Texas Instruments M0G3105QDGS28RQ1
- Part No.:
- M0G3105QDGS28RQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 28-TFSOP (0.118", 3.00mm Width)
- Datasheet:
-
M0G3105QDGS28RQ1.pdf
- Description:
- AUTOMOTIVE 80MHZ ARM CORTEX M0+
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
M0G3105QDGS28RQ1 from Texas Instruments is an automotive-grade Arm® Cortex®-M0+ microcontroller operating at up to 80MHz, featuring 32KB flash with ECC, 16KB SRAM with parity, CAN-FD interface, dual 12-bit 4Msps ADCs (11-channel), and AEC-Q100 Grade 1 qualification for use in body electronics and gateway modules.
For engineers reviewing the M0G3105QDGS28RQ1 datasheet, M0G3105QDGS28RQ1 pinout, M0G3105QDGS28RQ1 application, or M0G3105QDGS28RQ1 equivalent, this page delivers verified technical context, package-specific pin mapping, functional safety details (ASIL B), low-power operation down to 1.5µA in STANDBY, and automotive-qualified analog/digital integration - all confirmed for the 28-pin VSSOP variant.
Technical Context
The M0G3105QDGS28RQ1 implements a memory protection unit (MPU) and 7-channel DMA for deterministic real-time control, with dual ADCs supporting simultaneous sampling and hardware averaging for 14-bit effective resolution at 250ksps. Its clock system integrates SYSOSC (±1.2%), PLL (up to 80MHz), and dual crystal oscillators (HFXT/LFXT).
Functional safety is embedded at silicon level: ISO 26262 ASIL B certification by TÜV covers systematic capability and hardware integrity, while safety documentation supports system-level design. The device operates across –40°C to 125°C and 1.62V–3.6V, with five low-power modes including STANDBY (1.5µA, RTC + SRAM retained) and SHUTDOWN (80nA, IO wake-up capable).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0+, 80MHz max - enables real-time motor control and sensor fusion within tight timing budgets. |
| Flash / SRAM | 32KB flash with ECC + 16KB SRAM with parity - ensures code/data integrity in automotive ECU environments. |
| ADC Performance | Dual 12-bit, 4Msps, 11 external channels - supports high-speed battery monitoring or position sensing without external muxing. |
| CAN Interface | CAN-FD (up to 5Mbps) + CAN 2.0A/B - enables high-bandwidth vehicle network communication with payload expansion. |
| Operating Range | –40°C to 125°C, 1.62V–3.6V - meets AEC-Q100 Grade 1 requirements for under-hood and cabin applications. |
| Low-Power Modes | STANDBY: 1.5µA (RTC + SRAM + CPU state retained); SHUTDOWN: 80nA (IO wake-up enabled) - extends battery life in always-on modules. |
| Safety Certification | ISO 26262 ASIL B certified by TÜV - reduces functional safety validation effort for automotive system integrators. |
Pinout & Package
Package: 28-pin VSSOP (DGS), 7.1mm × 4.9mm, 0.5mm pitch, with wettable flanks option available. Thermal pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28 | GPIO / Peripheral Multiplexed I/O | All pins support configurable digital functions (UART, SPI, I2C, CAN, timers, ADC inputs); PA21/PA22/PA23 dedicated to VREF-/VREF+/GPAMP; PA26/PA27 assigned to CAN_RX/CAN_TX. |
| VDD (Pin 5) | Core Power Supply | 1.62V–3.6V input powering digital logic and integrated LDO - requires local 100nF decoupling per supply pin. |
| VSS (Pin 6) | Ground Reference | Analog/digital common return - must be connected to low-impedance PCB ground plane for ADC noise immunity. |
| VCORE (Pin 3) | Core Voltage Regulator Output | Internally regulated ~1.2V supply for CPU/SRAM - no external connection required; bypass with 1µF ceramic capacitor. |
| NRST (Pin 4) | Active-Low Reset Input | Asynchronous reset assertion resets CPU, peripherals, and registers - pulled high via external 10kΩ resistor for robust startup. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN-FD Controller | Enables 5Mbps data-rate communication with flexible data-length payloads (up to 64 bytes), reducing gateway latency versus legacy CAN 2.0. |
| Dual Simultaneous-Sampling ADCs | Two independent 12-bit, 4Msps converters with 11 shared external channels - eliminates time skew in multi-sensor acquisition (e.g., motor phase currents). |
| Hardware-Accelerated Cryptography | AES-128/256, TRNG, and CRC-16/32 engines offload security tasks from CPU - essential for secure boot and firmware updates in OTA-enabled ECUs. |
| Ultra-Low-Power STANDBY Mode | 1.5µA consumption with RTC running, SRAM retained, and CPU state preserved - ideal for occupancy detection or door handle wake-on-approach systems. |
| Automotive-Grade Analog Peripherals | Configurable 1.4V/2.5V internal VREF, GPAMP with differential inputs (PA18/PA26), and integrated temperature sensor - reduces BOM count in thermal management subsystems. |
Applications
| Automotive Body Control Module (BCM) | Steering Wheel Control Unit |
|---|---|
Use Scenario: Centralized control of lighting, window lifts, mirrors, and door locks in modern vehicles. IC Role / Device Role / Timing Role: Main MCU executing LIN/CAN gateway logic, PWM dimming, and fault diagnostics. Use Value: Dual ADCs monitor current-sense resistors for load protection; CAN-FD handles high-priority commands; ASIL B compliance satisfies OEM functional safety requirements. |
Use Scenario: Real-time processing of multifunction switch inputs, haptic feedback, and airbag status reporting. IC Role / Device Role / Timing Role: Low-latency interrupt-driven controller managing QEI-based rotary encoder and capacitive touch inputs. Use Value: 80MHz Cortex-M0+ executes debounce and gesture algorithms in <50µs; STANDBY mode enables wake-on-button-press with 80nA shutdown current. |
| Vehicle Occupancy Detection | Kick-to-Open Rear Gate Module |
Use Scenario: Detecting seat occupancy via pressure sensors and thermistors for airbag deployment logic. IC Role / Device Role / Timing Role: Sensor fusion MCU aggregating analog inputs, applying hardware averaging, and transmitting status over CAN. Use Value: 14-bit effective ADC resolution at 250ksps enables precise thermistor readings; integrated temperature sensor calibrates drift without external components. |
Use Scenario: Activating rear gate latch upon foot motion detection using ultrasonic or IR proximity sensors. IC Role / Device Role / Timing Role: Edge-node processor handling sensor signal conditioning, timing-critical pulse generation, and CAN status reporting. Use Value: GPAMP and programmable VREF enable direct amplification of weak sensor signals; 28-pin VSSOP fits compact mechanical envelopes near bumper mounting points. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| M0G3105QDGS32RQ1 | 32-pin VSSOP, 4 additional GPIOs, same flash/SRAM/CAN-FD/peripheral set | Supports higher I/O count for modules requiring extra switches or sensors (e.g., multi-zone lighting controls) | Select when board layout allows larger 32-pin footprint and >24 GPIOs are needed; identical firmware compatibility. |
| MSPM0G3105TRHBRQ1 | 32-pin VQFN (5mm × 5mm), wettable flanks, same core specs but 4 more GPIOs than DGS28 | Better thermal performance and solder joint inspection capability - preferred for reflow-critical automotive production | Choose for automated optical inspection (AOI) requirements or higher power dissipation scenarios; pinout differs, requiring layout change. |
Compared with M0G3105QDGS28RQ1, the 32-pin VSSOP alternative offers expanded I/O without firmware changes, while the VQFN variant trades pin count for superior manufacturability and thermal behavior - both retain identical ASIL B safety certification and CAN-FD functionality.
Availability
M0G3105QDGS28RQ1 is available at Aetrix Electronics and suitable for automotive body electronics, steering wheel systems, and vehicle occupancy detection requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for M0G3105QDGS28RQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive, industrial, and power management solutions.
The M0G3105QDGS28RQ1 belongs to the MSPM0G310x-Q1 automotive MCU family, designed specifically for cost-sensitive, safety-critical body electronics applications requiring CAN-FD connectivity, ultra-low-power operation, and AEC-Q100 Grade 1 reliability.
FAQ
What is the maximum operating frequency and core architecture of the M0G3105QDGS28RQ1?
The M0G3105QDGS28RQ1 features an Arm Cortex-M0+ CPU core with a maximum operating frequency of 80MHz. It includes a memory protection unit (MPU) and operates across the full automotive temperature range of –40°C to 125°C. This performance level supports real-time control tasks such as motor commutation and sensor fusion without requiring external accelerators. The M0G3105QDGS28RQ1 achieves deterministic execution through tightly coupled peripherals and low-latency interrupt response.
Does the M0G3105QDGS28RQ1 support CAN-FD, and what data rates does it achieve?
Yes, the M0G3105QDGS28RQ1 integrates a CAN-FD controller compliant with ISO 11898-1:2015, supporting both classical CAN 2.0A/B and CAN-FD protocols. It achieves data rates up to 5Mbps in FD mode with flexible data field lengths (up to 64 bytes), enabling faster firmware updates and richer diagnostic messaging compared to legacy CAN. The M0G3105QDGS28RQ1 implements dedicated CAN_TX and CAN_RX pins (PA26/PA27) with built-in bus fault protection.
How many analog-to-digital converter (ADC) channels does the M0G3105QDGS28RQ1 support, and what is its effective resolution?
The M0G3105QDGS28RQ1 integrates two simultaneous-sampling 12-bit ADCs with up to 11 external input channels. Using hardware averaging, it achieves 14-bit effective resolution at 250ksps - critical for precision current sensing in motor drives or battery monitoring. The M0G3105QDGS28RQ1 also includes a configurable internal voltage reference (1.4V or 2.5V) and a general-purpose amplifier (GPAMP) for signal conditioning prior to digitization.
What low-power modes are available on the M0G3105QDGS28RQ1, and what is the lowest current consumption?
The M0G3105QDGS28RQ1 offers five low-power modes: RUN (101µA/MHz), SLEEP (40µA/MHz), STOP (190µA at 4MHz), STANDBY (1.5µA with RTC, SRAM, and CPU state retained), and SHUTDOWN (80nA with IO wake-up capability). The SHUTDOWN mode enables ultra-low quiescent current for always-on vehicle systems like occupancy detection or keyless entry receivers - all while maintaining pin-state retention and fast wake-up response.
Is the M0G3105QDGS28RQ1 qualified for automotive applications, and what safety certifications does it hold?
Yes, the M0G3105QDGS28RQ1 is AEC-Q100 Grade 1 qualified (–40°C to 125°C) and ISO 26262 ASIL B certified by TÜV for both systematic capability and hardware integrity. It includes built-in error correction code (ECC) for flash memory and hardware parity for SRAM, along with a memory protection unit (MPU) and cyclic redundancy check (CRC) engines. These features make the M0G3105QDGS28RQ1 suitable for safety-critical automotive body control and gateway applications without requiring external safety monitors.
M0G3105QDGS28RQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 28-TFSOP (0.118", 3.00mm Width)
- Series:
- MSPM0 G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
- Number of I/O:
- 24
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
M0G3105QDGS28RQ1 FAQ
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6.How does Aetrix verify that M0G3105QDGS28RQ1 is sourced from the original manufacturer or authorized distributors?
All M0G3105QDGS28RQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0G3105QDGS28RQ1 meets industry standards.
7.What is the process for return or replacement of M0G3105QDGS28RQ1?
All M0G3105QDGS28RQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0G3105QDGS28RQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M0G3105QDGS28RQ1 part is unused and in its original packaging.
Return procedure for M0G3105QDGS28RQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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