NXP Semiconductors LX2162RN82029B
- Part No.:
- LX2162RN82029B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1150-FBGA
- Datasheet:
-
LX2162RN82029B.pdf
- Description:
- IC MPU QORIQ LX 2GHZ 1150FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,012
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Product details
Overview
LX2162RN82029B from NXP Semiconductors is a 16-core Arm Cortex-A72 network processor with integrated DPAA2 acceleration, 8 MB L3 cache with ECC, dual 25 Gbps SerDes lanes, and support for up to 14 Ethernet MACs including 10G/25G/40G/50G interfaces - deployed in carrier-grade edge routers, 5G front-haul gateways, and secure industrial firewalls.
For engineers reviewing the LX2162RN82029B datasheet, LX2162RN82029B pinout, LX2162RN82029B application, or LX2162RN82029B equivalent, key selection criteria include DDR4-2900 memory controller timing compliance, PCIe Gen3 x8/x4/x4 lane allocation, IEEE 1588 timestamping accuracy, and hardware virtualization support via Arm MMU-500.
Technical Context
The LX2162RN82029B implements a cache-coherent interconnect fabric operating at up to 1300 MHz, linking sixteen Cortex-A72 cores (each with 48 KB L1 instruction + 32 KB L1 data cache) to 8 MB shared L3 cache and on-chip memory (OCM) mode. It integrates Datapath Acceleration Architecture 2.0 (DPAA2), enabling concurrent packet parsing, classification, cryptography (SEC @ 50 Gbps), and compression/decompression (DCE @ 88 Gbps).
Its high-speed I/O subsystem includes three PCIe Gen3 controllers (x8, x4, x4), twelve SerDes lanes scalable to 25 Gbps per lane, and Ethernet interfaces supporting USXGMII, SFI, XFI, 25GAUI, 50GAUI-2, and XLAUI - all synchronized to IEEE 1588 precision time protocol with hardware timestamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 16× Arm Cortex-A72 @ up to 2.0 GHz; each with dedicated 48 KB L1 instruction and 32 KB L1 data cache. |
| L3 Cache | 8 MB with ECC and On-Chip Memory (OCM) mode; enables deterministic latency for real-time packet processing. |
| DDR Interface | Single 72-bit (64+8 ECC) DDR4 controller @ 2.9 GT/s; supports DDR4-2900 with full JEDEC compliance. |
| DPAA2 Acceleration | SEC crypto engine @ 50 Gbps; DCE compression/decompression @ 88 Gbps; 2 MB Packet Express Buffer. |
| Ethernet Support | Up to 14 MACs with multi-rate PHY support: 1G/2.5G/10G/25G/40G/50G via USXGMII, SGMII, XFI, SFI, 25GAUI, 50GAUI-2, XLAUI. |
| PCIe & SerDes | 3× PCIe Gen3 controllers (x8, x4, x4); 12 SerDes lanes configurable up to 25 Gbps per lane. |
| Security & Virtualization | Arm MMU-500 for hardware virtualization; QorIQ Platform Trust Architecture 3.0 with 256 KB trusted RAM. |
Pinout & Package
Package: FC-PBGA, 1150-ball, 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1_MDQ00–D1_MDQ63 | DDR4 Data Bus (64-bit + 8 ECC) | Bi-directional data lines for high-speed DDR4-2900 interface; require matched-length routing and termination. |
| D1_MCK0 / D1_MCK0_B | DDR4 Clock / Complement | Differential clock pair driving DDR4 memory; critical for timing closure at 1450 MHz effective frequency. |
| PCIe_RX0_P/N – PCIe_TX3_P/N | PCIe Gen3 Differential Lanes | Three independent PCIe controllers: x8 (lanes 0–7), x4 (lanes 8–11), x4 (lanes 12–15); each with AC-coupled differential signaling. |
| EMI1_TX0_P/N – EMI2_RX13_P/N | Multi-rate Ethernet PHY Interfaces | Supports SGMII, USXGMII, XFI, SFI, 25GAUI, 50GAUI-2; pin-mapped to specific SerDes lanes per configuration. |
| IIC1_SCL / IIC1_SDA | I²C Bus 1 Control | Configurable as GPIO or I²C master/slave; used for PMIC communication, temperature sensor readout, and board management. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Virtualization | Arm MMU-500 enforces partitioning across OS instances; enables secure co-location of control plane and data plane software. |
| IEEE 1588 Timestamping | Hardware-accelerated PTP timestamp insertion/extraction at MAC layer with sub-50 ns resolution for telecom synchronization. |
| Secure Boot & Trust Zone | QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip RAM for trusted execution; supports signed firmware validation and runtime attestation. |
| FlexSPI & eSDHC Controllers | Dual enhanced SD host controllers (eSDHC1/2) and FlexSPI support boot from QSPI NOR/NAND and high-speed flash expansion. |
| Real-time Debug | Arm CoreSight infrastructure with high-speed trace, performance monitoring, and run-control debugging across all 16 cores. |
Applications
| 5G Radio Unit Gateway | Carrier-Grade Edge Router |
|---|---|
Use Scenario: Aggregating fronthaul traffic between DU and RU in Open RAN deployments with strict latency and jitter requirements. IC Role / Device Role / Timing Role: Real-time packet forwarding, CPRI/eCPRI encapsulation/decapsulation, and IEEE 1588 boundary clock operation. Use Value: 50GAUI-2 and USXGMII support enable single-lane 50G connectivity; DPAA2 WRIOP offloads packet classification at line rate. |
Use Scenario: Multi-service aggregation at metro edge with Layer 3 routing, firewalling, and encrypted tunneling. IC Role / Device Role / Timing Role: Control plane (Linux-based routing stack) + data plane (DPAA2-accelerated forwarding) on same die. Use Value: 14 Ethernet MACs and 3× PCIe Gen3 allow 10G/25G uplinks + 1G/2.5G service ports; SEC engine handles IPsec at 50 Gbps. |
| Industrial Secure Firewall | Time-Sensitive Networking (TSN) Bridge |
Use Scenario: Isolating OT networks in power substations or rail signaling systems with IEC 62443-3-3 compliance. IC Role / Device Role / Timing Role: Dual-boot secure bootloader, hardware-enforced VM isolation, and encrypted inter-VM communication. Use Value: Arm MMU-500 and TrustZone enable certified separation between safety-critical and non-safety partitions; 256 KB trusted RAM stores keys. |
Use Scenario: Deterministic bridging for automotive ECUs or factory automation with sub-microsecond latency guarantees. IC Role / Device Role / Timing Role: IEEE 802.1AS grandmaster clock with hardware timestamping and TSN-aware queue management. Use Value: Integrated IEEE 1588 PTP engine synchronizes all 14 MACs; DPAA2 QDMA enables zero-copy buffer transfers for time-critical frames. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore network processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP LX2122A | 12-core Cortex-A72; identical DPAA2, SerDes, and peripheral set; lower core count reduces thermal envelope and power draw. | Suitable for mid-tier edge nodes where 16-core throughput is unnecessary; retains full software compatibility with LX2162RN82029B. | Select when BOM cost reduction and thermal margin are prioritized over peak packet-per-second capacity. |
| Marvell ARMADA 8040 | 8-core Cortex-A72 + integrated OCTEON Fusion CN9130 crypto; lacks DPAA2 but offers higher per-core cache (2 MB L2/core); no native 50G Ethernet support. | Better suited for compute-intensive security gateways than high-port-count switching; requires different driver stack and SDK. | Choose only if legacy Marvell toolchain integration or specific crypto algorithm acceleration (e.g., SHA3) is required. |
Compared with LX2122A, LX2162RN82029B delivers 33% more CPU throughput and full 50G Ethernet capability; versus ARMADA 8040, it provides superior packet acceleration, deterministic timing, and NXP's validated Layerscape SDK for rapid deployment in telco environments.
Availability
LX2162RN82029B is available at Aetrix Electronics and suitable for carrier-grade edge routers, 5G fronthaul gateways, and secure industrial firewalls requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LX2162RN82029B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and communications markets.
The LX2162RN82029B belongs to NXP's Layerscape family - designed specifically for high-performance, low-latency networking and edge computing applications demanding hardware-accelerated data path processing and robust security.
FAQ
What is the maximum DDR4 speed supported by the LX2162RN82029B?
The LX2162RN82029B supports a single 72-bit DDR4 interface running at 2.9 GT/s, corresponding to DDR4-2900 operation with full JEDEC compliance. This enables sustained memory bandwidth exceeding 23 GB/s with ECC protection, critical for DPAA2 packet buffering and real-time forwarding in high-throughput network appliances.
Does the LX2162RN82029B support IEEE 1588 Precision Time Protocol?
Yes, the LX2162RN82029B includes hardware-accelerated IEEE 1588 timestamping across all supported Ethernet MACs. It implements a full PTP boundary clock with sub-50 ns timestamp resolution, enabling precise synchronization in 5G fronthaul, TSN bridges, and telecom infrastructure without external timing ICs.
How many PCIe Gen3 lanes does the LX2162RN82029B provide?
The LX2162RN82029B integrates three independent PCIe Gen3 controllers configured as x8, x4, and x4 - totaling 16 lanes. These are electrically isolated and can be assigned to discrete peripherals such as FPGA accelerators, NVMe SSDs, or 10G/25G Ethernet adapters without bandwidth contention.
Is hardware virtualization supported on the LX2162RN82029B?
Yes, the LX2162RN82029B incorporates Arm MMU-500 to enforce hardware virtualization and partitioning. This enables secure co-location of multiple OS instances - for example, separating Linux-based control plane from real-time DPAA2 data plane - with guaranteed memory isolation and interrupt routing integrity.
What security features are integrated into the LX2162RN82029B?
The LX2162RN82029B includes QorIQ Platform Trust Architecture 3.0 with 256 KB on-chip RAM for trusted execution, secure boot with cryptographic signature verification, TrustZone-enabled peripheral access control, and hardware-accelerated cryptography (SEC engine) supporting AES-GCM, SHA-2, and RSA up to 4096-bit keys.
LX2162RN82029B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1150-FBGA
- Series:
- QorIQ LX
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A72
- Number of Cores/Bus Width:
- 16 Core, 64-Bit
- Speed:
- 2GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR4, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- SATA 6Gbps (4)
- USB:
- USB 3.0 (1)
- Voltage - I/O:
- -
- Operating Temperature:
- 5°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1150-FBGA (23x23)
- Additional Interfaces:
- CANbus, I2C, PCIe, SPI, UART
LX2162RN82029B FAQ
1.How can I place an order for LX2162RN82029B through Aetrix?
Please submit a Request for Quotation (RFQ) for LX2162RN82029B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LX2162RN82029B reliable?
The price and inventory of LX2162RN82029B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX2162RN82029B is usually 5 days.
3.What payment methods are accepted for LX2162RN82029B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX2162RN82029B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LX2162RN82029B?
LX2162RN82029B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LX2162RN82029B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LX2162RN82029B?
For technical support, including LX2162RN82029B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX2162RN82029B requirements.
6.How does Aetrix verify that LX2162RN82029B is sourced from the original manufacturer or authorized distributors?
All LX2162RN82029B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX2162RN82029B meets industry standards.
7.What is the process for return or replacement of LX2162RN82029B?
All LX2162RN82029B units undergo pre-shipment inspection (PSI). If there is an issue with LX2162RN82029B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LX2162RN82029B part is unused and in its original packaging.
Return procedure for LX2162RN82029B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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