NXP Semiconductors LX2160XE72029B
- Part No.:
- LX2160XE72029B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
LX2160XE72029B.pdf
- Description:
- IC MPU QORLQ LX2 2GHZ 1517FCPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LX2160XE72029B from NXP is a 16-core Arm Cortex-A72 network processor operating up to 2.2 GHz, featuring dual 72-bit DDR4 memory controllers with ECC, 24 SerDes lanes supporting up to 25 Gbps, and integrated DPAA2 datapath acceleration delivering 50 Gbps crypto and 100 Gbps compression throughput. It serves as the central control and packet processing engine in high-end networking equipment including 100G routers and telecom infrastructure.
For engineers reviewing the LX2160XE72029B datasheet, LX2160XE72029B pinout, LX2160XE72029B application, or LX2160XE72029B equivalent, key selection criteria include DDR4 ECC controller bandwidth, SerDes lane count and speed grade, DPAA2 acceleration capacity (SEC/DCE), IEEE 1588 timing precision, and PCIe Gen3 x8/x4 configuration flexibility.
Technical Context
The LX2160XE72029B implements a cache-coherent interconnect fabric running at up to 1500 MHz with 8 MB L3 cache and ECC-protected on-chip memory mode. Its 16 Cortex-A72 cores each feature 48 KB L1 instruction and 32 KB L1 data caches, backed by shared 8 MB L2 cache across all cores.
DPAA2 architecture provides hardware-accelerated packet parsing, classification, queue management, and switching (114 Gbps L2), alongside dedicated SEC (50 Gbps) and DCE (100 Gbps) engines. Ethernet support spans 1G to 100G via USXGMII, CAUI-4, 50GAUI-2, and XLAUI interfaces with full IEEE 1588 timestamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | 16 × Arm Cortex-A72 cores, enabling parallel real-time packet processing and control-plane execution in multi-service edge routers. |
| CPU Frequency | Up to 2.2 GHz - determines maximum instruction throughput per core for control software and virtualized service hosting. |
| Memory Interface | Dual 72-bit DDR4 SDRAM controllers with ECC - supports up to 2× 64-bit + 8-bit ECC channels, enabling >50 GB/s aggregate memory bandwidth with error resilience. |
| DPAA2 Acceleration | SEC crypto at 50 Gbps and DCE compression/decompression at 100 Gbps - offloads encryption and payload reduction from CPU cores in secure tunneling and WAN optimization. |
| SerDes Capability | 24 lanes configurable up to 25 Gbps - enables flexible high-speed connectivity to 100G QSFP28, 50G SFP56, and 25G SFP28 optical modules or backplane interfaces. |
| Ethernet MACs | Up to 18 IEEE 1588-compliant MACs supporting USXGMII, CAUI-4, 50GAUI-2, 25G-AUI, and XLAUI - allows single-chip aggregation of multiple 1G/10G/25G/40G/50G/100G ports with precise time synchronization. |
| PCIe Interfaces | Two Gen3 x8 and four Gen3 x4 controllers with SR-IOV support - enables direct attachment of high-throughput NICs, accelerators, or storage controllers with hardware-assisted virtualization. |
Pinout & Package
The LX2160XE72029B is housed in a 1517-ball FC-PBGA package with 1.0 mm ball pitch, designed for high-density routing and thermal dissipation in carrier-grade systems. Pin assignments are organized into functional groups including DDR1/DDR2, SerDes banks (Serdes1–Serdes3), Ethernet MI, USB PHY, EC1/EC2, I²C, SPI, UART, JTAG, and power/ground nets.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1_MDQ00–D1_MDQ63 | DDR1 Data Bus (64-bit + 8-bit ECC) | Primary 72-bit bidirectional data interface for first DDR4 channel; requires matched-length routing and termination for signal integrity at 3.2 GT/s. |
| D1_MCK0–D1_MCK3 | DDR1 Clock (Differential) | Four differential clock pairs driving DDR1 address/command/data; critical for timing closure and jitter tolerance in high-speed memory subsystems. |
| SD3_RX0_P/N–SD3_RX7_P/N | SerDes3 Receiver Lanes | Eight differential receive lanes supporting protocols including PCIe, SATA, SGMII, and USXGMII; configured via SerDes register programming. |
| SD3_TX0_P/N–SD3_TX7_P/N | SerDes3 Transmitter Lanes | Eight differential transmit lanes with programmable pre-emphasis and equalization; used for uplink/downlink high-speed serial links. |
| EMI1_MDIO / EMI1_MDC | Ethernet Management Interface | Shared MDIO/MDC bus for configuring up to 18 Ethernet PHYs; supports auto-negotiation, link status, and IEEE 1588 register access. |
| JTAG_TCK / TMS / TDI / TDO | IEEE 1149.1 Boundary Scan | Standard debug/test interface for silicon validation, board-level test, and in-system programming of boot firmware and security fuses. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Virtualization Support | Arm MMU-500 enforcement enables secure partitioning of CPU, memory, and I/O resources across multiple VMs or containers without hypervisor overhead. |
| QorIQ Trust Architecture 3.0 | 256 KB on-chip RAM for trusted execution environments (TEE), supporting secure boot, cryptographic key storage, and tamper detection with battery-backed monitoring. |
| Global Interrupt Controller | Arm GIC-500 manages >1000 interrupt sources with priority arbitration and message-based distribution across all 16 cores for deterministic real-time response. |
| Flexible Serial Peripheral Interface | FlexSPI controller supports XIP (execute-in-place) from external NOR/NAND flash, reducing boot latency and simplifying firmware update architecture. |
| Energy-Efficient Ethernet | IEEE 802.3az (EEE) support reduces dynamic power during low-traffic periods on RGMII and SGMII interfaces without compromising latency or throughput. |
Applications
| 5G Radio Unit (RU) Baseband Processing | Multi-Service Edge Router |
|---|---|
Use Scenario: Real-time baseband signal processing, fronthaul transport (eCPRI), and Layer 2 switching in Open RAN compliant 5G RU units. IC Role / Device Role / Timing Role: Central packet processing and timing synchronization unit with IEEE 1588 PTP grandmaster capability and USXGMII fronthaul interface. Use Value: Enables deterministic sub-microsecond timing accuracy across distributed RU deployments while consolidating control, transport, and switching functions onto one SoC. |
Use Scenario: Aggregation of 25G/100G uplinks with deep packet inspection, IPsec encryption, and QoS scheduling in enterprise and service provider edge routers. IC Role / Device Role / Timing Role: Control-plane processor and hardware-accelerated data-path engine using DPAA2 WRIOP and SEC blocks for line-rate crypto and classification. Use Value: Delivers 50 Gbps wire-speed IPsec and 100 Gbps lossless compression without CPU core saturation, reducing BOM cost and power per Gbps. |
| Industrial Time-Sensitive Networking (TSN) Gateway | Secure Network Function Virtualization (NFV) Platform |
Use Scenario: Deterministic bridging between PROFINET, EtherCAT, and IEEE 802.1AS TSN networks in smart factory automation systems. IC Role / Device Role / Timing Role: Precision time-aware switch with hardware timestamping, traffic shaping, and frame preemption using integrated Ethernet MACs and DPAA2 QMan. Use Value: Achieves <100 ns timestamp resolution and <1 µs end-to-end jitter across mixed industrial protocols, meeting IEC 61784-2 compliance requirements. |
Use Scenario: Hosting virtualized vFW, vCPE, and SD-WAN functions on white-box servers with hardware-enforced isolation and encrypted memory regions. IC Role / Device Role / Timing Role: Trusted execution host with Arm TrustZone, QorIQ Secure Boot, and MMU-500 IOMMU for memory and peripheral protection across VMs. Use Value: Provides certified hardware root-of-trust and runtime attestation for PCI-DSS and NIST SP 800-193 compliance in regulated cloud-edge deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore network processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LX2120A | 12-core Cortex-A72, 6 MB L2 cache, same DPAA2 and SerDes architecture but reduced core count and memory bandwidth. | Suitable for mid-tier 25G/40G aggregation where full 16-core capacity is not required; lower TDP and cost. | Select when system workload fits within 12 cores and DDR bandwidth demand is ≤80% of LX2160XE72029B capability. |
| LX2080A | 8-core Cortex-A72, 8 MB L2 cache, identical peripheral set but fewer SerDes lanes and PCIe endpoints than LX2160XE72029B. | Targeted at compact 10G/25G branch routers and embedded security appliances needing high L2 cache density over raw throughput. | Choose for space-constrained designs requiring strong single-thread performance and minimal SerDes usage, accepting reduced I/O scalability. |
Compared with LX2120A and LX2080A, the LX2160XE72029B delivers highest aggregate throughput via 16 cores, dual DDR4 channels, and 24 SerDes lanes - making it optimal for 100G+ control-and-forwarding convergence where both compute density and I/O bandwidth are limiting factors.
Availability
LX2160XE72029B is available at Aetrix Electronics and suitable for 5G infrastructure, telecom edge routing, industrial TSN gateways, and secure NFV platforms requiring stable component supply and long-term roadmap alignment.
Supply support for LX2160XE72029B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, IoT, and networking markets, with deep expertise in Arm-based SoCs and trusted execution technologies.
The LX2160XE72029B belongs to NXP's Layerscape LX series - a family of software-aware, core-agnostic network processors designed specifically for scalable, high-performance data path acceleration in next-generation wired and wireless infrastructure.
FAQ
What is the maximum DDR4 data rate supported by the LX2160XE72029B?
The LX2160XE72029B supports DDR4 SDRAM at 3.2 GT/s across two independent 72-bit channels (64-bit data + 8-bit ECC). This enables theoretical peak bandwidth of ~51.2 GB/s per channel, validated under JEDEC-compliant timing and voltage conditions specified in the official NXP datasheet Rev. 3 (09/2021).
Does the LX2160XE72029B support IEEE 1588 Precision Time Protocol in hardware?
Yes, the LX2160XE72029B integrates IEEE 1588 timestamping logic directly into all 18 Ethernet MACs. Hardware timestamping occurs at the PHY interface boundary with sub-ns resolution, enabling transparent clock correction and master/slave synchronization without CPU intervention - essential for TSN and 5G fronthaul timing.
How many PCIe Gen3 lanes does the LX2160XE72029B provide, and what configurations are supported?
The LX2160XE72029B provides two PCIe Gen3 x8 controllers and four PCIe Gen3 x4 controllers, totaling 32 lanes. Configurations include bifurcation (e.g., x8 → x4+x4), SR-IOV for virtualized endpoint sharing, and root complex or endpoint mode - all programmable via RCW and SerDes register settings per NXP AN5437.
Is the LX2160XE72029B pin-compatible with other Layerscape LX processors like LX2120A or LX2080A?
No, the LX2160XE72029B is not pin-compatible with LX2120A or LX2080A. Although all three share the same 1517-ball FC-PBGA package footprint, ball function mapping differs significantly - especially for DDR, SerDes, and PCIe signals - requiring unique PCB layouts for each variant.
What security features are implemented in the LX2160XE72029B for secure boot and runtime protection?
The LX2160XE72029B implements QorIQ Platform Trust Architecture 3.0, including immutable ROM-based boot ROM, SHA-256/ECDSA signature verification, 256 KB on-chip secure RAM, battery-backed tamper detection, and Arm TrustZone with MMU-500 IOMMU for peripheral and memory isolation - all enforced before first instruction fetch.
LX2160XE72029B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1517-BBGA, FCBGA
- Series:
- QorlQ LX2
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A72
- Number of Cores/Bus Width:
- 16 Core, 64-Bit
- Speed:
- 2GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- -
- Ethernet:
- 100Gbps (2)
- SATA:
- SATA 3.0 (4)
- USB:
- USB 3.0 (2) + PHY (2)
- Voltage - I/O:
- 1.2V, 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Secure Boot, TrustZone®
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCPBGA (40x40)
- Additional Interfaces:
- CANbus, I2C, MMC/SD, SPI, UART
LX2160XE72029B FAQ
1.How can I place an order for LX2160XE72029B through Aetrix?
Please submit a Request for Quotation (RFQ) for LX2160XE72029B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LX2160XE72029B reliable?
The price and inventory of LX2160XE72029B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2160XE72029B is usually 5 days.
3.What payment methods are accepted for LX2160XE72029B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2160XE72029B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LX2160XE72029B?
LX2160XE72029B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LX2160XE72029B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LX2160XE72029B?
For technical support, including LX2160XE72029B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2160XE72029B requirements.
6.How does Aetrix verify that LX2160XE72029B is sourced from the original manufacturer or authorized distributors?
All LX2160XE72029B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2160XE72029B meets industry standards.
7.What is the process for return or replacement of LX2160XE72029B?
All LX2160XE72029B units undergo pre-shipment inspection (PSI). If there is an issue with LX2160XE72029B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LX2160XE72029B part is unused and in its original packaging.
Return procedure for LX2160XE72029B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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