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Texas Instruments M0L1304QDGS32RQ1

Part No.:
M0L1304QDGS32RQ1
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
32-TFSOP (0.118", 3.00mm Width)
Datasheet:
AetrixM0L1304QDGS32RQ1.pdf
Description:
AUTOMOTIVE 32-MHZ ARM CORTEX-M0+
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,000

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Product details

Overview

M0L1304QDGS32RQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive-qualified 32-bit Arm® Cortex®-M0+ microcontroller operating up to 32 MHz, featuring 16 KB flash, 2 KB SRAM, a 12-bit 1.68-Msps ADC with 10 external channels, two zero-drift chopper op-amps, and dual UART/I²C/SPI interfaces - deployed in steering wheel systems and door handle modules.

For engineers reviewing the M0L1304QDGS32RQ1 datasheet, M0L1304QDGS32RQ1 pinout, M0L1304QDGS32RQ1 application, or M0L1304QDGS32RQ1 equivalent, key selection criteria include its -40°C to +125°C operation, 1.62–3.6 V supply range, STANDBY mode at 1.0 µA with 32-kHz timer retention, and 32-pin VSSOP package with two 5-V-tolerant open-drain I/Os for fail-safe automotive interface design.

Technical Context

The M0L1304QDGS32RQ1 integrates a 32-MHz Arm Cortex-M0+ core with on-chip SYSOSC (±1.2% accuracy) eliminating external crystals, and supports ultra-low-power operation via RUN (71 µA/MHz), STOP (44 µA @ 32 kHz), STANDBY (1.0 µA), and SHUTDOWN (61 nA) modes with 3.2-µs wakeup from STANDBY.

Its analog subsystem includes programmable connections between ADC, OPAs, COMP, and DAC; a configurable 1.4-V/2.5-V internal VREF; and a high-speed comparator with 32-ns propagation delay and integrated 8-bit reference DAC - all accessible through dedicated analog-capable pins in the 32-pin VSSOP footprint.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M0+, 32 MHz max - enables real-time control in automotive body electronics without external clock source
Flash / SRAM16 KB / 2 KB - sufficient for LIN gateway firmware with safety-critical boot code and runtime calibration data
ADC12-bit, 1.68-Msps, 10-channel - supports simultaneous sampling of multiple sensor inputs in seat comfort modules
OPATwo zero-drift chopper op-amps (0.5 µV/°C drift, 1–32× gain) - delivers stable signal conditioning for thermistor-based occupancy detection
Low-Power ModeSTANDBY: 1.0 µA with 32-kHz timer active, full SRAM retention, 3.2-µs wakeup - ideal for always-on kick-to-open wake detection
Package32-pin VSSOP (8.1 mm × 4.9 mm) - surface-mount compatible with automotive PCB assembly standards and thermal constraints
IO28 GPIOs, including two 5-V-tolerant open-drain pins - enables direct connection to 5-V LIN transceivers or discrete LED drivers without level shifters

Pinout & Package

Package: 32-pin VSSOP (DGS), 8.1 mm × 4.9 mm body size, standard JEDEC MS-012AC footprint with exposed pad not applicable (non-QFN).

Pin/TerminalCircuit RoleDesign Meaning
VDD / VSS / VCOREPower railsVDD (Pin 7): 1.62–3.6 V main supply; VSS (Pin 8): ground reference; VCORE (Pin 3): regulated 1.2-V core output for internal logic stability
PA20 / SWCLK, PA19 / SWDIODebug interface2-pin SWD for production programming and field firmware updates without requiring JTAG header space
PA23 / VREF+, PA21 / VREF-ADC referenceDedicated differential reference inputs supporting internal 1.4-V or 2.5-V VREF selection for precise ratiometric sensor measurements
PA27 / A0 to PA15 / A9ADC analog inputs10 external ADC channels mapped across pins PA27–PA15 - enables direct connection of potentiometers, thermistors, and current-sense resistors
PA26 / A1, PA25 / A2, PA24 / A3OPA0 input terminalsThree dedicated pins for OPA0 non-inverting/inverting inputs - supports fully differential sensor front-end configurations with programmable gain
PA22 / A4, PA18 / A7GPAMP / OPA1 I/OGPAMP_IN− (PA22), GPAMP_IN+ (PA26), GPAMP_OUT (PA22); OPA1_IN0+ (PA18) - enables closed-loop amplifier feedback without external routing
PA11, PA10UART1 TX/RXHardware UART with LIN protocol support - allows direct integration with automotive LIN bus nodes in steering column ECUs
PA0, PA15-V tolerant ODIOOpen-drain outputs with fail-safe protection - drive external pull-up to 5 V for LIN transceiver enable or LED status indication

Key Features

FeatureDesign Value
AEC-Q100 Grade 1 qualificationValidated for -40°C to +125°C ambient operation - meets automotive cabin and under-hood temperature requirements without derating
Integrated chopper op-amps0.5 µV/°C input offset drift with 1–32× programmable gain - eliminates manual calibration in vehicle occupancy detection using capacitive sensors
Configurable low-power modesSHUTDOWN mode draws only 61 nA with IO wakeup - extends battery life in passive entry systems with infrequent user interaction
On-chip CRC acceleratorHardware CRC-16/CRC-32 engine - ensures integrity of flash updates and EEPROM-emulated parameter storage in safety-critical applications
Flexible analog interconnectProgrammable routing between ADC, OPAs, COMP, and DAC - enables software-defined signal chains for multi-sensor fusion in seat comfort modules

Applications

Steering Wheel SystemsDoor Handle Modules

Use Scenario: Real-time processing of capacitive touch, button press, and haptic feedback signals within constrained space and thermal envelope.

IC Role / Device Role / Timing Role: Main MCU executing touch algorithm, driving local haptics, and communicating via LIN to body control module.

Use Value: Integrated 12-bit ADC and zero-drift OPAs enable direct analog front-end acquisition without external signal conditioning, reducing BOM count by ≥3 components.

Use Scenario: Detecting hand proximity and actuating mechanical latch release in keyless entry systems with ultra-low standby power.

IC Role / Device Role / Timing Role: Always-on sensor hub managing capacitive sensing, wake-on-touch, and secure LIN communication with central gateway.

Use Value: STANDBY mode at 1.0 µA with retained SRAM and 32-kHz timer allows sub-second response to proximity events while extending 12-V battery life beyond 10 years.

Kick-to-Open ModulesVehicle Occupancy Detection

Use Scenario: Detecting foot motion beneath rear bumper using time-of-flight or IR sensor array, triggering liftgate actuation.

IC Role / Device Role / Timing Role: Edge-processing node performing motion pattern recognition and sending validated trigger command over CAN/LIN.

Use Value: Dual UART interfaces support concurrent LIN diagnostics and CAN message forwarding, eliminating need for separate communication ICs.

Use Scenario: Monitoring seat capacitance and pressure distribution to determine occupant presence, size, and posture for airbag deployment logic.

IC Role / Device Role / Timing Role: Analog-intensive sensor fusion MCU acquiring multi-channel capacitive and resistive inputs with calibrated gain and reference.

Use Value: Configurable 1.4-V/2.5-V internal VREF and programmable OPA gain allow single hardware design to support multiple seat sensor variants without resistor changes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSPM0L1305QDGS32Q132 KB flash, 4 KB SRAM - double program memory and RAM capacitySupports larger LIN stack with OTA update capability and extended diagnostic loggingSelect when firmware complexity exceeds 16 KB or runtime data buffers require >2 KB SRAM
S9S12G128F0MLH16-bit S12X core, 25 MHz, 128 KB flash, no integrated chopper op-amps or VREFLegacy automotive platform with mature toolchain but higher power and less analog integrationSelect only for brownfield designs requiring pin-compatible migration from older S12G family

Compared with MSPM0L1305QDGS32Q1, M0L1304QDGS32RQ1 trades flash/SRAM headroom for cost-sensitive volume production; versus S9S12G128F0MLH, it delivers superior analog integration and 4× lower STANDBY current, enabling new energy-efficient architectures.

Availability

M0L1304QDGS32RQ1 is available at Aetrix Electronics and suitable for automotive body electronics, steering wheel systems, and door handle modules requiring stable component supply across extended product lifecycles and AEC-Q100-compliant traceability.

Supply support for M0L1304QDGS32RQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for automotive, industrial, and personal electronics markets.

The MSPM0L130x-Q1 product line targets cost-optimized, ultra-low-power automotive microcontrollers with integrated high-precision analog peripherals - designed specifically for body electronics, lighting, and electromechanical control where AEC-Q100 compliance and minimal external components are critical.

FAQ

What is the maximum operating frequency and core architecture of the M0L1304QDGS32RQ1?

The M0L1304QDGS32RQ1 features an Arm Cortex-M0+ 32-bit RISC core with a maximum operating frequency of 32 MHz. It uses a Harvard architecture with separate instruction and data buses, enabling efficient execution of automotive control algorithms. The device achieves this speed using its internal 4–32 MHz SYSOSC with ±1.2% accuracy, eliminating the need for an external crystal oscillator in most applications.

Does the M0L1304QDGS32RQ1 support AEC-Q100 qualification, and what temperature grade does it meet?

Yes, the M0L1304QDGS32RQ1 is AEC-Q100 qualified for automotive applications and meets Grade 1 specifications, operating reliably from –40°C to +125°C ambient temperature. This qualification covers stress testing for accelerated environmental, thermal, and lifetime reliability - confirming suitability for under-hood and cabin-mounted electronic control units without derating.

How much flash memory and SRAM does the M0L1304QDGS32RQ1 include, and what are their typical use cases?

The M0L1304QDGS32RQ1 includes 16 KB of embedded flash memory and 2 KB of SRAM. The flash stores application firmware, bootloader, and calibration constants; the SRAM holds runtime variables, stack, and sensor buffers. This configuration supports LIN gateway stacks, capacitive touch firmware, and real-time motor control loops in resource-constrained automotive modules like door handles and kick-to-open systems.

What analog peripherals are integrated into the M0L1304QDGS32RQ1, and how do they support automotive sensing?

The M0L1304QDGS32RQ1 integrates a 12-bit 1.68-Msps ADC with up to 10 external channels, two zero-drift chopper op-amps (0.5 µV/°C drift), one general-purpose amplifier, one high-speed comparator (32-ns propagation), and a configurable 1.4-V/2.5-V internal voltage reference. These enable direct acquisition and conditioning of thermistor, capacitive, and current-sense signals in occupancy detection and seat comfort modules without external signal chain components.

What low-power modes does the M0L1304QDGS32RQ1 support, and what are their current consumption values?

The M0L1304QDGS32RQ1 supports RUN (71 µA/MHz), STOP (44 µA @ 32 kHz), STANDBY (1.0 µA with 32-kHz timer active and full SRAM retention), and SHUTDOWN (61 nA with IO wakeup). STANDBY mode enables fast 3.2-µs wakeup - critical for always-on applications like proximity sensing in door handle modules where responsiveness and battery longevity are both essential.

M0L1304QDGS32RQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
32-TFSOP (0.118", 3.00mm Width)
Series:
MSPM0 L
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

M0L1304QDGS32RQ1 FAQ

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The price and inventory of M0L1304QDGS32RQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M0L1304QDGS32RQ1 is usually 5 days.

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M0L1304QDGS32RQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M0L1304QDGS32RQ1?

For technical support, including M0L1304QDGS32RQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M0L1304QDGS32RQ1 requirements.

6.How does Aetrix verify that M0L1304QDGS32RQ1 is sourced from the original manufacturer or authorized distributors?

All M0L1304QDGS32RQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0L1304QDGS32RQ1 meets industry standards.

7.What is the process for return or replacement of M0L1304QDGS32RQ1?

All M0L1304QDGS32RQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0L1304QDGS32RQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M0L1304QDGS32RQ1 part is unused and in its original packaging.

Return procedure for M0L1304QDGS32RQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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