Texas Instruments M0L1304QDGS32RQ1
- Part No.:
- M0L1304QDGS32RQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 32-TFSOP (0.118", 3.00mm Width)
- Datasheet:
-
M0L1304QDGS32RQ1.pdf
- Description:
- AUTOMOTIVE 32-MHZ ARM CORTEX-M0+
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
M0L1304QDGS32RQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive-qualified 32-bit Arm® Cortex®-M0+ microcontroller operating up to 32 MHz, featuring 16 KB flash, 2 KB SRAM, a 12-bit 1.68-Msps ADC with 10 external channels, two zero-drift chopper op-amps, and dual UART/I²C/SPI interfaces - deployed in steering wheel systems and door handle modules.
For engineers reviewing the M0L1304QDGS32RQ1 datasheet, M0L1304QDGS32RQ1 pinout, M0L1304QDGS32RQ1 application, or M0L1304QDGS32RQ1 equivalent, key selection criteria include its -40°C to +125°C operation, 1.62–3.6 V supply range, STANDBY mode at 1.0 µA with 32-kHz timer retention, and 32-pin VSSOP package with two 5-V-tolerant open-drain I/Os for fail-safe automotive interface design.
Technical Context
The M0L1304QDGS32RQ1 integrates a 32-MHz Arm Cortex-M0+ core with on-chip SYSOSC (±1.2% accuracy) eliminating external crystals, and supports ultra-low-power operation via RUN (71 µA/MHz), STOP (44 µA @ 32 kHz), STANDBY (1.0 µA), and SHUTDOWN (61 nA) modes with 3.2-µs wakeup from STANDBY.
Its analog subsystem includes programmable connections between ADC, OPAs, COMP, and DAC; a configurable 1.4-V/2.5-V internal VREF; and a high-speed comparator with 32-ns propagation delay and integrated 8-bit reference DAC - all accessible through dedicated analog-capable pins in the 32-pin VSSOP footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M0+, 32 MHz max - enables real-time control in automotive body electronics without external clock source |
| Flash / SRAM | 16 KB / 2 KB - sufficient for LIN gateway firmware with safety-critical boot code and runtime calibration data |
| ADC | 12-bit, 1.68-Msps, 10-channel - supports simultaneous sampling of multiple sensor inputs in seat comfort modules |
| OPA | Two zero-drift chopper op-amps (0.5 µV/°C drift, 1–32× gain) - delivers stable signal conditioning for thermistor-based occupancy detection |
| Low-Power Mode | STANDBY: 1.0 µA with 32-kHz timer active, full SRAM retention, 3.2-µs wakeup - ideal for always-on kick-to-open wake detection |
| Package | 32-pin VSSOP (8.1 mm × 4.9 mm) - surface-mount compatible with automotive PCB assembly standards and thermal constraints |
| IO | 28 GPIOs, including two 5-V-tolerant open-drain pins - enables direct connection to 5-V LIN transceivers or discrete LED drivers without level shifters |
Pinout & Package
Package: 32-pin VSSOP (DGS), 8.1 mm × 4.9 mm body size, standard JEDEC MS-012AC footprint with exposed pad not applicable (non-QFN).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS / VCORE | Power rails | VDD (Pin 7): 1.62–3.6 V main supply; VSS (Pin 8): ground reference; VCORE (Pin 3): regulated 1.2-V core output for internal logic stability |
| PA20 / SWCLK, PA19 / SWDIO | Debug interface | 2-pin SWD for production programming and field firmware updates without requiring JTAG header space |
| PA23 / VREF+, PA21 / VREF- | ADC reference | Dedicated differential reference inputs supporting internal 1.4-V or 2.5-V VREF selection for precise ratiometric sensor measurements |
| PA27 / A0 to PA15 / A9 | ADC analog inputs | 10 external ADC channels mapped across pins PA27–PA15 - enables direct connection of potentiometers, thermistors, and current-sense resistors |
| PA26 / A1, PA25 / A2, PA24 / A3 | OPA0 input terminals | Three dedicated pins for OPA0 non-inverting/inverting inputs - supports fully differential sensor front-end configurations with programmable gain |
| PA22 / A4, PA18 / A7 | GPAMP / OPA1 I/O | GPAMP_IN− (PA22), GPAMP_IN+ (PA26), GPAMP_OUT (PA22); OPA1_IN0+ (PA18) - enables closed-loop amplifier feedback without external routing |
| PA11, PA10 | UART1 TX/RX | Hardware UART with LIN protocol support - allows direct integration with automotive LIN bus nodes in steering column ECUs |
| PA0, PA1 | 5-V tolerant ODIO | Open-drain outputs with fail-safe protection - drive external pull-up to 5 V for LIN transceiver enable or LED status indication |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 1 qualification | Validated for -40°C to +125°C ambient operation - meets automotive cabin and under-hood temperature requirements without derating |
| Integrated chopper op-amps | 0.5 µV/°C input offset drift with 1–32× programmable gain - eliminates manual calibration in vehicle occupancy detection using capacitive sensors |
| Configurable low-power modes | SHUTDOWN mode draws only 61 nA with IO wakeup - extends battery life in passive entry systems with infrequent user interaction |
| On-chip CRC accelerator | Hardware CRC-16/CRC-32 engine - ensures integrity of flash updates and EEPROM-emulated parameter storage in safety-critical applications |
| Flexible analog interconnect | Programmable routing between ADC, OPAs, COMP, and DAC - enables software-defined signal chains for multi-sensor fusion in seat comfort modules |
Applications
| Steering Wheel Systems | Door Handle Modules |
|---|---|
Use Scenario: Real-time processing of capacitive touch, button press, and haptic feedback signals within constrained space and thermal envelope. IC Role / Device Role / Timing Role: Main MCU executing touch algorithm, driving local haptics, and communicating via LIN to body control module. Use Value: Integrated 12-bit ADC and zero-drift OPAs enable direct analog front-end acquisition without external signal conditioning, reducing BOM count by ≥3 components. | Use Scenario: Detecting hand proximity and actuating mechanical latch release in keyless entry systems with ultra-low standby power. IC Role / Device Role / Timing Role: Always-on sensor hub managing capacitive sensing, wake-on-touch, and secure LIN communication with central gateway. Use Value: STANDBY mode at 1.0 µA with retained SRAM and 32-kHz timer allows sub-second response to proximity events while extending 12-V battery life beyond 10 years. |
| Kick-to-Open Modules | Vehicle Occupancy Detection |
Use Scenario: Detecting foot motion beneath rear bumper using time-of-flight or IR sensor array, triggering liftgate actuation. IC Role / Device Role / Timing Role: Edge-processing node performing motion pattern recognition and sending validated trigger command over CAN/LIN. Use Value: Dual UART interfaces support concurrent LIN diagnostics and CAN message forwarding, eliminating need for separate communication ICs. | Use Scenario: Monitoring seat capacitance and pressure distribution to determine occupant presence, size, and posture for airbag deployment logic. IC Role / Device Role / Timing Role: Analog-intensive sensor fusion MCU acquiring multi-channel capacitive and resistive inputs with calibrated gain and reference. Use Value: Configurable 1.4-V/2.5-V internal VREF and programmable OPA gain allow single hardware design to support multiple seat sensor variants without resistor changes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSPM0L1305QDGS32Q1 | 32 KB flash, 4 KB SRAM - double program memory and RAM capacity | Supports larger LIN stack with OTA update capability and extended diagnostic logging | Select when firmware complexity exceeds 16 KB or runtime data buffers require >2 KB SRAM |
| S9S12G128F0MLH | 16-bit S12X core, 25 MHz, 128 KB flash, no integrated chopper op-amps or VREF | Legacy automotive platform with mature toolchain but higher power and less analog integration | Select only for brownfield designs requiring pin-compatible migration from older S12G family |
Compared with MSPM0L1305QDGS32Q1, M0L1304QDGS32RQ1 trades flash/SRAM headroom for cost-sensitive volume production; versus S9S12G128F0MLH, it delivers superior analog integration and 4× lower STANDBY current, enabling new energy-efficient architectures.
Availability
M0L1304QDGS32RQ1 is available at Aetrix Electronics and suitable for automotive body electronics, steering wheel systems, and door handle modules requiring stable component supply across extended product lifecycles and AEC-Q100-compliant traceability.
Supply support for M0L1304QDGS32RQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for automotive, industrial, and personal electronics markets.
The MSPM0L130x-Q1 product line targets cost-optimized, ultra-low-power automotive microcontrollers with integrated high-precision analog peripherals - designed specifically for body electronics, lighting, and electromechanical control where AEC-Q100 compliance and minimal external components are critical.
FAQ
What is the maximum operating frequency and core architecture of the M0L1304QDGS32RQ1?
The M0L1304QDGS32RQ1 features an Arm Cortex-M0+ 32-bit RISC core with a maximum operating frequency of 32 MHz. It uses a Harvard architecture with separate instruction and data buses, enabling efficient execution of automotive control algorithms. The device achieves this speed using its internal 4–32 MHz SYSOSC with ±1.2% accuracy, eliminating the need for an external crystal oscillator in most applications.
Does the M0L1304QDGS32RQ1 support AEC-Q100 qualification, and what temperature grade does it meet?
Yes, the M0L1304QDGS32RQ1 is AEC-Q100 qualified for automotive applications and meets Grade 1 specifications, operating reliably from –40°C to +125°C ambient temperature. This qualification covers stress testing for accelerated environmental, thermal, and lifetime reliability - confirming suitability for under-hood and cabin-mounted electronic control units without derating.
How much flash memory and SRAM does the M0L1304QDGS32RQ1 include, and what are their typical use cases?
The M0L1304QDGS32RQ1 includes 16 KB of embedded flash memory and 2 KB of SRAM. The flash stores application firmware, bootloader, and calibration constants; the SRAM holds runtime variables, stack, and sensor buffers. This configuration supports LIN gateway stacks, capacitive touch firmware, and real-time motor control loops in resource-constrained automotive modules like door handles and kick-to-open systems.
What analog peripherals are integrated into the M0L1304QDGS32RQ1, and how do they support automotive sensing?
The M0L1304QDGS32RQ1 integrates a 12-bit 1.68-Msps ADC with up to 10 external channels, two zero-drift chopper op-amps (0.5 µV/°C drift), one general-purpose amplifier, one high-speed comparator (32-ns propagation), and a configurable 1.4-V/2.5-V internal voltage reference. These enable direct acquisition and conditioning of thermistor, capacitive, and current-sense signals in occupancy detection and seat comfort modules without external signal chain components.
What low-power modes does the M0L1304QDGS32RQ1 support, and what are their current consumption values?
The M0L1304QDGS32RQ1 supports RUN (71 µA/MHz), STOP (44 µA @ 32 kHz), STANDBY (1.0 µA with 32-kHz timer active and full SRAM retention), and SHUTDOWN (61 nA with IO wakeup). STANDBY mode enables fast 3.2-µs wakeup - critical for always-on applications like proximity sensing in door handle modules where responsiveness and battery longevity are both essential.
M0L1304QDGS32RQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 32-TFSOP (0.118", 3.00mm Width)
- Series:
- MSPM0 L
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 10x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
M0L1304QDGS32RQ1 FAQ
1.How can I place an order for M0L1304QDGS32RQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for M0L1304QDGS32RQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M0L1304QDGS32RQ1 reliable?
The price and inventory of M0L1304QDGS32RQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M0L1304QDGS32RQ1 is usually 5 days.
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5.How can I obtain technical support or documentation for M0L1304QDGS32RQ1?
For technical support, including M0L1304QDGS32RQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M0L1304QDGS32RQ1 requirements.
6.How does Aetrix verify that M0L1304QDGS32RQ1 is sourced from the original manufacturer or authorized distributors?
All M0L1304QDGS32RQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0L1304QDGS32RQ1 meets industry standards.
7.What is the process for return or replacement of M0L1304QDGS32RQ1?
All M0L1304QDGS32RQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0L1304QDGS32RQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M0L1304QDGS32RQ1 part is unused and in its original packaging.
Return procedure for M0L1304QDGS32RQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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