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Renesas M10042040108X0ISAR
- Part No.:
- M10042040108X0ISAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M10042040108X0ISAR.pdf
- Description:
- IC RAM 4MBIT SPI 108MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,329
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Product details
Overview
M10042040108X0ISAR from Renesas is a 4Mb serial STT-MRAM non-volatile memory IC with QSPI interface, 108MHz SDR clock rate, 1.71–2.0V supply, and industrial temperature range (−40°C to +85°C). It delivers SRAM-compatible read/write timing, zero write latency, and persistent data retention-used in real-time industrial control logging and firmware parameter storage where power loss resilience is critical.
For engineers reviewing the M10042040108X0ISAR datasheet, M10042040108X0ISAR pinout, M10042040108X0ISAR application, or M10042040108X0ISAR equivalent, key selection considerations include its 8-pad DFN (WSON) package, hardware/software write protection, 256-byte augmented storage array, JEDEC reset support, and compatibility with SPI Mode 0/3 for deterministic timing in deterministic embedded systems.
Technical Context
The M10042040108X0ISAR implements a 40nm pMTJ spin-transfer torque MRAM core with true random access, enabling byte-level reads/writes without erase cycles. Its QSPI interface supports 1-4-4 command-address-data configuration and executes instructions on rising clock edges in SDR mode.
It integrates dual power domains (1.8V core/I/O), hardware write protection via WP# pin, and software-configurable block protection through Status and Configuration Registers. The device supports eXecute-In-Place (XIP), Deep Power Down (3µs entry), and Hibernate modes-all preserving data and register state across low-power transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 4Mbit (512KB); enables compact firmware storage or real-time sensor log buffers without external backup. |
| Interface | QSPI (1-4-4); supports high-throughput burst reads at up to 108MHz SDR, reducing host CPU overhead vs. legacy SPI. |
| Supply Voltage | 1.71V–2.00V; compatible with modern 1.8V logic rails and eliminates level-shifting in low-voltage industrial designs. |
| Operating Temp | −40°C to +85°C; qualified for uncontrolled factory automation environments without thermal derating. |
| Endurance | Virtually unlimited (>10¹⁵ cycles); eliminates wear leveling firmware and guarantees lifetime data integrity in cyclic logging. |
| Data Retention | ≥20 years at 85°C; ensures firmware and calibration data persistence across product lifecycle without refresh. |
| Package | 8-pad DFN (WSON), 5.0mm × 6.0mm; surface-mount compatible with standard reflow profiles and space-constrained PCB layouts. |
Pinout & Package
8-pad DFN (WSON) package, 5.0mm × 6.0mm, moisture sensitivity level 3, RoHS/REACH compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable; falling edge initiates instruction decode; must be held high during power-up sequencing per tPU timing. |
| WP# / IO[2] | Bidirectional Write Protect / Data Line | Hardware write lock for Status Register when pulled low; also serves as QPI data line IO[2] in quad mode. |
| SI / IO[0] | Input / Bidirectional Data Line | Serial input in single-SPI; bidirectional IO[0] in dual/quad modes; latched on rising CLK edge in SDR. |
| CLK | Clock Input | Synchronous timing source; rising edge samples commands/addresses in SDR; both edges used in DDR mode. |
| IO[3] | Bidirectional Data Line | QPI data line IO[3]; tri-stated when unused; may be tied to VCC if single-SPI only. |
| SO / IO[1] | Output / Bidirectional Data Line | Serial output in single-SPI; bidirectional IO[1] in dual/quad modes; data output always begins on falling CLK edge. |
| VCC | Power Supply | 1.71–2.00V core and I/O rail; requires local 100nF decoupling per datasheet layout guidelines. |
| VSS | Ground | Common reference for core and I/O; must be low-impedance connection to minimize noise coupling into MRAM array. |
Key Features
| Feature | Design Value |
|---|---|
| STT-MRAM Technology | 40nm pMTJ cell enables zero write latency, no erase-before-write, and immunity to radiation-induced bit flips. |
| eXecute-In-Place (XIP) | Reduces instruction overhead by allowing sequential reads without repeated command issuance-critical for deterministic boot code execution. |
| Augmented Storage Array | 256-byte user-programmable section with per-block (32B) write protection-ideal for storing calibrated sensor offsets or secure keys. |
| JEDEC Reset Support | Standardized reset command (66h) ensures interoperability with existing SPI memory controllers without custom firmware. |
| Deep Power Down Mode | Reduces current to ISB (≤10µA) in <3µs while retaining full memory and register state-enables ultra-low-power wake-on-event designs. |
Applications
| Factory Automation Logging | Multifunction Printer Firmware |
|---|---|
Use Scenario: Continuous timestamped logging of PLC I/O states and motion controller events in robotic assembly cells. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory holding last-known operational state and error logs; accessed via QSPI bursts during idle cycles. Use Value: Eliminates battery-backed SRAM and avoids Flash wear-out-ensures 20+ year data retention even after 10⁶ power cycles. | Use Scenario: Storing printer firmware patches, font tables, and job queue metadata across cold starts and firmware updates. IC Role / Device Role / Timing Role: Executable code storage with XIP capability; enables direct execution from MRAM without RAM copy, reducing boot time by ~35ms. Use Value: 108MHz SDR interface sustains >40MB/s read throughput-matching NAND+RAM hybrid performance at lower system complexity. |
| Industrial Control Parameter Storage | Medical Diagnostic Calibration Data |
Use Scenario: Holding PID loop coefficients, sensor calibration curves, and safety-critical configuration flags in programmable logic controllers. IC Role / Device Role / Timing Role: Persistent configuration register bank; written infrequently but read on every control cycle via fast random-access reads. Use Value: Byte-level writes eliminate Flash page-erase delays-guarantees sub-100ns parameter fetches for 1kHz closed-loop control. | Use Scenario: Securing patient-specific calibration constants and diagnostic algorithm parameters in portable ultrasound and ECG devices. IC Role / Device Role / Timing Role: Tamper-resistant storage using hardware WP# and software block protection; augmented array holds encrypted keys. Use Value: 64-bit unique ID and user-programmable serial number support traceability and regulatory audit requirements (IEC 62304). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar non-volatile serial memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V04 | 4Mb F-RAM; 3.0V operation (2.7–3.6V); max 40MHz SPI; no QSPI or XIP support. | Limited to lower-speed control interfaces; lacks augmented storage and JEDEC reset. | Select when 1.8V operation or QSPI bandwidth is not required and legacy 3V design reuse is prioritized. |
| Infineon Technologies CY14B104QN | 4Mb nvSRAM; 3.0V operation; built-in lithium battery backup; 55MHz max SPI; no MRAM endurance advantage. | Requires battery management circuitry; susceptible to end-of-life battery leakage and environmental restrictions. | Select only where existing battery-backed nvSRAM infrastructure exists and long-term maintenance access is guaranteed. |
Compared with FM25V04 and CY14B104QN, the M10042040108X0ISAR provides 2.7× higher interface speed, eliminates battery or capacitor backup, and guarantees 20-year data retention without wear leveling-making it optimal for sealed, maintenance-free industrial deployments.
Availability
M10042040108X0ISAR is available at Aetrix Electronics and suitable for factory automation logging, multifunction printer firmware storage, and industrial control parameter storage requiring stable component supply across extended product lifecycles.
Supply support for M10042040108X0ISAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The Mxxxx204 family was designed as Persistent SRAM (P-SRAM) replacements-delivering true non-volatility with SRAM-like performance for mission-critical embedded systems demanding zero-latency writes and infinite endurance.
FAQ
What is the operating voltage range for M10042040108X0ISAR?
The M10042040108X0ISAR operates from 1.71V to 2.00V. This 1.8V nominal supply range aligns with modern low-power industrial microcontrollers and eliminates the need for level shifters. Operation outside this window risks data corruption or failure to initialize, as confirmed in Table 7 of the datasheet under "1.8V Power Up/Down Timing."
Does M10042040108X0ISAR support Quad SPI mode?
Yes, M10042040108X0ISAR supports Quad SPI (QPI) mode with 4-4-4 command-address-data configuration. It achieves 108MHz SDR operation in this mode, delivering up to 432MB/s effective throughput. Pin assignments for IO[0]–IO[3] are defined in Table 2 and Figures 3–4 of the datasheet.
What is the purpose of the Augmented Storage Array in M10042040108X0ISAR?
The Augmented Storage Array is a dedicated 256-byte user-programmable section with per-block (32-byte) write protection. In M10042040108X0ISAR, it stores calibration data, security keys, or serial numbers-separately from main memory-and retains independent protection settings via Configuration Register 2.
How does M10042040108X0ISAR handle power loss during write operations?
M10042040108X0ISAR uses STT-MRAM technology, which completes writes atomically in <10ns with no erase phase. Unlike Flash or EEPROM, it requires no suspend/resume logic or power-loss recovery firmware. Data written before power collapse remains intact-verified by >10¹⁵ endurance and 20-year retention specs.
Is M10042040108X0ISAR pin-compatible with other members of the Mxxxx204 family?
Yes, all Mxxxx204 variants-including M10042040108X0ISAR-share identical 8-pad DFN (WSON) and 8-pin SOIC footprints, pin assignments, and electrical signaling. Density (4Mb/8Mb/16Mb) and voltage (1.8V/3.0V) variants are functionally and physically interchangeable at the board level when matching temperature and package options are selected.
M10042040108X0ISAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 4Mbit
- Memory Organization:
- 1M x 4
- Memory Interface:
- SPI
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.71V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M10042040108X0ISAR FAQ
1.How can I place an order for M10042040108X0ISAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M10042040108X0ISAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M10042040108X0ISAR reliable?
The price and inventory of M10042040108X0ISAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M10042040108X0ISAR is usually 5 days.
3.What payment methods are accepted for M10042040108X0ISAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M10042040108X0ISAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M10042040108X0ISAR?
M10042040108X0ISAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M10042040108X0ISAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M10042040108X0ISAR?
For technical support, including M10042040108X0ISAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M10042040108X0ISAR requirements.
6.How does Aetrix verify that M10042040108X0ISAR is sourced from the original manufacturer or authorized distributors?
All M10042040108X0ISAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M10042040108X0ISAR meets industry standards.
7.What is the process for return or replacement of M10042040108X0ISAR?
All M10042040108X0ISAR units undergo pre-shipment inspection (PSI). If there is an issue with M10042040108X0ISAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M10042040108X0ISAR part is unused and in its original packaging.
Return procedure for M10042040108X0ISAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M10042040108X0ISAR Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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