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NXP Semiconductors LX2162RE82029B

Part No.:
LX2162RE82029B
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
1150-FBGA
Datasheet:
AetrixLX2162RE82029B.pdf
Description:
IC MPU QORIQ LX 2GHZ 1150FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,063

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Product details

Overview

LX2162RE82029B from NXP Semiconductors is a 16-core Arm Cortex-A72 network processor operating up to 2.0 GHz, integrating DPAA2 datapath acceleration (50 Gbps crypto, 88 Gbps compression), dual CAN-FD interfaces, 14 Ethernet MACs supporting 1G–50G speeds, and a 72-bit DDR4 memory controller with ECC. It targets high-throughput secure edge routing and telecom infrastructure.

For engineers reviewing the LX2162RE82029B datasheet, LX2162RE82029B pinout, LX2162RE82029B application, or LX2162RE82029B equivalent, key selection criteria include PCIe Gen3 x8/x4/x4 support, 12×25 Gbps SerDes lanes, IEEE 1588 timing precision, hardware virtualization (Arm MMU-500), and QorIQ Trust Architecture 3.0 with 256 KB on-chip secure RAM.

Technical Context

The LX2162RE82029B implements a cache-coherent interconnect fabric running at up to 1300 MHz with 8 MB L3 cache and ECC-protected on-chip memory mode. Its DPAA2 architecture includes WRIOP for packet parsing/classification, SEC for cryptographic offload, DCE for lossless compression/decompression, and a 2 MB Packet Express Buffer.

It delivers deterministic low-latency networking via 14 configurable Ethernet MACs supporting SGMII, XFI, SFI, USXGMII, 25GAUI, 50GAUI-2, and XLAUI, alongside IEEE 1588 timestamping and SyncE clock outputs. The platform integrates Arm GIC-500 global interrupt controller and supports hardware-enforced partitioning and virtualization.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores 16× Arm Cortex-A72 @ up to 2.0 GHz, each with 48 KB L1 instruction + 32 KB L1 data cache
Memory Interface Single 72-bit DDR4 controller @ 2.9 GT/s with ECC; supports up to 256 GB capacity
Datapath Acceleration DPAA2 with SEC crypto engine (50 Gbps throughput) and DCE compression/decompression (88 Gbps)
Ethernet Support Up to 14 MACs with multi-rate PHY interface support: 1G/2.5G/10G/25G/40G/50G via SGMII, XFI, SFI, USXGMII, 25GAUI, 50GAUI-2, XLAUI
High-Speed I/O 12 SerDes lanes @ up to 25 Gbps; 3× PCIe Gen3 controllers (x8, x4, x4); 2× SATA 3.0; 2× CAN-FD
Security & Trust QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip RAM for trusted execution; Arm MMU-500 for hardware virtualization enforcement
Peripheral Integration 8× I²C, 4× UART, 2× eSDHC, USB 3.0 + PHY, FlexSPI, 3× SPI, 101 GPIOs, 2× Flextimers, secure/non-secure watchdogs

Pinout & Package

The LX2162RE82029B is housed in a 1150-ball Fine-Pitch Ball Grid Array (FC-PBGA) package with 27 mm × 27 mm body size, 0.8 mm ball pitch, and standard thermal pad configuration per NXP's mechanical drawings (Rev. 1, 08/2021).

Pin/Terminal Circuit Role Design Meaning
D1_MDQ00–D1_MDQ63 DDR4 Data Bus (64-bit + 8-bit ECC) Bi-directional 72-bit wide data path with full ECC protection; supports DDR4-2933 operation
D1_MA00–D1_MA13 DDR4 Address Bus 14-bit address bus for row/column/bank/group addressing of DDR4 SDRAM modules
D1_MCK0/D1_MCK0_B DDR4 Clock / Complement Differential clock pair driving DDR4 memory interface at up to 1466 MHz effective frequency
EC1_TX/EC1_RX Ethernet MAC 1 Differential Pair 10G-SXGMII or USXGMII-capable interface; supports IEEE 1588 timestamping and PTP synchronization
PCIe1_CLK_P/PCIe1_CLK_N PCIe Gen3 Reference Clock 100 MHz differential reference clock input for primary PCIe controller (x8 lane configuration)
USB3_DP/USB3_DM USB 3.0 High-Speed Differential Pair Integrated PHY supports SuperSpeed (5 Gbps) operation; compliant with USB 3.0 specification
CAN1_TX/CAN1_RX CAN-FD Transceiver Interface Supports Flexible Data-Rate up to 5 Mbps; integrated CAN protocol controller with message filtering and FIFO buffering

Key Features

Feature Design Value
DPAA2 Hardware Acceleration Offloads packet classification, queue management, crypto (SEC), and compression (DCE) from CPU cores-reducing latency and freeing 100% of A72 cores for application logic
Multi-Rate Ethernet Flexibility Single MAC block supports 1G/2.5G/10G/25G/40G/50G via reconfigurable SerDes lanes and protocol adaptation-enabling one design across access, aggregation, and core layers
Hardware Virtualization Enforcement Arm MMU-500 and GIC-500 enable secure VM isolation with real-time scheduling guarantees-critical for NFV and containerized network functions
Secure Boot & Runtime Trust QorIQ Trust Architecture 3.0 with immutable boot ROM, secure monitor, tamper detection, and 256 KB dedicated on-chip RAM for trusted code execution
Thermal & Power Management Voltage ID (VID) support enables dynamic voltage scaling; thermal diode and THERM pins allow closed-loop cooling control in fanless telecom chassis

Applications

5G Radio Unit (RU) Enterprise SD-WAN Edge Router

Use Scenario: Real-time fronthaul processing in Open RAN deployments requiring deterministic latency and precise time synchronization.

IC Role / Device Role / Timing Role: Baseband processor handling CPRI/eCPRI packet forwarding, Layer 1/2 processing, and IEEE 1588 boundary clock functionality.

Use Value: 14 integrated Ethernet MACs with USXGMII and SyncE outputs eliminate external PHYs; DPAA2 WRIOP ensures sub-10 µs packet classification latency.

Use Scenario: Multi-WAN branch office router performing encrypted traffic steering, application-aware QoS, and zero-touch provisioning.

IC Role / Device Role / Timing Role: Control-plane processor managing Linux-based routing stack while offloading IPsec, TLS, and compression to SEC/DCE engines.

Use Value: 50 Gbps crypto throughput enables line-rate IPsec at 10G WAN links; 16 A72 cores support concurrent Docker containers for microservices architecture.

Industrial Time-Sensitive Networking (TSN) Gateway Secure Network Function Virtualization (NFV) Platform

Use Scenario: Deterministic bridging between legacy industrial protocols (Modbus, PROFINET) and TSN-enabled Ethernet networks.

IC Role / Device Role / Timing Role: Real-time gateway controller executing IEEE 802.1AS time synchronization, scheduled traffic shaping, and frame preemption.

Use Value: Hardware-accelerated IEEE 1588 timestamping and GIC-500 interrupt prioritization guarantee <1 µs time sync jitter and bounded latency for safety-critical motion control.

Use Scenario: Carrier-grade vCPE hosting virtual firewalls, DPI, and load balancers on shared hardware with strict tenant isolation.

IC Role / Device Role / Timing Role: Hypervisor host enabling KVM-based VMs with hardware-enforced memory and I/O partitioning via Arm MMU-500 and IO MMUs.

Use Value: Dedicated 256 KB trust RAM and secure boot prevent firmware-level rootkits; DPAA2 QB-Man provides hardware-managed buffer pools for predictable vSwitch performance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar network processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP LX2122A 12-core Cortex-A72 (vs. 16-core); identical DPAA2, SerDes, and peripheral set; lower thermal envelope (12W typical vs. 18W) Targeted at cost-sensitive edge routers and compact SD-WAN appliances where 20% fewer cores suffice for target throughput Select LX2122A when system-level performance validation confirms 12 cores meet throughput and latency SLAs without over-provisioning
Intel OCTEON TX2 CN9675 12× MIPS64 cores + custom crypto accelerators; different ISA, toolchain, and software ecosystem; lacks native CAN-FD and FlexSPI Suitable for existing MIPS-based telecom stacks; requires porting effort but offers mature LTE/EPC software libraries Choose CN9675 only if leveraging existing OCTEON SDK investments; LX2162RE82029B provides superior Arm ecosystem alignment and CAN-FD for industrial convergence

Compared with LX2122A, the LX2162RE82029B delivers higher core count and bandwidth headroom for future-proofing; versus CN9675, it offers native Arm tooling, integrated CAN-FD for IIoT gateways, and tighter IEEE 1588/SyncE integration-reducing BOM cost and design risk.

Availability

LX2162RE82029B is available at Aetrix Electronics and suitable for 5G RU deployments, enterprise SD-WAN edge routing, industrial TSN gateways, and secure NFV platforms requiring stable component supply across extended product lifecycles.

Supply support for LX2162RE82029B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, IoT, and networking markets, with deep expertise in Arm-based processing and edge intelligence.

The LX2162RE82029B belongs to NXP's Layerscape family of adaptive network processors, engineered specifically for high-performance, secure, and energy-efficient data plane acceleration in telecom infrastructure, enterprise networking, and industrial edge systems.

FAQ

What is the maximum DDR4 memory speed supported by the LX2162RE82029B?

The LX2162RE82029B supports DDR4 memory at up to 2.9 GT/s (DDR4-2933), implemented via a single 72-bit interface with full ECC protection across all 64 data bits and 8 ECC bits. This enables sustained bandwidth exceeding 23 GB/s in practical configurations, validated under JEDEC-compliant timing margins and NXP's recommended operating conditions.

Does the LX2162RE82029B support IEEE 1588 Precision Time Protocol in hardware?

Yes, the LX2162RE82029B integrates full hardware timestamping capability for IEEE 1588v2 across all 14 Ethernet MACs. Each MAC features dedicated timestamp registers, fine-resolution nanosecond counters, and hardware-assisted PTP event message handling-enabling sub-50 ns timestamp accuracy and deterministic delay measurement without CPU intervention.

How many PCIe Gen3 lanes does the LX2162RE82029B provide, and how are they configured?

The LX2162RE82029B provides three independent PCIe Gen3 controllers configured as x8, x4, and x4-totaling 16 usable lanes. These are electrically isolated and can be assigned to separate root complexes or endpoints, supporting mixed topologies such as NVMe storage (x4), FPGA acceleration (x8), and network adapter (x4) simultaneously without bandwidth contention.

Is CAN-FD support built into the LX2162RE82029B, and what data rates does it achieve?

Yes, the LX2162RE82029B includes two fully integrated Controller Area Network modules supporting CAN Flexible Data-Rate (CAN-FD) up to 5 Mbps in the data phase. Both controllers implement ISO 11898-1:2015 compliance, automatic bit rate switching, and hardware message filtering-enabling direct connection to automotive and industrial CAN-FD networks without external transceivers.

What security features are implemented in hardware on the LX2162RE82029B?

The LX2162RE82029B implements QorIQ Platform Trust Architecture 3.0 with ROM-based secure boot, hardware root-of-trust, tamper-detect circuitry, battery-backed security monitor, and 256 KB of dedicated on-chip RAM accessible only by trusted code. All cryptographic operations-including AES, SHA, RSA, and ECC-are accelerated in the SEC engine, with keys protected in hardware key stores.

LX2162RE82029B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
1150-FBGA
Series:
QorIQ LX
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
16 Core, 64-Bit
Speed:
2GHz
Co-Processors/DSP:
-
RAM Controllers:
DDR4, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
-
SATA:
SATA 6Gbps (4)
USB:
USB 3.0 (1)
Voltage - I/O:
-
Operating Temperature:
5°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1150-FBGA (23x23)
Additional Interfaces:
CANbus, I2C, PCIe, SPI, UART

LX2162RE82029B FAQ

1.How can I place an order for LX2162RE82029B through Aetrix?

Please submit a Request for Quotation (RFQ) for LX2162RE82029B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LX2162RE82029B reliable?

The price and inventory of LX2162RE82029B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2162RE82029B is usually 5 days.

3.What payment methods are accepted for LX2162RE82029B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2162RE82029B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LX2162RE82029B?

LX2162RE82029B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LX2162RE82029B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LX2162RE82029B?

For technical support, including LX2162RE82029B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2162RE82029B requirements.

6.How does Aetrix verify that LX2162RE82029B is sourced from the original manufacturer or authorized distributors?

All LX2162RE82029B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2162RE82029B meets industry standards.

7.What is the process for return or replacement of LX2162RE82029B?

All LX2162RE82029B units undergo pre-shipment inspection (PSI). If there is an issue with LX2162RE82029B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LX2162RE82029B part is unused and in its original packaging.

Return procedure for LX2162RE82029B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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