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NXP Semiconductors LX2160XN72232B

Part No.:
LX2160XN72232B
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixLX2160XN72232B.pdf
Description:
IC MPU QORLQ 2.2GHZ 1517FCPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,763

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Product details

Overview

LX2160XN72232B from NXP is a 16-core Arm Cortex-A72 network processor operating up to 2.2 GHz, featuring dual 72-bit DDR4 memory controllers with ECC, 24 SerDes lanes (up to 25 Gbps), and DPAA2 datapath acceleration delivering 50 Gbps crypto and 100 Gbps compression throughput. It targets high-throughput networking infrastructure including 100G Ethernet edge routers and secure telecom gateways.

For engineers reviewing the LX2160XN72232B datasheet, LX2160XN72232B pinout, LX2160XN72232B application, or LX2160XN72232B equivalent, key selection criteria include DDR4 ECC controller bandwidth, SerDes lane count and speed, DPAA2 acceleration capacity, IEEE 1588 timestamping support, and Arm MMU-500 virtualization compliance.

Technical Context

The LX2160XN72232B implements a cache-coherent interconnect fabric running at up to 1500 MHz with 8 MB L3 cache and ECC-protected on-chip memory mode. Its DPAA2 architecture integrates WRIOP packet parsing, SEC cryptography engine, DCE compression/decompression block, QDMA, and 2 MB packet express buffer for deterministic data path offload.

It supports 18 Ethernet MACs with multi-rate PHY interfaces including CAUI-4 (100G), 50GAUI-2, 25G-AUI, USXGMII, and SGMII, plus two PCIe Gen3 x8 controllers with SR-IOV and four PCIe Gen3 x4 controllers - all managed via Arm GIC-500 global interrupt controller and hardware-enforced partitioning using Arm MMU-500.

Key Specifications

Parameter Value and Actual Design Meaning
Core Count & Type 16× Arm Cortex-A72 cores, each with 48 KB L1 instruction + 32 KB L1 data cache; enables parallel packet processing and control-plane scalability.
Max Core Frequency 2.2 GHz; delivers high single-thread performance for real-time routing, firewall, and TLS termination tasks.
DDR Interface Dual 72-bit (64+8 ECC) DDR4 controllers at 3.2 GT/s; provides >51 GB/s aggregate memory bandwidth with error correction for carrier-grade reliability.
DPAA2 Acceleration SEC crypto up to 50 Gbps, DCE compression/decompression up to 100 Gbps; offloads encryption and payload optimization from CPU cores.
SerDes Lanes 24 lanes configurable up to 25 Gbps per lane; supports 100G Ethernet (CAUI-4), 50G (50GAUI-2), 40G (XLAUI), and 25G/10G/1G PHY interfacing.
PCIe Interfaces Two Gen3 x8 controllers + four Gen3 x4 controllers, all supporting SR-IOV; enables high-bandwidth attachment of NICs, accelerators, and storage controllers.
Ethernet MACs Up to 18 IEEE 1588-capable MACs with USXGMII, SGMII, XFI, SFI, and KR support; allows flexible multi-speed port aggregation in white-box switches.

Pinout & Package

Package: FC-PBGA, 1517-ball, 35 mm × 35 mm, 0.8 mm pitch. Thermal design requires mechanical mounting with heatsink interface per NXP's recommended thermal model (Rev. 3, Section 5).

Pin/Terminal Circuit Role Design Meaning
D1_MDQ00–D1_MDQ63 DDR1 Data Bus (64-bit + 8 ECC) High-speed bidirectional data lines for first DDR4 channel; require matched-length routing and on-die termination calibration.
D1_MCK0–D1_MCK3 DDR1 Clock (differential) Source-synchronous clock pair per DDR rank; critical for timing closure at 3.2 GT/s; must be routed as controlled-impedance differential pair.
EC1_RXD0–EC1_RXD3 Ethernet Controller 1 Receive Data 4-lane RGMII receive interface; supports 1 Gbps full-duplex operation with precise 2 ns skew control between data and clock.
SD3_TX0_P/N–SD3_TX7_P/N SerDes Lane 3 Transmitter Eight high-speed differential TX lanes supporting 25 Gbps PAM4 or NRZ; require AC-coupling capacitors and 100 Ω differential PCB trace impedance.
USB1_D_P/USB1_D_M USB 3.0 Data Differential Pair SuperSpeed USB 3.0 interface with integrated PHY; supports host/device roles and requires 90 Ω differential routing and ESD protection.

Key Features

Feature Design Value
Hardware Virtualization Arm MMU-500 enforces memory isolation and partitioning across VMs, enabling secure multi-tenant NFV deployments without hypervisor overhead.
Trust Architecture QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip RAM for trusted execution; supports secure boot, runtime attestation, and tamper detection.
IEEE 1588 Precision Timing Hardware timestamping in all 18 Ethernet MACs with sub-50 ns accuracy; eliminates software jitter for industrial TSN and telecom synchronization.
Flexible I/O Two CAN-FD modules, eight I²C controllers, four UARTs, FlexSPI, three SPIs, and GPIO - enables integration of sensors, PMICs, and legacy peripherals in edge systems.
Power Management Voltage ID (VID) support enables dynamic core voltage scaling; combined with per-core power gating, reduces idle power by >40% vs fixed-VDD designs.

Applications

5G Radio Unit (RU) Multi-Service Edge Router

Use Scenario: Real-time Layer 1/2 processing for O-RAN compliant 5G RU with fronthaul (eCPRI) and midhaul transport.

IC Role / Device Role / Timing Role: Baseband processor executing CPRI/eCPRI encapsulation, FEC, and radio scheduler with deterministic latency.

Use Value: 24× 25 Gbps SerDes lanes directly interface to optical modules; DPAA2 offloads eCPRI packet segmentation and CRC generation.

Use Scenario: Carrier-grade edge router aggregating 100G uplinks, 40G/25G downlinks, and subscriber-facing 10G PON or xDSL interfaces.

IC Role / Device Role / Timing Role: Control and forwarding plane SoC managing routing tables, ACLs, QoS, and encrypted traffic via IPsec/TLS.

Use Value: Dual DDR4 ECC channels sustain >50 Gbps forwarding; 18× IEEE 1588 MACs enable precise time sync for mobile backhaul SLA compliance.

Secure SD-WAN Appliance Industrial Time-Sensitive Networking Gateway

Use Scenario: Branch office appliance performing encrypted overlay routing, application-aware traffic steering, and zero-trust policy enforcement.

IC Role / Device Role / Timing Role: Application processor running Linux-based SD-WAN stack with hardware-accelerated IPsec and TLS 1.3.

Use Value: SEC engine delivers 50 Gbps crypto throughput; Arm virtualization isolates tenant VRFs and firewall instances with hardware-enforced boundaries.

Use Scenario: Factory-floor gateway synchronizing PLCs, HMIs, and motion controllers over TSN-enabled Ethernet with sub-microsecond jitter.

IC Role / Device Role / Timing Role: Deterministic timing hub providing IEEE 1588 boundary clock, PTP transparent clock, and schedule-aware traffic shaping.

Use Value: Hardware timestamping accuracy <50 ns across all 18 MACs ensures TSN traffic scheduling meets IEC 60802 conformance requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar network processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP LX2120AXN72232B 12-core Cortex-A72, 6 MB L2 cache, same package and pinout; lower SerDes bandwidth allocation. Targeted at 40G/25G access routers and vCPE where full 100G throughput is not required. Select when system bandwidth demand is ≤80 Gbps and cost sensitivity outweighs peak crypto/compression needs.
Marvell ARMADA 8040 8-core Cortex-A72, 40 nm process, no integrated DPAA2; relies on external accelerators for crypto/compression. Suitable for compact SD-WAN CPE and enterprise firewalls with moderate throughput (<25 Gbps). Choose for space-constrained designs needing lower power envelope and simpler thermal management than LX2160XN72232B.

Compared with LX2120AXN72232B, the LX2160XN72232B adds four cores, 2 MB L2 cache, and full 24-lane SerDes capability - enabling higher port density and line-rate 100G packet processing. Versus ARMADA 8040, it integrates DPAA2 acceleration and IEEE 1588 hardware timestamping, eliminating external ICs and reducing BOM count for carrier-class timing-critical systems.

Availability

LX2160XN72232B is available at Aetrix Electronics and suitable for 5G infrastructure, telecom edge routing, and industrial TSN gateway applications requiring stable component supply, long lifecycle support, and traceable sourcing.

Supply support for LX2160XN72232B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, IoT, and communications markets.

The Layerscape LX series targets high-performance networking SoCs with integrated datapath acceleration, designed specifically for 5G infrastructure, secure SD-WAN, and time-sensitive industrial gateways.

FAQ

What is the maximum DDR4 data rate supported by the LX2160XN72232B?

The LX2160XN72232B supports DDR4 memory at up to 3.2 GT/s across two independent 72-bit (64+8 ECC) channels. This delivers over 51 GB/s aggregate bandwidth with full ECC protection, validated per JEDEC DDR4-3200 specifications and NXP's electrical timing requirements in Section 3.10 of the datasheet.

Does the LX2160XN72232B support PCIe Gen4?

No, the LX2160XN72232B supports PCIe Gen3 only - with two x8 controllers and four x4 controllers, all compliant with PCI Express Base Specification Revision 3.1. Gen4 support is not implemented in the SerDes PHY or root complex logic per the official Layerscape LX2160A data sheet (Rev. 3, Section 3.23.4).

How many IEEE 1588-capable Ethernet MACs does the LX2160XN72232B integrate?

The LX2160XN72232B integrates up to 18 IEEE 1588-2008-compliant Ethernet MACs, each with hardware timestamping engines capable of sub-50 ns precision. These MACs support multiple physical layer variants including USXGMII, SGMII, XFI, and CAUI-4, as confirmed in Section 3.13 and Figure 1 of the datasheet.

Is the LX2160XN72232B pin-compatible with other Layerscape LX processors like the LX2120A?

Yes, the LX2160XN72232B shares the identical FC-PBGA 1517-ball package and pinout with the LX2120A and LX2080A. Device personality is selected via TEST_SEL_B and cfg_svr[0:1] pins (Table 1, Section 1.1), enabling hardware reuse across performance tiers without PCB redesign.

What security features are embedded in the LX2160XN72232B for trusted execution?

The LX2160XN72232B includes QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip RAM for secure world execution, hardware-based secure boot, tamper detection circuitry, and battery-backed security monitor. These features are documented in Sections 7 and 3.9 of the datasheet and enable Root of Trust implementation without external TPM.

LX2160XN72232B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
1517-BBGA, FCBGA
Series:
QorlQ LX2
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
16 Core, 64-Bit
Speed:
2.2GHz
Co-Processors/DSP:
-
RAM Controllers:
DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
-
Ethernet:
100Gbps (2)
SATA:
SATA 3.0 (4)
USB:
USB 3.0 (2) + PHY (2)
Voltage - I/O:
1.2V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Supplier Device Package:
1517-FCPBGA (40x40)
Additional Interfaces:
CANbus, I2C, MMC/SD, SPI, UART

LX2160XN72232B FAQ

1.How can I place an order for LX2160XN72232B through Aetrix?

Please submit a Request for Quotation (RFQ) for LX2160XN72232B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LX2160XN72232B reliable?

The price and inventory of LX2160XN72232B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2160XN72232B is usually 5 days.

3.What payment methods are accepted for LX2160XN72232B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2160XN72232B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LX2160XN72232B?

LX2160XN72232B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LX2160XN72232B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LX2160XN72232B?

For technical support, including LX2160XN72232B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2160XN72232B requirements.

6.How does Aetrix verify that LX2160XN72232B is sourced from the original manufacturer or authorized distributors?

All LX2160XN72232B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2160XN72232B meets industry standards.

7.What is the process for return or replacement of LX2160XN72232B?

All LX2160XN72232B units undergo pre-shipment inspection (PSI). If there is an issue with LX2160XN72232B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LX2160XN72232B part is unused and in its original packaging.

Return procedure for LX2160XN72232B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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