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Microchip Technology LX7175CLD-TR
- Part No.:
- LX7175CLD-TR
- Manufacturer:
- Microchip Technology
- Package:
- 10-WFDFN Exposed Pad
- Datasheet:
-
LX7175CLD-TR.pdf
- Description:
- IC REG BUCK ADJ 3.5A 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,519
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Product details
Overview
LX7175CLD-TR from Microsemi is a 3.5A synchronous step-down PWM switching regulator IC with integrated high-side PMOS and low-side NMOS power stages, operating from 3V–5.5V input and delivering adjustable output voltages from 0.8V to 3.3V; features 1.4MHz fixed-frequency PWM mode and hysteretic power-save mode (PSM), cycle-by-cycle overcurrent protection, and power-good signaling - used in notebook DC/DC conversion and PoE-powered device power rails.
For engineers reviewing the LX7175CLD-TR datasheet, LX7175CLD-TR pinout, LX7175CLD-TR application, or LX7175CLD-TR equivalent, key selection criteria include input voltage range (3V–5.5V), output current capability (0–3.5A), dual-mode operation (PWM/PSM), thermal resistance (θJA = 41.2°C/W), and DFN 3×3 10-lead package compatibility with compact PCB layouts.
Technical Context
The LX7175CLD-TR employs a hysteretic control topology with internal digital soft-start and PLL-stabilized 1.4MHz switching in PWM mode, enabling fast transient response and small external filter components (e.g., 1µH inductor, 2×22µF X5R output capacitors). Its MODE pin selects between continuous conduction (VIN-tied) and variable-frequency boundary-conduction (GND-tied) operation.
It integrates cycle-by-cycle current limiting (4.5–7.3A threshold depending on VIN), latch-off short-circuit protection, input UVLO (2.4–2.8V), and thermal shutdown (140–185°C) with 27°C hysteresis. The FB pin references an internal 0.800V ±12mV bandgap, supporting precise output regulation via resistor divider feedback.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.0V to 5.5V - supports single-cell Li-ion, USB 5V, and 3.3V system rails without pre-regulation. |
| Output Current | 0A to 3.5A - delivers full rated load with <1.4ms soft-start and no external current-sense resistor. |
| Switching Frequency | 1.4MHz (PWM mode) - enables use of sub-2mm height inductors and reduces output ripple filtering burden. |
| Feedback Reference | 0.800V ±12mV at TJ = 25°C - sets output voltage accuracy to ±1.5% over temperature and line/load conditions. |
| RDS(on) High-Side | 55–100mΩ - limits conduction loss at 3.5A, contributing to >90% peak efficiency at medium loads. |
| RDS(on) Low-Side | 40–65mΩ - complements high-side FET for synchronous rectification and minimizes body-diode conduction loss. |
| Thermal Resistance θJA | 41.2°C/W - measured on 4-layer JEDEC-compliant board; requires thermal pad connection to GND plane for reliability at full load. |
Pinout & Package
Package: DFN 3×3 mm, 10-lead, exposed thermal pad (GND-connected). RoHS-compliant, Pb-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (FB) | Voltage feedback input | Connects to resistor divider output node; regulates VOUT by comparing against 0.800V internal reference. |
| 2,3 (VIN) | Main input power supply | Accepts 3V–5.5V; requires ≥10µF X5R ceramic capacitor placed adjacent to pins for stability and EMI suppression. |
| 4,5 (GND) | Power ground return | Low-impedance path for high-current switch-node return; must be connected to thermal pad and PCB GND plane. |
| 6,7 (SW) | Switch-node output | Drives external inductor; carries high di/dt square wave; layout critical to minimize parasitic inductance and ringing. |
| 8 (MODE) | Operating mode select | Tie to GND for PSM (variable frequency, high light-load efficiency); tie to VIN for fixed 1.4MHz PWM mode. |
| 9 (PGOOD) | Open-drain power-good flag | Signals valid regulation (FB > 83% of setpoint) after soft-start; requires external pull-up to VIN or logic rail. |
| 10 (EN) | Enable control input | Active-high; enables regulator when >1.1V; disables to <1µA quiescent current; hysteresis ensures noise immunity. |
| Thermal Pad | Exposed GND thermal interface | Mandatory connection via thermal vias to inner/outer GND planes; essential for thermal performance and reliability. |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous buck architecture | Integrated PMOS high-side + NMOS low-side switches eliminate external Schottky diode and reduce conduction loss. |
| Dual-mode operation | Configurable PWM (fixed 1.4MHz) or PSM (hysteretic, frequency scales with load) - maintains >85% efficiency down to 1mA. |
| Internal soft-start | 1.4ms ramp time prevents inrush current; eliminates need for external timing capacitor or sequencing circuitry. |
| Cycle-by-cycle OCP | Current limit threshold varies with VIN (3.89–7.3A); shuts off high-side FET each cycle exceeding limit, then latches off on sustained short. |
| Power-good monitoring | Open-drain PGOOD with 40mV hysteresis and 5µs glitch filter ensures reliable system power sequencing and fault detection. |
Applications
| Notebook/Netbook Core Power | PoE-Powered Device DC/DC |
|---|---|
Use Scenario: Regulating 5V PoE input to 1.8V or 3.3V for Ethernet PHY, MCU, or memory in IP cameras or VoIP phones. IC Role / Device Role / Timing Role: Primary synchronous buck converter providing isolated, efficient, and compact point-of-load regulation. Use Value: Enables single-stage conversion from 5V PoE midspan without linear post-regulators, reducing heat and board area. |
Use Scenario: Supplying CPU I/O or DDR memory rails in ultra-thin notebooks using 3.3V or 5V battery/adapter input. IC Role / Device Role / Timing Role: Main system PMIC buck stage delivering up to 3.5A with tight output tolerance and fast load transient response. Use Value: Supports dynamic voltage scaling and deep-sleep modes via EN and MODE pins, extending battery life. |
| HDD Head Actuator Supply | Set-Top Box SoC Core Rail |
Use Scenario: Generating clean 1.2V or 1.5V for HDD voice coil motor drivers and servo controllers. IC Role / Device Role / Timing Role: High-current, low-noise buck regulator with low output ripple (<35mV peak-to-peak under 0.1–1.5A transients). Use Value: Minimizes position error signal (PES) noise and improves track-following accuracy in high-speed drives. |
Use Scenario: Powering ARM-based SoC cores in cable/satellite STBs requiring stable 1.0V–1.2V at up to 3A. IC Role / Device Role / Timing Role: Primary core voltage regulator with PGOOD signaling for safe boot and thermal fault management. Use Value: Integrates UVLO, thermal shutdown, and latch-off protection - eliminating need for discrete supervision ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar step-down regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP2315DJ-LF-Z (Monolithic Power) | 3A rating, 2.5–5.5V input, 1.5MHz fSW, no MODE pin; uses constant-on-time control instead of hysteretic. | Lacks PSM mode and programmable operating mode; lower max current limits use in 3.5A designs. | Select when fixed-frequency operation suffices and thermal budget allows higher RDS(on) (110mΩ HS). |
| TPS563201 (Texas Instruments) | 3A, 4.5–17V input, 500kHz–1.7MHz adjustable fSW, external compensation; no integrated MOSFETs. | Requires external high/low-side FETs and loop compensation components - larger solution size and design effort. | Choose for wider input range or when adjustable frequency and external FET optimization are required. |
Compared with MP2315DJ-LF-Z and TPS563201, the LX7175CLD-TR uniquely combines 3.5A capability, 3V–5.5V input, integrated dual-FETs, and selectable PWM/PSM modes in a 3×3mm DFN - making it optimal for space-constrained, battery- or PoE-fed systems needing high light-load efficiency without external complexity.
Availability
LX7175CLD-TR is available at Aetrix Electronics and suitable for notebook/Netbook power delivery, PoE-powered device DC/DC conversion, and HDD actuator supply requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for LX7175CLD-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) designs high-reliability analog, mixed-signal, and power management ICs for aerospace, defense, communications, and industrial markets.
The LX7175CLD-TR belongs to Microsemi's LX-series of integrated synchronous buck regulators, engineered specifically for compact, high-efficiency point-of-load conversion in portable and PoE-powered electronics.
FAQ
What is the recommended input capacitance for LX7175CLD-TR?
The LX7175CLD-TR requires a minimum 10µF X5R ceramic capacitor placed as close as possible between VIN (pins 2,3) and GND (pins 4,5). This ensures stable operation, suppresses high-frequency noise, and provides local charge storage during high di/dt switching events. Larger values (e.g., 22µF) improve input ripple rejection but must maintain low ESL.
Does LX7175CLD-TR support adjustable output voltage?
Yes, the LX7175CLD-TR supports adjustable output voltage from 0.8V to 3.3V using an external resistor divider connected to the FB pin. The internal 0.800V reference determines VOUT = 0.800V × (1 + R1/R2); typical designs use 1% resistors (e.g., R1 = 24.9kΩ, R2 = 100kΩ for 1.0V output).
How does the MODE pin affect efficiency across load conditions?
When MODE is tied to GND, the LX7175CLD-TR enters Power Save Mode (PSM), reducing switching frequency at light loads to maintain >85% efficiency down to ~1mA. When MODE is tied to VIN, it operates in fixed 1.4MHz PWM mode - optimizing efficiency at medium-to-heavy loads (>300mA) and improving transient response.
What thermal design considerations apply to LX7175CLD-TR?
The LX7175CLD-TR has θJA = 41.2°C/W on a 4-layer JEDEC board. To sustain 3.5A continuously, the thermal pad must be soldered and connected via ≥4 thermal vias (0.3mm diameter) to an internal or bottom-layer GND plane. Insufficient thermal relief causes junction temperature to exceed 150°C, triggering thermal shutdown.
Can LX7175CLD-TR safely drive a short-circuited output?
Yes - the LX7175CLD-TR includes cycle-by-cycle overcurrent protection and latch-off behavior under sustained short. During overload, it limits peak inductor current (4.5–7.3A), then latches off if FB falls below 40% of VREF. Recovery requires cycling the EN pin; this protects both the IC and external components during fault conditions.
LX7175CLD-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 10-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 3V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.8V
- Voltage - Output (Max):
- 3.3V
- Current - Output:
- 3.5A
- Frequency - Switching:
- 1.4MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -10°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-DFN (3x3)
LX7175CLD-TR FAQ
1.How can I place an order for LX7175CLD-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for LX7175CLD-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LX7175CLD-TR reliable?
The price and inventory of LX7175CLD-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LX7175CLD-TR is usually 5 days.
3.What payment methods are accepted for LX7175CLD-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LX7175CLD-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LX7175CLD-TR?
LX7175CLD-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LX7175CLD-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LX7175CLD-TR?
For technical support, including LX7175CLD-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LX7175CLD-TR requirements.
6.How does Aetrix verify that LX7175CLD-TR is sourced from the original manufacturer or authorized distributors?
All LX7175CLD-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LX7175CLD-TR meets industry standards.
7.What is the process for return or replacement of LX7175CLD-TR?
All LX7175CLD-TR units undergo pre-shipment inspection (PSI). If there is an issue with LX7175CLD-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LX7175CLD-TR part is unused and in its original packaging.
Return procedure for LX7175CLD-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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