Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments M0G3106QDGS32RQ1

Part No.:
M0G3106QDGS32RQ1
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
32-TFSOP (0.118", 3.00mm Width)
Datasheet:
AetrixM0G3106QDGS32RQ1.pdf
Description:
AUTOMOTIVE 80MHZ ARM CORTEX-M0+
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,443

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

M0G3106QDGS32RQ1 from Texas Instruments is an automotive-grade Arm® Cortex®-M0+ microcontroller with CAN-FD interface, 64KB flash, 32KB SRAM, dual 12-bit 4Msps ADCs, and AEC-Q100 Grade 1 qualification for operation from –40°C to 125°C - deployed in body electronics, gateway modules, and motor control subsystems.

For engineers reviewing the M0G3106QDGS32RQ1 datasheet, M0G3106QDGS32RQ1 pinout, M0G3106QDGS32RQ1 application, or M0G3106QDGS32RQ1 equivalent, key selection criteria include ASIL B functional safety certification, 32-pin VSSOP package with 8.1mm × 4.9mm footprint, CAN-FD + UART/I²C/SPI connectivity, ultra-low-power STANDBY mode (1.5µA), and integrated VREF/GPAMP for sensor signal conditioning.

Technical Context

The M0G3106QDGS32RQ1 implements a memory protection unit (MPU) and 7-channel DMA for deterministic real-time execution. Its dual ADC subsystem supports simultaneous sampling across up to 11 external channels with hardware averaging enabling 14-bit effective resolution at 250ksps.

Power management includes five low-power modes (RUN, SLEEP, STOP, STANDBY, SHUTDOWN) with retention of CPU state, RTC, and SRAM in STANDBY. The clock system integrates SYSOSC (±1.2%), LFOSC (±3%), HFXT/LFXT support, and PLL scaling to 80MHz.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M0+, 80MHz max - enables real-time deterministic control in automotive timing-critical tasks.
Flash / SRAM64KB flash with ECC + 32KB SRAM with parity - ensures code/data integrity in harsh automotive environments.
ADC PerformanceDual 12-bit, 4Msps with 11-channel input - supports high-speed sensor acquisition for motor position or battery monitoring.
Operating Temp–40°C to 125°C - meets AEC-Q100 Grade 1 requirements for under-hood and cabin applications.
Supply Voltage1.62V to 3.6V - compatible with wide-range automotive power rails including post-regulated 3.3V and 2.5V domains.
Low-Power STANDBY1.5µA with RTC, SRAM, and CPU state retained - enables always-on wake-up capability for door handle or occupancy detection.
CAN InterfaceCAN-FD (up to 5Mbps) + CAN 2.0B - supports high-bandwidth diagnostics, firmware updates, and domain controller communication.
Security PeripheralsAES-128/256, TRNG, CRC-16/32 - provides cryptographic primitives for secure boot and ECU authentication.

Pinout & Package

Package: 32-pin VSSOP (DGS), 8.1mm × 4.9mm body, 0.5mm pitch, with wettable flanks option available. Pin count and layout optimized for space-constrained automotive modules requiring CAN-FD and analog sensing.

Pin/TerminalCircuit RoleDesign Meaning
PA0 / PA15V-tolerant open-drain I/OSupport LIN bus or I²C level-shifting without external components; default BSL I²C interface for programming.
PA19 / PA20SWD debug interface2-pin serial wire debug (SWCLK/SWDIO) enables in-system programming and real-time trace via standard JTAG/SWD tools.
PA21 / PA23VREF− / VREF+Configurable internal reference (1.4V or 2.5V) shared between ADCs and GPAMP - eliminates need for external reference ICs.
PA22 / PA26 / PA27GPAMP_OUT / A0_1 / A0_0Integrated general-purpose amplifier with programmable gain - conditions analog sensor signals before ADC digitization.
PA12 / PA13CAN_TX / CAN_RXDedicated differential CAN-FD transceiver interface pins - routed for minimal loop area and EMC robustness.
NRST / VCORE / VDD / VSSReset & power supplySeparate core (VCORE) and I/O (VDD) supplies enable independent power domain control and low-noise analog operation.

Key Features

FeatureDesign Value
ASIL B Functional Safety CertificationTÜV-certified per ISO 26262 - reduces system-level validation effort for automotive safety mechanisms.
Dual Simultaneous ADC SamplingTwo independent 12-bit 4Msps converters with hardware averaging - enables synchronized current/voltage measurement in motor control.
Ultra-Low-Power STANDBY Mode1.5µA with RTC, SRAM, and CPU registers retained - allows rapid wake-up (<10µs) for event-driven automotive functions.
Integrated GPAMP + Shared VREFOne rail-to-rail amplifier with selectable gain and programmable 1.4V/2.5V reference - simplifies analog front-end design for temperature, pressure, or position sensors.
CAN-FD + Multiple UART/I²C/SPIOne CAN-FD (5Mbps), four UARTs (three support STANDBY wakeup), two I²C (FM+), two SPI - enables flexible vehicle network topology and peripheral bridging.
Hardware Security EngineAES-128/256 encryption, TRNG, and CRC accelerators - offloads crypto operations from CPU and protects firmware updates and keys.

Applications

Automotive Body Control ModuleSteering Wheel System

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing body control logic, managing LIN/CAN communication, and sampling switch/button inputs via GPIO and ADC.

Use Value: 64KB flash supports complex feature sets (e.g., anti-pinch algorithms); STANDBY mode enables instant response to key fob wake-up signals.

Use Scenario: Real-time processing of multifunction button presses, haptic feedback, and capacitive touch on steering wheel controls.

IC Role / Device Role / Timing Role: Dedicated MCU handling human-machine interface (HMI) with low-latency GPIO scanning, ADC-based touch sensing, and CAN-FD messaging to central gateway.

Use Value: Dual ADCs sample multiple touch electrodes simultaneously; GPAMP conditions analog touch signals; 1.5µA STANDBY extends battery life during vehicle sleep.

Vehicle Occupancy DetectionSeat Comfort Module

Use Scenario: Detecting occupant presence and position using seat-mounted pressure sensors and ultrasonic time-of-flight measurements.

IC Role / Device Role / Timing Role: Sensor fusion MCU acquiring analog pressure data, processing ultrasonic echo timing, and transmitting occupancy status over CAN-FD.

Use Value: Hardware averaging in ADC achieves 14-bit effective resolution for precise pressure mapping; TRNG supports secure sensor data reporting.

Use Scenario: Controlling seat heating, ventilation, and massage actuators based on user preferences and thermal feedback.

IC Role / Device Role / Timing Role: Motor and thermal control MCU driving H-bridge drivers, reading NTC thermistors via ADC, and regulating PWM outputs for heater elements.

Use Value: Two advanced timers with dead-band insertion safely drive bidirectional seat motors; integrated VREF ensures accurate temperature measurement across operating range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
M0G3107QDGS32RQ1128KB flash, 32KB SRAM - same package, peripherals, and safety certification.Required when firmware size exceeds 64KB or future-proofing for OTA updates is needed.Select for larger application code footprints while retaining identical pinout, layout, and qualification.
S912ZVMC12F0MLFRFreescale S12Z core (16-bit), 128KB flash, no CAN-FD, ASIL B via software-only measures.Limited to legacy CAN 2.0B networks; lacks hardware crypto and dual high-speed ADCs.Consider only for cost-sensitive brownfield designs where CAN-FD and security are not required.

Compared with M0G3107QDGS32RQ1, the M0G3106QDGS32RQ1 offers optimal balance of flash capacity, power efficiency, and CAN-FD bandwidth for mid-tier automotive modules; versus S912ZVMC12F0MLFR, it delivers higher compute throughput, native CAN-FD, and hardware-enforced security - reducing integration risk in new designs.

Availability

M0G3106QDGS32RQ1 is available at Aetrix Electronics and suitable for automotive body electronics, steering wheel systems, and seat comfort modules requiring stable component supply, AEC-Q100 compliance, and long-term production continuity.

Supply support for M0G3106QDGS32RQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for automotive, industrial, and personal electronics markets.

The M0G3106QDGS32RQ1 belongs to the MSPM0G310x-Q1 family - purpose-built for cost-optimized, functional-safety-compliant automotive microcontrollers integrating high-performance analog, CAN-FD, and ultra-low-power operation in compact packages.

FAQ

What is the maximum operating frequency of the M0G3106QDGS32RQ1?

The M0G3106QDGS32RQ1 features an Arm Cortex-M0+ CPU with a maximum operating frequency of 80MHz, achieved via its integrated PLL. This frequency is fully supported across the specified operating temperature range (–40°C to 125°C) and supply voltage (1.62V to 3.6V), enabling deterministic real-time execution in automotive control loops. The M0G3106QDGS32RQ1 maintains timing accuracy through its ±1.2% internal SYSOSC and optional external crystal support.

Does the M0G3106QDGS32RQ1 support CAN-FD, and what data rates are achievable?

Yes, the M0G3106QDGS32RQ1 integrates a Controller Area Network interface compliant with both CAN 2.0A/B and CAN-FD protocols. It supports bit rates up to 5Mbps in FD mode, with flexible data phase configuration. The dedicated CAN_TX and CAN_RX pins (PA12/PA13) are electrically optimized for low-emission routing, and the peripheral includes hardware message filtering and FIFO buffering - all confirmed in the M0G3106QDGS32RQ1 technical reference manual.

How many analog input channels does the M0G3106QDGS32RQ1 support in its 32-pin VSSOP package?

In the 32-pin VSSOP (DGS) package, the M0G3106QDGS32RQ1 supports up to 11 external analog input channels across its dual 12-bit ADC subsystem. This is explicitly documented in Table 5-1 (Device Comparison) and Section 6.2 (Pin Attributes) of the datasheet, where pins PA21–PA27, PA22–PA25, and PA26–PA27 are assigned to A0_x and A1_x analog functions. No additional external muxing is required to access all 11 channels.

What low-power modes are available on the M0G3106QDGS32RQ1, and what is the lowest current draw?

The M0G3106QDGS32RQ1 offers five configurable low-power modes: RUN, SLEEP, STOP, STANDBY, and SHUTDOWN. The lowest active-retention mode is STANDBY, drawing just 1.5µA while retaining SRAM, CPU register state, and RTC operation with 32kHz LFXT. SHUTDOWN draws 80nA but loses all state except IO wake-up capability. These values are measured and guaranteed per the recommended operating conditions in Section 7.5 of the M0G3106QDGS32RQ1 datasheet.

Is the M0G3106QDGS32RQ1 qualified for automotive use, and what safety certifications does it hold?

Yes, the M0G3106QDGS32RQ1 is AEC-Q100 Grade 1 qualified (–40°C to 125°C) and certified by TÜV for functional safety up to ASIL B per ISO 26262. Documentation supporting systematic capability and hardware integrity analysis is provided by Texas Instruments. These qualifications apply specifically to the M0G3106QDGS32RQ1 device variant - not inferred from family-level claims - and are verified in the device's production data sheet (SLASF86C, September 2025 revision).

M0G3106QDGS32RQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
32-TFSOP (0.118", 3.00mm Width)
Series:
MSPM0 G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
AES, Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 11x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

M0G3106QDGS32RQ1 FAQ

1.How can I place an order for M0G3106QDGS32RQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for M0G3106QDGS32RQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M0G3106QDGS32RQ1 reliable?

The price and inventory of M0G3106QDGS32RQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M0G3106QDGS32RQ1 is usually 5 days.

3.What payment methods are accepted for M0G3106QDGS32RQ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M0G3106QDGS32RQ1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for M0G3106QDGS32RQ1?

M0G3106QDGS32RQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M0G3106QDGS32RQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M0G3106QDGS32RQ1?

For technical support, including M0G3106QDGS32RQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M0G3106QDGS32RQ1 requirements.

6.How does Aetrix verify that M0G3106QDGS32RQ1 is sourced from the original manufacturer or authorized distributors?

All M0G3106QDGS32RQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0G3106QDGS32RQ1 meets industry standards.

7.What is the process for return or replacement of M0G3106QDGS32RQ1?

All M0G3106QDGS32RQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0G3106QDGS32RQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M0G3106QDGS32RQ1 part is unused and in its original packaging.

Return procedure for M0G3106QDGS32RQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

M0G3106QDGS32RQ1 Tags

  • M0G3106QDGS32RQ1
  • M0G3106QDGS32RQ1 PDF
  • M0G3106QDGS32RQ1 Datasheet
  • M0G3106QDGS32RQ1 Specifications
  • M0G3106QDGS32RQ1 Images
  • Texas Instruments
  • Texas Instruments M0G3106QDGS32RQ1
  • Buy M0G3106QDGS32RQ1
  • M0G3106QDGS32RQ1 Price
  • M0G3106QDGS32RQ1 Distributor
  • M0G3106QDGS32RQ1 Supplier
  • M0G3106QDGS32RQ1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER