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Texas Instruments M0L1306QRGERQ1
- Part No.:
- M0L1306QRGERQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
M0L1306QRGERQ1.pdf
- Description:
- AUTOMOTIVE 32-MHZ ARM CORTEX-M0+
- Quantity:
- Payment:
- Shipping:
Inventory:3,000
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Product details
Overview
M0L1306QRGERQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive microcontroller based on the Arm® Cortex®-M0+ core operating at up to 32 MHz, featuring 64 KB flash, 4 KB SRAM, a 12-bit 1.68-Msps ADC with 9 external channels, two zero-drift chopper op-amps, and integrated temperature sensing - deployed in body electronics, steering wheel systems, and door handle modules.
For engineers reviewing the M0L1306QRGERQ1 datasheet, M0L1306QRGERQ1 pinout, M0L1306QRGERQ1 application, or M0L1306QRGERQ1 equivalent, key selection considerations include its 24-pin VQFN (RGE) package, -40°C to +125°C operation, 1.62–3.6 V supply range, ultra-low-power STANDBY mode (1.0 µA), and functional safety documentation support for automotive system design.
Technical Context
The M0L1306QRGERQ1 implements a single-core Arm Cortex-M0+ CPU with on-chip SYSOSC (±1.2% accuracy) and LFOSC (±3%), eliminating need for external crystals. Its analog subsystem integrates ADC0 with configurable internal VREF (1.4 V or 2.5 V), COMP0 with 8-bit reference DAC and 32-ns propagation delay, and two chopper OPAs offering 0.5-µV/°C drift and programmable gain (1–32×).
Digital peripherals include four 16-bit timers supporting 8 PWM channels, three-channel DMA, event fabric signaling, and dual UART/I²C/SPI interfaces - all with STANDBY-mode wakeup capability. Power management enables RUN (71 µA/MHz), STOP (44 µA @ 32 kHz), STANDBY (1.0 µA), and SHUTDOWN (61 nA) modes with 32-kHz timer retention and 3.2-µs wakeup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0+, 32 MHz max - enables real-time deterministic control in automotive body ECUs without external clock source. |
| Flash / SRAM | 64 KB / 4 KB - sufficient for AUTOSAR-compliant firmware, sensor fusion algorithms, and bootloader + application partitioning. |
| ADC Resolution / Speed | 12-bit / 1.68 Msps - supports high-fidelity sampling of analog sensors (e.g., potentiometers, thermistors) in seat comfort or occupancy detection. |
| OPA Drift / Gain | 0.5 µV/°C / 1–32× programmable - ensures stable signal conditioning across automotive temperature range without calibration overhead. |
| Low-Power STANDBY | 1.0 µA with 32-kHz timer active - enables always-on wake-on-event functionality (e.g., kick-to-open, door handle touch) with sub-second response. |
| Package / Pins | 24-pin VQFN (RGE), 4 mm × 4 mm - compact footprint suitable for space-constrained modules like steering column controls or interior lighting nodes. |
| Operating Temp | -40°C to +125°C (Grade 1) - qualified for under-hood and cabin-mounted automotive applications per AEC-Q100. |
| Supply Voltage | 1.62 V to 3.6 V - compatible with 3.3 V and 2.5 V automotive power domains, including battery-backed backup rails. |
Pinout & Package
24-pin VQFN (RGE) package with 4 mm × 4 mm body and wettable flanks; thermal pad recommended to be connected to VSS for thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA0 / PA1 | 5-V-tolerant open-drain I/O | Support LIN bus physical layer or SMBus communication without level-shifting; fail-safe protection prevents latch-up during transients. |
| PA22 / PA23 | ADC input / VREF+ and VREF- | Direct connection to internal 1.4-V or 2.5-V reference enables ratiometric sensor measurements with minimal external components. |
| PA20 / PA19 | SWCLK / SWDIO | 2-pin serial wire debug interface allows in-system programming and real-time trace without dedicated JTAG header space. |
| PA26 / PA27 | A1 / A0 (ADC inputs) | First two ADC channels mapped to dedicated pins - simplifies routing for critical analog signals like hall-effect position feedback. |
| VDD / VSS / VCORE | Power supply terminals | Separate VCORE output enables clean digital domain regulation; dual VDD/VSS pair improves noise immunity in mixed-signal operation. |
| Thermal Pad | Exposed die attach pad | Must be soldered to PCB ground plane to maintain junction temperature within spec under continuous 32-MHz operation. |
Key Features
| Feature | Design Value |
|---|---|
| Zero-drift chopper OPAs | Two integrated OPA0/OPA1 with 0.5-µV/°C drift and 1–32× gain - eliminates manual offset trimming in current-sense or bridge amplifier circuits. |
| Configurable ADC reference | Internal 1.4-V or 2.5-V VREF selectable via register - enables flexible scaling for resistive divider or thermistor networks without external reference ICs. |
| Ultra-low-power STANDBY | 1.0 µA with 32-kHz timer running and full SRAM retention - supports persistent state storage and fast (<3.2 µs) wake for proximity or capacitive touch events. |
| Functional safety documentation | TI-provided FSQM artifacts aid ISO 26262 ASIL-B system-level analysis - reduces validation effort for automotive body control modules. |
| Automotive qualification | AEC-Q100 Grade 1 (-40°C to +125°C) and PPAP-ready - meets OEM requirements for production deployment in passenger compartment ECUs. |
| Integrated temperature sensor | On-die sensor with ±2°C accuracy - enables thermal derating of motor drivers or ambient compensation of analog front-ends without external thermistor. |
Applications
| Steering Wheel Systems | Door Handle Modules |
|---|---|
Use Scenario: Real-time processing of multifunction button presses, haptic feedback control, and CAN/LIN gateway functions within constrained space behind airbag module. IC Role / Device Role / Timing Role: Primary MCU executing button debouncing, LED driver timing, and LIN slave protocol stack with <3.2 µs wakeup from STANDBY on keypress interrupt. Use Value: 24-pin VQFN footprint fits tight mechanical envelope; 1.0 µA STANDBY extends battery backup life during vehicle sleep mode. | Use Scenario: Capacitive or mechanical switch sensing, RF receiver interfacing, and local actuator control for passive entry systems. IC Role / Device Role / Timing Role: Sensor hub aggregating touch, proximity, and low-frequency RFID data; uses ADC and GPAMP for analog signal conditioning prior to encryption. Use Value: Integrated 12-bit ADC and programmable-gain op-amps eliminate discrete signal chain components, reducing BOM count and PCB area. |
| Kick-to-Open Modules | Seat Comfort Module |
Use Scenario: Detecting foot motion via ultrasonic time-of-flight or IR proximity sensors, triggering rear liftgate actuation with anti-pinch logic. IC Role / Device Role / Timing Role: Real-time signal acquisition and edge detection using ADC oversampling and TIMG4 timer capture; executes safety-critical timeout monitoring. Use Value: 1.68-Msps ADC resolution enables precise distance measurement; STANDBY mode with IO wakeup ensures immediate response to motion events. | Use Scenario: Closed-loop control of seat heating elements, massage motors, and position memory using thermistors, current sense, and potentiometer feedback. IC Role / Device Role / Timing Role: Analog front-end conditioner (OPA0/OPA1), precision ADC digitizer, and PWM generator for heater/motor drive with thermal derating. Use Value: Zero-drift op-amps maintain accuracy over cabin temperature swings; integrated temperature sensor enables automatic thermal foldback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSPM0L1306QDGS24Q1 | Same core, memory, and peripherals; 24-pin VSSOP package (7.1 mm × 4.9 mm) instead of 24-pin VQFN (4 mm × 4 mm) | Better suited for through-hole or wave-soldered assemblies; larger footprint eases hand-soldering but increases board area | Select for legacy assembly lines requiring SOIC-compatible land patterns or higher thermal mass in non-space-constrained modules |
| S9S12G128F0MLH | Legacy S12 architecture (16-bit), 128 KB flash, no chopper op-amps or ultra-low-power STANDBY (<1 µA); requires external crystal | Used in mature automotive platforms where toolchain continuity and long-term supply are prioritized over power/performance | Choose only when migrating legacy S12 codebase; lacks modern analog integration and fails AEC-Q100 Grade 1 temp margin at upper end |
Compared with MSPM0L1306QDGS24Q1, M0L1306QRGERQ1 offers 44% smaller PCB footprint and superior thermal dissipation via wettable-flank VQFN; versus S9S12G128F0MLH, it delivers 2× lower active power, integrated analog signal chain, and native functional safety documentation - enabling next-gen body electronics with reduced component count.
Availability
M0L1306QRGERQ1 is available at Aetrix Electronics and suitable for automotive body electronics, steering wheel systems, and door handle modules requiring stable component supply, AEC-Q100 compliance, and long-term industrial availability.
Supply support for M0L1306QRGERQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies for automotive, industrial, and consumer markets.
The MSPM0L130x-Q1 product line delivers cost-optimized, ultra-low-power 32-bit MCUs with integrated high-performance analog peripherals - designed specifically for automotive body electronics, lighting, and occupant sensing applications demanding AEC-Q100 qualification and functional safety readiness.
FAQ
What is the maximum operating frequency and core architecture of the M0L1306QRGERQ1?
The M0L1306QRGERQ1 features an Arm Cortex-M0+ core with a maximum operating frequency of 32 MHz. This architecture provides deterministic real-time performance with low gate count and energy efficiency - ideal for automotive body control units where predictable interrupt latency and minimal power consumption are critical. The internal SYSOSC achieves ±1.2% accuracy, eliminating need for external crystal.
How many analog input channels does the M0L1306QRGERQ1 support, and what is its ADC resolution?
The M0L1306QRGERQ1 supports 9 external analog input channels on its 12-bit ADC, capable of 1.68 million samples per second. This resolution and speed enable accurate digitization of sensor signals such as potentiometer wiper positions, thermistor voltages, or current-sense amplifier outputs in applications like seat position memory or HVAC actuators.
Does the M0L1306QRGERQ1 include hardware support for functional safety development?
Yes, the M0L1306QRGERQ1 is designated as Functional Safety Quality-Managed (FSQM), with documentation available to aid ISO 26262 ASIL-B system-level design. This includes failure mode analysis reports, diagnostic coverage data, and safety manual guidance - not just marketing claims, but deliverables intended for use in automotive safety case development.
What low-power modes are available on the M0L1306QRGERQ1, and what is the lowest current draw?
The M0L1306QRGERQ1 offers RUN, STOP, STANDBY, and SHUTDOWN modes. Its lowest operational current is 1.0 µA in STANDBY mode with 32-kHz timer running and full SRAM/register retention. Wakeup occurs in 3.2 µs, making it suitable for event-driven automotive applications like proximity sensing or capacitive touch where responsiveness and battery longevity are both essential.
What package type and pin count does the M0L1306QRGERQ1 use, and are there thermal considerations?
The M0L1306QRGERQ1 uses a 24-pin VQFN (RGE) package measuring 4 mm × 4 mm with wettable flanks. The exposed thermal pad must be soldered to a PCB ground plane to ensure proper heat dissipation - TI specifies this connection to maintain junction temperature within limits during sustained 32-MHz operation or analog peripheral use.
M0L1306QRGERQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 24-VFQFN Exposed Pad
- Series:
- MSPM0 L
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
- Number of I/O:
- 20
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 9x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
M0L1306QRGERQ1 FAQ
1.How can I place an order for M0L1306QRGERQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for M0L1306QRGERQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M0L1306QRGERQ1 reliable?
The price and inventory of M0L1306QRGERQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M0L1306QRGERQ1 is usually 5 days.
3.What payment methods are accepted for M0L1306QRGERQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M0L1306QRGERQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M0L1306QRGERQ1?
M0L1306QRGERQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M0L1306QRGERQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M0L1306QRGERQ1?
For technical support, including M0L1306QRGERQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M0L1306QRGERQ1 requirements.
6.How does Aetrix verify that M0L1306QRGERQ1 is sourced from the original manufacturer or authorized distributors?
All M0L1306QRGERQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M0L1306QRGERQ1 meets industry standards.
7.What is the process for return or replacement of M0L1306QRGERQ1?
All M0L1306QRGERQ1 units undergo pre-shipment inspection (PSI). If there is an issue with M0L1306QRGERQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M0L1306QRGERQ1 part is unused and in its original packaging.
Return procedure for M0L1306QRGERQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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