Texas Instruments M0G3106QDGS32RQ1
- Part No.:
- M0G3106QDGS32RQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 32-TFSOP (0.118", 3.00mm Width)
- Datasheet:
-
M0G3106QDGS32RQ1.pdf
- Description:
- AUTOMOTIVE 80MHZ ARM CORTEX-M0+
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
M0G3106QDGS32RQ1 from Texas Instruments is an automotive-grade Arm® Cortex®-M0+ microcontroller with CAN-FD interface, 64KB flash, 32KB SRAM, dual 12-bit 4Msps ADCs, and AEC-Q100 Grade 1 qualification for operation from –40°C to 125°C - deployed in body electronics, gateway modules, and motor control subsystems.
For engineers reviewing the M0G3106QDGS32RQ1 datasheet, M0G3106QDGS32RQ1 pinout, M0G3106QDGS32RQ1 application, or M0G3106QDGS32RQ1 equivalent, key selection criteria include ASIL B functional safety certification, 32-pin VSSOP package with 8.1mm × 4.9mm footprint, CAN-FD + UART/I²C/SPI connectivity, ultra-low-power STANDBY mode (1.5µA), and integrated VREF/GPAMP for sensor signal conditioning.
Technical Context
The M0G3106QDGS32RQ1 implements a memory protection unit (MPU) and 7-channel DMA for deterministic real-time execution. Its dual ADC subsystem supports simultaneous sampling across up to 11 external channels with hardware averaging enabling 14-bit effective resolution at 250ksps.
Power management includes five low-power modes (RUN, SLEEP, STOP, STANDBY, SHUTDOWN) with retention of CPU state, RTC, and SRAM in STANDBY. The clock system integrates SYSOSC (±1.2%), LFOSC (±3%), HFXT/LFXT support, and PLL scaling to 80MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0+, 80MHz max - enables real-time deterministic control in automotive timing-critical tasks. |
| Flash / SRAM | 64KB flash with ECC + 32KB SRAM with parity - ensures code/data integrity in harsh automotive environments. |
| ADC Performance | Dual 12-bit, 4Msps with 11-channel input - supports high-speed sensor acquisition for motor position or battery monitoring. |
| Operating Temp | –40°C to 125°C - meets AEC-Q100 Grade 1 requirements for under-hood and cabin applications. |
| Supply Voltage | 1.62V to 3.6V - compatible with wide-range automotive power rails including post-regulated 3.3V and 2.5V domains. |
| Low-Power STANDBY | 1.5µA with RTC, SRAM, and CPU state retained - enables always-on wake-up capability for door handle or occupancy detection. |
| CAN Interface | CAN-FD (up to 5Mbps) + CAN 2.0B - supports high-bandwidth diagnostics, firmware updates, and domain controller communication. |
| Security Peripherals | AES-128/256, TRNG, CRC-16/32 - provides cryptographic primitives for secure boot and ECU authentication. |
Pinout & Package
Package: 32-pin VSSOP (DGS), 8.1mm × 4.9mm body, 0.5mm pitch, with wettable flanks option available. Pin count and layout optimized for space-constrained automotive modules requiring CAN-FD and analog sensing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0 / PA1 | 5V-tolerant open-drain I/O | Support LIN bus or I²C level-shifting without external components; default BSL I²C interface for programming. |
| PA19 / PA20 | SWD debug interface | 2-pin serial wire debug (SWCLK/SWDIO) enables in-system programming and real-time trace via standard JTAG/SWD tools. |
| PA21 / PA23 | VREF− / VREF+ | Configurable internal reference (1.4V or 2.5V) shared between ADCs and GPAMP - eliminates need for external reference ICs. |
| PA22 / PA26 / PA27 | GPAMP_OUT / A0_1 / A0_0 | Integrated general-purpose amplifier with programmable gain - conditions analog sensor signals before ADC digitization. |
| PA12 / PA13 | CAN_TX / CAN_RX | Dedicated differential CAN-FD transceiver interface pins - routed for minimal loop area and EMC robustness. |
| NRST / VCORE / VDD / VSS | Reset & power supply | Separate core (VCORE) and I/O (VDD) supplies enable independent power domain control and low-noise analog operation. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B Functional Safety Certification | TÜV-certified per ISO 26262 - reduces system-level validation effort for automotive safety mechanisms. |
| Dual Simultaneous ADC Sampling | Two independent 12-bit 4Msps converters with hardware averaging - enables synchronized current/voltage measurement in motor control. |
| Ultra-Low-Power STANDBY Mode | 1.5µA with RTC, SRAM, and CPU registers retained - allows rapid wake-up (<10µs) for event-driven automotive functions. |
| Integrated GPAMP + Shared VREF | One rail-to-rail amplifier with selectable gain and programmable 1.4V/2.5V reference - simplifies analog front-end design for temperature, pressure, or position sensors. |
| CAN-FD + Multiple UART/I²C/SPI | One CAN-FD (5Mbps), four UARTs (three support STANDBY wakeup), two I²C (FM+), two SPI - enables flexible vehicle network topology and peripheral bridging. |
| Hardware Security Engine | AES-128/256 encryption, TRNG, and CRC accelerators - offloads crypto operations from CPU and protects firmware updates and keys. |
Applications
| Automotive Body Control Module | Steering Wheel System |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern vehicles. IC Role / Device Role / Timing Role: Main MCU executing body control logic, managing LIN/CAN communication, and sampling switch/button inputs via GPIO and ADC. Use Value: 64KB flash supports complex feature sets (e.g., anti-pinch algorithms); STANDBY mode enables instant response to key fob wake-up signals. | Use Scenario: Real-time processing of multifunction button presses, haptic feedback, and capacitive touch on steering wheel controls. IC Role / Device Role / Timing Role: Dedicated MCU handling human-machine interface (HMI) with low-latency GPIO scanning, ADC-based touch sensing, and CAN-FD messaging to central gateway. Use Value: Dual ADCs sample multiple touch electrodes simultaneously; GPAMP conditions analog touch signals; 1.5µA STANDBY extends battery life during vehicle sleep. |
| Vehicle Occupancy Detection | Seat Comfort Module |
Use Scenario: Detecting occupant presence and position using seat-mounted pressure sensors and ultrasonic time-of-flight measurements. IC Role / Device Role / Timing Role: Sensor fusion MCU acquiring analog pressure data, processing ultrasonic echo timing, and transmitting occupancy status over CAN-FD. Use Value: Hardware averaging in ADC achieves 14-bit effective resolution for precise pressure mapping; TRNG supports secure sensor data reporting. | Use Scenario: Controlling seat heating, ventilation, and massage actuators based on user preferences and thermal feedback. IC Role / Device Role / Timing Role: Motor and thermal control MCU driving H-bridge drivers, reading NTC thermistors via ADC, and regulating PWM outputs for heater elements. Use Value: Two advanced timers with dead-band insertion safely drive bidirectional seat motors; integrated VREF ensures accurate temperature measurement across operating range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| M0G3107QDGS32RQ1 | 128KB flash, 32KB SRAM - same package, peripherals, and safety certification. | Required when firmware size exceeds 64KB or future-proofing for OTA updates is needed. | Select for larger application code footprints while retaining identical pinout, layout, and qualification. |
| S912ZVMC12F0MLFR | Freescale S12Z core (16-bit), 128KB flash, no CAN-FD, ASIL B via software-only measures. | Limited to legacy CAN 2.0B networks; lacks hardware crypto and dual high-speed ADCs. | Consider only for cost-sensitive brownfield designs where CAN-FD and security are not required. |
Compared with M0G3107QDGS32RQ1, the M0G3106QDGS32RQ1 offers optimal balance of flash capacity, power efficiency, and CAN-FD bandwidth for mid-tier automotive modules; versus S912ZVMC12F0MLFR, it delivers higher compute throughput, native CAN-FD, and hardware-enforced security - reducing integration risk in new designs.
Availability
M0G3106QDGS32RQ1 is available at Aetrix Electronics and suitable for automotive body electronics, steering wheel systems, and seat comfort modules requiring stable component supply, AEC-Q100 compliance, and long-term production continuity.
Supply support for M0G3106QDGS32RQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for automotive, industrial, and personal electronics markets.
The M0G3106QDGS32RQ1 belongs to the MSPM0G310x-Q1 family - purpose-built for cost-optimized, functional-safety-compliant automotive microcontrollers integrating high-performance analog, CAN-FD, and ultra-low-power operation in compact packages.
FAQ
What is the maximum operating frequency of the M0G3106QDGS32RQ1?
The M0G3106QDGS32RQ1 features an Arm Cortex-M0+ CPU with a maximum operating frequency of 80MHz, achieved via its integrated PLL. This frequency is fully supported across the specified operating temperature range (–40°C to 125°C) and supply voltage (1.62V to 3.6V), enabling deterministic real-time execution in automotive control loops. The M0G3106QDGS32RQ1 maintains timing accuracy through its ±1.2% internal SYSOSC and optional external crystal support.
Does the M0G3106QDGS32RQ1 support CAN-FD, and what data rates are achievable?
Yes, the M0G3106QDGS32RQ1 integrates a Controller Area Network interface compliant with both CAN 2.0A/B and CAN-FD protocols. It supports bit rates up to 5Mbps in FD mode, with flexible data phase configuration. The dedicated CAN_TX and CAN_RX pins (PA12/PA13) are electrically optimized for low-emission routing, and the peripheral includes hardware message filtering and FIFO buffering - all confirmed in the M0G3106QDGS32RQ1 technical reference manual.
How many analog input channels does the M0G3106QDGS32RQ1 support in its 32-pin VSSOP package?
In the 32-pin VSSOP (DGS) package, the M0G3106QDGS32RQ1 supports up to 11 external analog input channels across its dual 12-bit ADC subsystem. This is explicitly documented in Table 5-1 (Device Comparison) and Section 6.2 (Pin Attributes) of the datasheet, where pins PA21–PA27, PA22–PA25, and PA26–PA27 are assigned to A0_x and A1_x analog functions. No additional external muxing is required to access all 11 channels.
What low-power modes are available on the M0G3106QDGS32RQ1, and what is the lowest current draw?
The M0G3106QDGS32RQ1 offers five configurable low-power modes: RUN, SLEEP, STOP, STANDBY, and SHUTDOWN. The lowest active-retention mode is STANDBY, drawing just 1.5µA while retaining SRAM, CPU register state, and RTC operation with 32kHz LFXT. SHUTDOWN draws 80nA but loses all state except IO wake-up capability. These values are measured and guaranteed per the recommended operating conditions in Section 7.5 of the M0G3106QDGS32RQ1 datasheet.
Is the M0G3106QDGS32RQ1 qualified for automotive use, and what safety certifications does it hold?
Yes, the M0G3106QDGS32RQ1 is AEC-Q100 Grade 1 qualified (–40°C to 125°C) and certified by TÜV for functional safety up to ASIL B per ISO 26262. Documentation supporting systematic capability and hardware integrity analysis is provided by Texas Instruments. These qualifications apply specifically to the M0G3106QDGS32RQ1 device variant - not inferred from family-level claims - and are verified in the device's production data sheet (SLASF86C, September 2025 revision).
M0G3106QDGS32RQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 32-TFSOP (0.118", 3.00mm Width)
- Series:
- MSPM0 G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 11x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
M0G3106QDGS32RQ1 FAQ
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6.How does Aetrix verify that M0G3106QDGS32RQ1 is sourced from the original manufacturer or authorized distributors?
All M0G3106QDGS32RQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0G3106QDGS32RQ1 meets industry standards.
7.What is the process for return or replacement of M0G3106QDGS32RQ1?
All M0G3106QDGS32RQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0G3106QDGS32RQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M0G3106QDGS32RQ1 part is unused and in its original packaging.
Return procedure for M0G3106QDGS32RQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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