure, industrial TSN, and secure network appliance applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LX2160XC72232B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and networking markets.
The Layerscape LX series targets high-performance networking and edge computing, designed to unify control-plane processing, data-path acceleration, and hardware-enforced security in a single SoC platform.
FAQ
What is the maximum DDR4 data rate supported by the LX2160XC72232B?
The LX2160XC72232B supports DDR4 SDRAM at up to 3.2 GT/s across two independent 72-bit channels with full ECC. Each channel operates with differential clocking and on-die termination, enabling reliable operation in high-density memory subsystems used in telecom and datacom equipment. The LX2160XC72232B implements JEDEC-compliant DDR4 timing parameters including tRCD, tRP, and tRFC for LPDDR4-compatible configurations.
Does the LX2160XC72232B support PCIe Gen4?
No, the LX2160XC72232B supports PCIe Gen3 only - with two 8-lane controllers and four 4-lane controllers, all compliant with PCI Express Base Specification Revision 3.1. It does not implement Gen4 PHY or data-link layers. Designs requiring Gen4 must use alternative processors such as NXP's later LX22xx series or competitor offerings. The LX2160XC72232B's SerDes lanes are optimized for Ethernet and SATA 3.0, not PCIe Gen4 signaling.
How many Ethernet MACs does the LX2160XC72232B integrate, and what speeds do they support?
The LX2160XC72232B integrates 18 Ethernet MACs supporting speeds from 1G to 100G via multiple physical layer interfaces: SGMII, XFI, SFI, USXGMII, CAUI-4, 50GAUI-2, and 25G-AUI. These MACs are fully IEEE 1588 v2-compliant with hardware timestamping engines accurate to ±25 ns. The LX2160XC72232B routes MAC traffic through its DPAA2 switching fabric, enabling non-blocking 114 Gbps L2 switching capacity.
Is the LX2160XC72232B pin-compatible with other Layerscape LX devices like the LX2120A or LX2080A?
Yes, the LX2160XC72232B shares the same 1517-ball FC-PBGA package and pinout with the LX2120A and LX2080A. Differences between models are configured via TEST_SEL_B and cfg_svr[0:1] pins during power-on reset, allowing board-level reuse across performance tiers. This enables scalable hardware design where the same PCB can host LX2080A, LX2120A, or LX2160XC72232B based on firmware and thermal constraints.
What security features are implemented in hardware on the LX2160XC72232B?
The LX2160XC72232B implements QorIQ Platform Trust Architecture 3.0, including Arm TrustZone, secure boot with immutable ROM-based root-of-trust, 256 KB on-chip SRAM for trusted firmware execution, battery-backed tamper detection, and hardware cryptographic accelerators (SEC) supporting AES-GCM, SHA-2, RSA-4096, and ECC. All security functions are accessible via standardized APIs in the Layerscape SDK, and the LX2160XC72232B enforces isolation between secure and non-secure worlds using Arm MMU-500.
LX2160XC72232B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1517-BBGA, FCBGA
- Series:
- QorlQ LX2
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A72
- Number of Cores/Bus Width:
- 16 Core, 64-Bit
- Speed:
- 2.2GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- -
- Ethernet:
- 100Gbps (2)
- SATA:
- SATA 3.0 (4)
- USB:
- USB 3.0 (2) + PHY (2)
- Voltage - I/O:
- 1.2V, 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Secure Boot, TrustZone®
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCPBGA (40x40)
- Additional Interfaces:
- CANbus, I2C, MMC/SD, SPI, UART
LX2160XC72232B FAQ
1.How can I place an order for LX2160XC72232B through Aetrix?
Please submit a Request for Quotation (RFQ) for LX2160XC72232B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LX2160XC72232B reliable?
The price and inventory of LX2160XC72232B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2160XC72232B is usually 5 days.
3.What payment methods are accepted for LX2160XC72232B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2160XC72232B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LX2160XC72232B?
LX2160XC72232B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LX2160XC72232B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LX2160XC72232B?
For technical support, including LX2160XC72232B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2160XC72232B requirements.
6.How does Aetrix verify that LX2160XC72232B is sourced from the original manufacturer or authorized distributors?
All LX2160XC72232B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2160XC72232B meets industry standards.
7.What is the process for return or replacement of LX2160XC72232B?
All LX2160XC72232B units undergo pre-shipment inspection (PSI). If there is an issue with LX2160XC72232B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LX2160XC72232B part is unused and in its original packaging.
Return procedure for LX2160XC72232B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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