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Texas Instruments M0L1304QDGS28RQ1
- Part No.:
- M0L1304QDGS28RQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 28-TFSOP (0.118", 3.00mm Width)
- Datasheet:
-
M0L1304QDGS28RQ1.pdf
- Description:
- AUTOMOTIVE 32-MHZ ARM CORTEX-M0+
- Quantity:
- Payment:
- Shipping:
Inventory:4,615
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Product details
Overview
M0L1304QDGS28RQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive-qualified Arm® Cortex®-M0+ microcontroller operating up to 32 MHz, featuring 16 KB flash, 2 KB SRAM, a 12-bit 1.68-Msps ADC with 10 external channels, two zero-drift chopper op-amps, and integrated temperature sensing - deployed in steering wheel systems and door handle modules.
For engineers reviewing the M0L1304QDGS28RQ1 datasheet, M0L1304QDGS28RQ1 pinout, M0L1304QDGS28RQ1 application, or M0L1304QDGS28RQ1 equivalent, key selection criteria include its 28-pin VSSOP package, -40°C to +125°C operation, 1.62–3.6 V supply range, low-power STANDBY mode (1.0 µA), and functional safety documentation support.
Technical Context
The M0L1304QDGS28RQ1 implements an Arm Cortex-M0+ core with on-chip SYSOSC (±1.2% accuracy) and LFOSC (±3%), eliminating external crystals. Its analog subsystem integrates ADC0 with configurable 1.4-V/2.5-V internal VREF, COMP0 with 8-bit reference DAC and 32-ns propagation delay, and OPA0/OPA1 with 0.5-µV/°C drift and programmable gain (1–32×).
Digital peripherals include four 16-bit timers supporting 8 PWM channels, two UARTs (one LIN-capable), two I²C interfaces (one FM+), one SPI (16 Mbit/s), 3-channel DMA, and event fabric signaling - all operable in STANDBY mode with sub-µA retention and 3.2-µs wakeup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0+, 32 MHz max - enables deterministic real-time control in automotive body electronics. |
| Flash / SRAM | 16 KB flash / 2 KB SRAM - sufficient for compact firmware in occupancy detection and kick-to-open modules. |
| ADC | 12-bit, 1.68-Msps, 10 external channels - supports high-speed sensor acquisition in seat comfort and lighting control. |
| OPA Performance | Zero-drift chopper op-amps, 0.5-µV/°C drift, 1–32× programmable gain - ensures stable signal conditioning over automotive temperature range. |
| Low-Power Modes | STANDBY: 1.0 µA with 32-kHz timer running, full SRAM retention, 3.2-µs wakeup - extends battery life in always-on vehicle modules. |
| Operating Range | -40°C to +125°C, 1.62–3.6 V supply - meets AEC-Q100 Grade 1 requirements for under-hood and interior automotive use. |
| Package | 28-pin VSSOP (7.1 mm × 4.9 mm) - surface-mount compatible with space-constrained automotive PCB layouts. |
Pinout & Package
28-pin VSSOP (DGS28) package with exposed thermal pad recommended to be connected to VSS. Pin count and footprint match TI's standardized 28-pin VSSOP layout for drop-in compatibility across MSPM0L130x variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0 / PA1 | 5-V-tolerant open-drain I/O | Support LIN bus physical layer and fail-safe I²C communication without level shifters. |
| PA20 / PA19 | SWCLK / SWDIO | 2-pin serial wire debug interface - enables in-system programming and real-time debugging with minimal PCB routing. |
| PA27 / PA26 / PA25 / PA24 / PA23 / PA22 / PA21 | ADC0 analog inputs A0–A6 | Seven dedicated analog input pins with internal multiplexer - simplifies multi-sensor analog front-end design. |
| PA23 / PA21 | VREF+ / VREF- | Configurable 1.4-V or 2.5-V internal ADC reference - eliminates need for external voltage reference ICs. |
| PA18 / PA19 / PA20 / PA21 | GPAMP_IN-, OPA1_IN0+, COMP0_IN1+, A5 | Shared analog/digital pins with flexible IOMUX - allows dynamic reconfiguration of signal paths in runtime. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 1 qualification | Validated for automotive environments (-40°C to +125°C), enabling direct use in production body control modules without additional qualification. |
| Functional Safety Quality-Managed | Documentation provided for ISO 26262 ASIL-B system-level integration - reduces safety case development effort for OEMs. |
| Integrated analog subsystem | ADC + dual chopper OPAs + COMP + GPAMP + temperature sensor on single die - replaces 4–5 discrete analog ICs in sensor signal chains. |
| Ultra-low-power STANDBY mode | 1.0 µA with 32-kHz timer active and full register/SRAM retention - enables always-on wake-on-event functionality in door handle and occupancy systems. |
| Flexible communication stack | Two UARTs (LIN-capable), two I²C (SMBus/PMBus), one SPI - supports mixed-protocol gateways connecting CAN, LIN, and local sensors. |
Applications
| Steering Wheel Systems | Door Handle Modules |
|---|---|
Use Scenario: Real-time monitoring of capacitive touch buttons, rotary encoders, and haptic feedback drivers in driver-facing controls. IC Role / Device Role / Timing Role: Main MCU executing touch algorithm, managing LED indicators, and communicating via LIN to body domain controller. Use Value: Integrated ADC and chopper OPAs enable precise analog front-end for touch sensing; STANDBY mode supports instant wake from sleep on button press. |
Use Scenario: Proximity detection, mechanical actuation control, and tamper alert handling in exterior door handles. IC Role / Device Role / Timing Role: Sensor fusion processor aggregating capacitive, Hall-effect, and ambient light data; transmits status over LIN. Use Value: 10-channel ADC and programmable gain OPAs allow simultaneous conditioning of multiple sensor types; 1.0 µA STANDBY extends vehicle standby time. |
| Kick-to-Open Modules | Seat Comfort Module |
Use Scenario: Detecting leg motion via ultrasonic or radar sensor signals, triggering rear liftgate actuation. IC Role / Device Role / Timing Role: Signal acquisition and preprocessing unit interfacing with analog radar front-end and controlling motor driver ICs. Use Value: 1.68-Msps ADC captures fast-rising echo pulses; zero-drift OPAs maintain DC accuracy across cabin temperature swings. |
Use Scenario: Monitoring seat position, weight, heating element current, and occupant presence via thermistors and current shunts. IC Role / Device Role / Timing Role: Dedicated analog-intensive MCU performing closed-loop thermal control and occupancy classification. Use Value: Dual chopper OPAs condition low-level thermistor and shunt signals; integrated temperature sensor enables self-calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSPM0L1305QDGS28Q1 | 32 KB flash, 4 KB SRAM, same package and peripheral set | Supports larger firmware images for enhanced diagnostics or OTA update capability | Select when firmware size exceeds 16 KB or additional RAM is required for buffer-intensive protocols. |
| STM32G031K8T6 | Arm Cortex-M0+, 64 MHz, 64 KB flash, 8 KB SRAM, no chopper OPAs or integrated VREF | Lacks automotive-grade analog integration; requires external op-amps and reference for precision sensing | Choose only if higher CPU speed and memory are prioritized over analog integration and AEC-Q100 qualification. |
Compared with MSPM0L1305QDGS28Q1, M0L1304QDGS28RQ1 trades flash/SRAM capacity for cost-sensitive designs where analog integration remains critical; versus STM32G031K8T6, it delivers automotive-qualified analog subsystems but at lower clock speed and memory - making it optimal for analog-centric, safety-aware body electronics.
Availability
M0L1304QDGS28RQ1 is available at Aetrix Electronics and suitable for automotive body electronics, steering wheel systems, and door handle modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for M0L1304QDGS28RQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive, industrial, and power management solutions.
The MSPM0L130x-Q1 product line delivers ultra-low-power, AEC-Q100 qualified MCUs optimized for cost-sensitive automotive body electronics - integrating high-precision analog peripherals to reduce system component count and simplify design.
FAQ
What is the maximum operating frequency of the M0L1304QDGS28RQ1?
The M0L1304QDGS28RQ1 features an Arm Cortex-M0+ CPU with a maximum operating frequency of 32 MHz. This speed is supported by the internal SYSOSC oscillator, which maintains ±1.2% accuracy across the full -40°C to +125°C temperature range - eliminating the need for external crystal components in most automotive applications.
Does the M0L1304QDGS28RQ1 support LIN communication?
Yes, the M0L1304QDGS28RQ1 supports LIN communication through UART0, which is explicitly listed in the datasheet as LIN-capable. One of its two UART interfaces includes hardware support for LIN protocol timing and frame formatting, enabling direct connection to LIN transceivers in body control networks without software bit-banging.
How many analog input channels does the M0L1304QDGS28RQ1 ADC support?
The M0L1304QDGS28RQ1 integrates a 12-bit ADC (ADC0) with up to 10 total external analog input channels (A0–A9). In the 28-pin VSSOP package, pins PA27 through PA21 and PA20, PA19, PA18, PA17 provide access to A0–A7, while A8 and A9 are routed to PA16 and PA15 - all usable simultaneously under proper IOMUX configuration.
What low-power modes are available on the M0L1304QDGS28RQ1?
The M0L1304QDGS28RQ1 offers four defined low-power modes: RUN (71 µA/MHz), STOP (151 µA at 4 MHz), STANDBY (1.0 µA with 32-kHz timer active and full SRAM retention), and SHUTDOWN (61 nA with IO wakeup). STANDBY mode enables fastest wakeup (3.2 µs) while preserving context - ideal for event-driven automotive modules like door handles.
Is the M0L1304QDGS28RQ1 pin-compatible with other MSPM0L130x-Q1 variants in the same package?
Yes, the M0L1304QDGS28RQ1 is pin-compatible with MSPM0L1305QDGS28Q1 and MSPM0L1306QDGS28Q1 in the 28-pin VSSOP (DGS28) package. All share identical pin functions, electrical characteristics, and mechanical footprint - allowing firmware and PCB reuse across flash/RAM variants during design scaling or cost optimization.
M0L1304QDGS28RQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 28-TFSOP (0.118", 3.00mm Width)
- Series:
- MSPM0 L
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
- Number of I/O:
- 24
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 10x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
M0L1304QDGS28RQ1 FAQ
1.How can I place an order for M0L1304QDGS28RQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for M0L1304QDGS28RQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M0L1304QDGS28RQ1 reliable?
The price and inventory of M0L1304QDGS28RQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M0L1304QDGS28RQ1 is usually 5 days.
3.What payment methods are accepted for M0L1304QDGS28RQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M0L1304QDGS28RQ1 transactions.
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4.How is shipping managed for M0L1304QDGS28RQ1?
M0L1304QDGS28RQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M0L1304QDGS28RQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M0L1304QDGS28RQ1?
For technical support, including M0L1304QDGS28RQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M0L1304QDGS28RQ1 requirements.
6.How does Aetrix verify that M0L1304QDGS28RQ1 is sourced from the original manufacturer or authorized distributors?
All M0L1304QDGS28RQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0L1304QDGS28RQ1 meets industry standards.
7.What is the process for return or replacement of M0L1304QDGS28RQ1?
All M0L1304QDGS28RQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0L1304QDGS28RQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M0L1304QDGS28RQ1 part is unused and in its original packaging.
Return procedure for M0L1304QDGS28RQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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