Texas Instruments M0G3106QDGS20RQ1
- Part No.:
- M0G3106QDGS20RQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 20-TFSOP (0.118", 3.00mm Width)
- Datasheet:
-
M0G3106QDGS20RQ1.pdf
- Description:
- AUTOMOTIVE 80MHZ ARM CORTEX-M0+
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
M0G3106QDGS20RQ1 from Texas Instruments is an automotive-grade Arm® Cortex®-M0+ microcontroller with CAN-FD interface, 64KB flash, 32KB SRAM, dual 12-bit 4Msps ADCs, and ASIL B functional safety certification for body electronics and motor control applications operating from –40°C to 125°C at 1.62V–3.6V supply.
For engineers reviewing the M0G3106QDGS20RQ1 datasheet, M0G3106QDGS20RQ1 pinout, M0G3106QDGS20RQ1 application, or M0G3106QDGS20RQ1 equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, 20-pin VSSOP package with 16 GPIOs, CAN-FD + UART/I²C/SPI interfaces, low-power STANDBY mode (1.5µA), and integrated VREF/GPAMP for sensor signal conditioning in space-constrained automotive modules.
Technical Context
This MCU implements a single-core Arm Cortex-M0+ running up to 80MHz with MPU, 7-channel DMA, and dual-bus architecture (AHB + ULPCLK). Its analog subsystem integrates two simultaneous-sampling 12-bit ADCs (4Msps, 6 external channels), configurable 1.4V/2.5V VREF, and one GPAMP with dedicated IN+/IN−/OUT pins on the 20-pin VSSOP package.
The power management unit supports five low-power modes: RUN (101µA/MHz), SLEEP (40µA/MHz), STOP (190µA @4MHz), STANDBY (1.5µA with RTC/SRAM retention), and SHUTDOWN (80nA with IO wake-up). Clocking includes SYSOSC (±1.2%), PLL, HFXT/LFXT, and LFOSC (±3%).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M0+, 80MHz max - enables real-time control of automotive lighting and motor functions within tight timing budgets. |
| Flash / SRAM | 64KB flash with ECC / 32KB SRAM with parity - ensures code/data integrity in safety-critical vehicle systems. |
| ADC | Dual 12-bit, 4Msps, 6 external channels - supports high-speed sampling of position sensors or current shunts in compact modules. |
| Operating Temp | –40°C to 125°C - meets AEC-Q100 Grade 1 requirements for under-hood and cabin-mounted ECUs. |
| Supply Voltage | 1.62V to 3.6V - compatible with automotive 3.3V domains and brown-out tolerant across battery transients. |
| CAN Interface | CAN-FD (up to 5Mbps) + CAN 2.0 - enables high-bandwidth gateway communication and firmware updates over vehicle networks. |
| Low-Power STANDBY | 1.5µA with RTC, SRAM, CPU state retained - allows always-on occupancy detection or door handle wake-up without external supervisors. |
Pinout & Package
20-pin VSSOP (DGS20) package, 5.1mm × 4.9mm body, 0.65mm pitch, wettable flanks option available. Pin count and I/O count optimized for minimal footprint in space-constrained automotive modules such as kick-to-open actuators and seat comfort controllers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS, VCORE | Power rails | Separate analog/digital/core supplies enable noise isolation for ADC and CAN operation in noisy automotive environments. |
| NRST | Reset input | Active-low reset with internal pull-up; supports external watchdog or system-level reset coordination. |
| PA0–PA11, PA14, PA16–PA18, PA20–PA27 | GPIO / peripheral multiplexing | 16 total GPIOs with configurable drive strength, wake capability, and analog function mapping (e.g., A0_0–A0_7, A1_0–A1_7, VREF+, VREF−, GPAMP_IN+/OUT). |
| PA19 / PA20 | SWDIO / SWCLK | 2-pin serial wire debug interface - enables in-system programming and real-time debugging without additional headers. |
| PA5 / PA6 | HFXIN / HFXOUT | Connects to external 4–48MHz crystal for precise clock source required by CAN-FD timing and ADC sampling. |
| PA26 / PA27 | CAN_TX / CAN_RX | Dedicated differential CAN-FD bus interface pins - require external transceiver but eliminate routing complexity in 20-pin layout. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B certification | TÜV-certified per ISO 26262 - reduces functional safety validation effort for automotive body control modules. |
| Dual simultaneous ADCs | Two independent 12-bit 4Msps converters with 6 shared external channels - enables synchronized current/voltage measurement for motor phase control in inverters. |
| Integrated VREF & GPAMP | Configurable 1.4V/2.5V reference + rail-to-rail amplifier - eliminates external precision references and op-amps in sensor front-ends for occupancy or temperature sensing. |
| Ultra-low STANDBY current | 1.5µA with RTC, SRAM, and registers retained - supports battery-powered modules requiring multi-year operation without recharge. |
| CAN-FD + 3x UART + 2x I²C + 1x SPI | Multi-protocol connectivity in 20-pin package - simplifies integration into gateways or distributed nodes without external bridge ICs. |
Applications
| Automotive Door Handle Module | Kick-to-Open Actuator Control |
|---|---|
Use Scenario: Proximity sensing and mechanical actuation triggered by user foot motion near rear bumper. IC Role / Device Role / Timing Role: Real-time sensor fusion (ADC + GPAMP), CAN-FD command execution, and low-power wake-from-STANDBY via IO interrupt. Use Value: 1.5µA STANDBY current extends battery life >5 years; integrated VREF/GPAMP reduces BOM by 3 passive components. | Use Scenario: Compact actuator controller mounted inside rear bumper housing, exposed to wide thermal cycling. IC Role / Device Role / Timing Role: Motor commutation timing via PWM outputs, position feedback acquisition via ADC, and CAN-FD status reporting. Use Value: –40°C to 125°C operation ensures reliability in extreme climates; 20-pin VSSOP minimizes PCB area vs. larger QFN alternatives. |
| Vehicle Occupancy Detection | Seat Comfort Module |
Use Scenario: Capacitive or pressure-based seat sensing for airbag deployment logic and HVAC zone control. IC Role / Device Role / Timing Role: Analog front-end signal conditioning (GPAMP + VREF + ADC), local decision-making, and CAN-FD data transmission. Use Value: Dual ADCs allow simultaneous sampling of multiple sensor elements; ASIL B certification satisfies airbag system safety requirements. | Use Scenario: Integrated heating/cooling and massage control in premium automotive seats. IC Role / Device Role / Timing Role: PWM-driven heater/cooler driver control, thermistor monitoring via ADC, and LIN/CAN communication with body domain controller. Use Value: 64KB flash accommodates complex thermal algorithms and calibration tables; 32KB SRAM enables real-time PID loop execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| M0G3105QDGS20RQ1 | 32KB flash, 16KB SRAM, same 20-pin VSSOP package and peripheral set | Suitable for simpler sensor nodes with smaller firmware footprints and lower RAM needs | Select when application code size <256KB and no concurrent multi-threaded tasking is required |
| M0G3107QDGS20RQ1 | 128KB flash, 32KB SRAM, identical package and peripherals | Required for feature-rich modules needing OTA update partitions, cryptographic libraries, or large lookup tables | Select when future firmware expansion, AES-256 encryption, or dual-bank flash updates are mandatory |
Compared with M0G3105QDGS20RQ1, M0G3106QDGS20RQ1 provides double flash capacity for bootloader + application separation, while M0G3107QDGS20RQ1 adds headroom for safety-certified diagnostic routines and secure boot assets - all sharing identical pinout, power, and timing behavior.
Availability
M0G3106QDGS20RQ1 is available at Aetrix Electronics and suitable for automotive body electronics, door handle modules, and seat comfort systems requiring stable component supply, AEC-Q100 compliance, and long-term industrial availability.
Supply support for M0G3106QDGS20RQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for automotive, industrial, and personal electronics markets.
The MSPM0G310x-Q1 product line delivers ultra-low-power, ASIL B-certified MCUs with integrated analog peripherals and CAN-FD for cost-sensitive automotive body control and electrification applications.
FAQ
What is the maximum operating frequency and core type of the M0G3106QDGS20RQ1?
The M0G3106QDGS20RQ1 features an Arm Cortex-M0+ CPU with a maximum operating frequency of 80MHz. It includes a memory protection unit (MPU) and operates within the extended automotive temperature range of –40°C to 125°C. This core delivers deterministic real-time performance suitable for motor control and sensor processing tasks in the M0G3106QDGS20RQ1.
Does the M0G3106QDGS20RQ1 support CAN-FD, and what are its physical interface requirements?
Yes, the M0G3106QDGS20RQ1 integrates a Controller Area Network interface supporting both CAN 2.0 and CAN-FD protocols up to 5Mbps. It provides dedicated CAN_TX and CAN_RX pins (PA26 and PA27) but requires an external CAN transceiver for physical layer compliance. The M0G3106QDGS20RQ1 does not include integrated transceiver circuitry.
How many GPIOs and analog input channels are available on the M0G3106QDGS20RQ1 in its 20-pin VSSOP package?
The M0G3106QDGS20RQ1 provides 16 GPIOs in the 20-pin VSSOP (DGS20) package, with up to 6 external analog input channels mapped across A0_0–A0_7 and A1_0–A1_7. These support the dual 12-bit 4Msps ADCs and include dedicated pins for VREF+ and VREF−, enabling precision sensor interfacing without external reference components in the M0G3106QDGS20RQ1.
What low-power modes does the M0G3106QDGS20RQ1 support, and what is its lowest active current draw?
The M0G3106QDGS20RQ1 supports RUN, SLEEP, STOP, STANDBY, and SHUTDOWN modes. Its lowest active retention mode is STANDBY at 1.5µA with RTC, SRAM, CPU state, and registers retained - critical for always-on automotive modules. RUN mode consumes 101µA/MHz (CoreMark), confirming efficient execution efficiency in the M0G3106QDGS20RQ1.
Is the M0G3106QDGS20RQ1 qualified for automotive use, and what safety certifications does it hold?
Yes, the M0G3106QDGS20RQ1 is AEC-Q100 Grade 1 qualified (–40°C to 125°C) and ISO 26262 certified up to ASIL B by TÜV. It includes hardware integrity features such as flash ECC, SRAM parity, memory protection unit, and systematic safety documentation - making it suitable for automotive body electronics and safety-related subsystems per the M0G3106QDGS20RQ1 specification.
M0G3106QDGS20RQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 20-TFSOP (0.118", 3.00mm Width)
- Series:
- MSPM0 G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 6x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
M0G3106QDGS20RQ1 FAQ
1.How can I place an order for M0G3106QDGS20RQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for M0G3106QDGS20RQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M0G3106QDGS20RQ1 reliable?
The price and inventory of M0G3106QDGS20RQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M0G3106QDGS20RQ1 is usually 5 days.
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Once your M0G3106QDGS20RQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M0G3106QDGS20RQ1?
For technical support, including M0G3106QDGS20RQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M0G3106QDGS20RQ1 requirements.
6.How does Aetrix verify that M0G3106QDGS20RQ1 is sourced from the original manufacturer or authorized distributors?
All M0G3106QDGS20RQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0G3106QDGS20RQ1 meets industry standards.
7.What is the process for return or replacement of M0G3106QDGS20RQ1?
All M0G3106QDGS20RQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0G3106QDGS20RQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M0G3106QDGS20RQ1 part is unused and in its original packaging.
Return procedure for M0G3106QDGS20RQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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