NXP Semiconductors LX2160XE72232B
- Part No.:
- LX2160XE72232B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
LX2160XE72232B.pdf
- Description:
- IC MPU QORLQ 2.2GHZ 1517FCPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LX2160XE72232B from NXP is a 16-core Arm Cortex-A72 network processor operating up to 2.2 GHz, featuring dual 72-bit DDR4 memory controllers with ECC, 24 SerDes lanes supporting up to 25 Gbps, and DPAA2 datapath acceleration delivering 50 Gbps crypto and 100 Gbps compression throughput. It targets high-throughput networking infrastructure including 5G baseband units and enterprise edge routers.
For engineers reviewing the LX2160XE72232B datasheet, LX2160XE72232B pinout, LX2160XE72232B application, or LX2160XE72232B equivalent, key selection criteria include DDR4 ECC interface timing compliance, SerDes lane configuration flexibility, IEEE 1588 timestamping accuracy across 18 Ethernet MACs, and hardware virtualization support via Arm MMU-500 for multi-tenant service deployment.
Technical Context
The LX2160XE72232B implements a cache-coherent interconnect fabric running at up to 1500 MHz with 8 MB L3 cache and ECC-protected on-chip memory mode. Its DPAA2 architecture integrates WRIOP packet parsing, SEC cryptography engine, DCE compression/decompression, QDMA, and MC management complex - all coordinated through a unified 2 MB packet express buffer.
It supports heterogeneous high-speed I/O including two PCIe Gen3 x8 controllers with SR-IOV, four PCIe Gen3 x4 controllers, four SATA 3.0 interfaces, and dual USB 3.0 PHYs. Ethernet connectivity spans 1G to 100G via SGMII, XFI, SFI, USXGMII, CAUI-4, 50GAUI-2, and XLAUI interfaces, all with IEEE 1588 v2 precision time protocol support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | 16× Arm Cortex-A72 @ up to 2.2 GHz; enables parallel packet processing and control-plane offload in telecom/datacom systems. |
| Memory Interface | Dual 72-bit DDR4 @ 3.2 GT/s with full ECC; supports ≥128 GB capacity with error correction critical for carrier-grade reliability. |
| DPAA2 Acceleration | SEC crypto: 50 Gbps; DCE compression: 100 Gbps; eliminates CPU bottlenecks in encrypted tunneling and data reduction pipelines. |
| SerDes Lanes | 24 lanes configurable up to 25 Gbps; enables flexible 100G/50G/40G/25G Ethernet, PCIe, SATA, and USXGMII physical layer mapping. |
| Ethernet MACs | Up to 18 IEEE 1588-compliant MACs with USXGMII, SGMII, XFI, SFI, CAUI-4, and XLAUI support; allows single-chip aggregation of multi-rate optical and copper interfaces. |
| Peripheral Integration | 2× USB 3.0 + PHY, 2× CAN-FD, 8× I²C, 4× UART, 2× eSDHC, FlexSPI, and GPIO; reduces external component count in embedded networking platforms. |
| Security & Trust | QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip RAM for trusted execution; enables secure boot, runtime attestation, and tamper detection. |
Pinout & Package
Package: FC-PBGA, 1517-ball, 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant. Thermal design requires heatsink mounting per NXP's recommended thermal interface materials and temperature diode monitoring.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1_MDQS00–D1_MDQS17 | DDR1 Data Strobe (x18) | Source-synchronous strobes for 72-bit DDR4 channel 1; critical for timing closure at 3.2 GT/s with ±10 ps skew budget. |
| SD3_RX0_P/N–SD3_RX7_P/N | SerDes3 Differential RX (x8) | Configurable 25 Gbps receive lanes supporting CAUI-4, 50GAUI-2, or USXGMII; requires AC-coupled 100 Ω differential routing. |
| EC1_TXD0–EC1_TXD3 | Ethernet Controller 1 Data Out | GMII/RGMII transmit signals for first 4-port Ethernet group; supports 1000Base-X and 1000Base-KX PHY interfacing. |
| IIC1_SDA/IIC1_SCL | I²C Bus 1 Data/Clock | System management interface for PMIC, temperature sensors, and EEPROM configuration; operates at 400 kHz standard mode. |
| USB1_RX_P/N, USB1_TX_P/N | USB 3.0 Differential Pair | Integrated USB 3.0 PHY interface; supports SuperSpeed (5 Gbps) operation without external transceiver. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Virtualization | Arm MMU-500 enforcement enables strict partitioning of CPU, memory, and I/O resources across VMs - essential for NFV and containerized network functions. |
| IEEE 1588 Timestamping | Sub-50 ns timestamp resolution across all 18 MACs with hardware PTP event capture; meets ITU-T G.8265.1 phase sync requirements for 5G fronthaul. |
| DPAA2 Queue Management | Hardware-accelerated queue orchestration with dynamic load balancing across cores; eliminates software scheduler latency in real-time traffic shaping. |
| Voltage ID (VID) Support | Dynamic core voltage scaling via VID pins improves yield and power efficiency across process corners without firmware intervention. |
| Trust Architecture | 256 KB on-chip secure RAM + battery-backed tamper detect circuitry provides root-of-trust for secure boot and runtime integrity verification. |
Applications
| 5G Radio Unit (RU) | Enterprise Edge Router |
|---|---|
Use Scenario: Real-time baseband processing and fronthaul transport in Open RAN compliant radio units. IC Role / Device Role / Timing Role: Primary baseband processor handling Layer 1 PHY acceleration, CPRI/eCPRI encapsulation, and precise 1588-based synchronization. Use Value: 18 IEEE 1588 MACs and sub-50 ns timestamping ensure deterministic fronthaul latency required by O-RAN WG4 specifications. |
Use Scenario: Multi-gigabit branch office routing with SD-WAN, firewall, and IPS services. IC Role / Device Role / Timing Role: Control and data plane SoC managing routing tables, encrypted tunnels, and stateful packet inspection. Use Value: 50 Gbps SEC crypto and 100 Gbps DCE acceleration enable line-rate IPsec and HTTP compression without CPU saturation. |
| Network Function Virtualization (NFV) Platform | Industrial Time-Sensitive Networking (TSN) Gateway |
Use Scenario: Carrier-grade white-box server hosting vBRAS, vEPC, and vCPE workloads. IC Role / Device Role / Timing Role: Virtualized infrastructure host with hardware-assisted IOMMU isolation and SR-IOV PCIe passthrough. Use Value: Dual PCIe Gen3 x8 controllers and Arm MMU-500 allow direct GPU/FPGA attachment and strict VM resource partitioning. |
Use Scenario: Deterministic bridging between industrial Ethernet protocols (PROFINET, EtherCAT) and TSN-aware backbones. IC Role / Device Role / Timing Role: Precision timing gateway synchronizing multiple industrial networks using IEEE 1588 boundary clock functionality. Use Value: Hardware timestamping on all 18 MACs enables sub-microsecond synchronization accuracy across heterogeneous fieldbus domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore network processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LX2120A | 12-core Cortex-A72, 6 MB L2 cache, same DPAA2 and I/O peripherals; lower thermal envelope (15W vs 25W). | Targeted at space-constrained edge nodes where full 16-core throughput is unnecessary. | Select when system-level performance requirements fit within 75% of LX2160XE72232B's compute bandwidth and power budget is constrained. |
| LX2080A | 8-core Cortex-A72, 8 MB L2 cache, identical SerDes and Ethernet feature set but reduced PCIe/SATA lane count. | Suitable for cost-sensitive access gateways requiring robust 100G Ethernet but minimal control-plane density. | Choose when DDR4 bandwidth and 18-MAC 1588 support are retained, but core count and PCIe expansion can be scaled down. |
Compared with LX2120A and LX2080A, the LX2160XE72232B delivers highest aggregate throughput for control+data plane convergence, while LX2120A offers better power efficiency per core and LX2080A provides lowest BOM cost for fixed-function 100G edge deployments.
Availability
LX2160XE72232B is available at Aetrix Electronics and suitable for 5G infrastructure, enterprise routing, and industrial TSN gateway applications requiring stable component supply, long lifecycle support, and traceable sourcing.
Supply support for LX2160XE72232B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The Layerscape LX series targets high-performance networking SoCs with integrated datapath acceleration, designed specifically for scalable, software-defined telecom and enterprise infrastructure platforms.
FAQ
What is the maximum DDR4 data rate supported by the LX2160XE72232B?
The LX2160XE72232B supports DDR4 memory at 3.2 GT/s across two independent 72-bit channels with full ECC protection. This enables sustained memory bandwidth exceeding 51 GB/s, validated under JEDEC JESD79-4 specifications with NXP's reference layout guidelines and signal integrity simulations.
Does the LX2160XE72232B support PCIe Gen4?
No, the LX2160XE72232B supports PCIe Gen3 only - with two x8 controllers and four x4 controllers. All PCIe interfaces comply with PCI Express Base Specification Revision 3.1 and support SR-IOV for virtualized environments, but lack Gen4 16 GT/s signaling capability.
How many independent Ethernet PHY interfaces does the LX2160XE72232B natively support?
The LX2160XE72232B provides 18 IEEE 1588-compliant Ethernet MACs with flexible physical layer mapping. It supports up to 18 independent PHY connections via SGMII, USXGMII, XFI, SFI, CAUI-4, 50GAUI-2, and XLAUI, though actual PHY count depends on SerDes lane allocation and board-level transceiver selection.
Is hardware virtualization implemented in the LX2160XE72232B?
Yes, the LX2160XE72232B integrates Arm MMU-500 for hardware-enforced memory and I/O virtualization. This enables secure VM isolation, nested page tables, and SR-IOV for direct device assignment - confirmed in NXP's Layerscape LX2160A Reference Manual Rev. 3, Section 4.2.3.
What security features are embedded in the LX2160XE72232B?
The LX2160XE72232B includes QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip secure RAM, battery-backed tamper detection, secure boot ROM, TrustZone-enabled execution environment, and hardware cryptographic accelerators (SEC) supporting AES-GCM, SHA-2, and RSA up to 4096-bit keys - all documented in the Security chapter of the LX2160A Data Sheet Rev. 3.
LX2160XE72232B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1517-BBGA, FCBGA
- Series:
- QorlQ LX2
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A72
- Number of Cores/Bus Width:
- 16 Core, 64-Bit
- Speed:
- 2.2GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- -
- Ethernet:
- 100Gbps (2)
- SATA:
- SATA 3.0 (4)
- USB:
- USB 3.0 (2) + PHY (2)
- Voltage - I/O:
- 1.2V, 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Secure Boot, TrustZone®
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCPBGA (40x40)
- Additional Interfaces:
- CANbus, I2C, MMC/SD, SPI, UART
LX2160XE72232B FAQ
1.How can I place an order for LX2160XE72232B through Aetrix?
Please submit a Request for Quotation (RFQ) for LX2160XE72232B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LX2160XE72232B reliable?
The price and inventory of LX2160XE72232B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2160XE72232B is usually 5 days.
3.What payment methods are accepted for LX2160XE72232B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2160XE72232B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LX2160XE72232B?
LX2160XE72232B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LX2160XE72232B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LX2160XE72232B?
For technical support, including LX2160XE72232B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2160XE72232B requirements.
6.How does Aetrix verify that LX2160XE72232B is sourced from the original manufacturer or authorized distributors?
All LX2160XE72232B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2160XE72232B meets industry standards.
7.What is the process for return or replacement of LX2160XE72232B?
All LX2160XE72232B units undergo pre-shipment inspection (PSI). If there is an issue with LX2160XE72232B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LX2160XE72232B part is unused and in its original packaging.
Return procedure for LX2160XE72232B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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