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Renesas M10082040108X0ISAR
- Part No.:
- M10082040108X0ISAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M10082040108X0ISAR.pdf
- Description:
- IC RAM 8MBIT 108MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,614
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Product details
Overview
M10082040108X0ISAR from Renesas is an 8Mb serial STT-MRAM (Spin-Transfer Torque Magnetoresistive RAM) with QSPI interface, 108MHz SDR operation, 1.71–2.0V supply voltage, industrial temperature range (−40°C to +85°C), and 8-pin SOIC package. It delivers persistent SRAM-equivalent read/write timing with true non-volatility, enabling instant data retention after power loss in real-time control systems.
For engineers reviewing the M10082040108X0ISAR datasheet, M10082040108X0ISAR pinout, M10082040108X0ISAR application, or M10082040108X0ISAR equivalent, key selection criteria include its 108MHz SDR QSPI speed, hardware/software write protection (WP# pin + configuration registers), 256-byte augmented storage array, JEDEC reset support, and compatibility with legacy SPI-based memory controllers in industrial edge nodes.
Technical Context
The M10082040108X0ISAR implements a 40nm pMTJ STT-MRAM array with quad SPI (4-4-4) interface supporting both SDR (108MHz) and DDR (54MHz) modes. Its architecture includes dedicated command/address/data paths per I/O lane, eXecute-In-Place (XIP) capability to reduce instruction overhead, and dual-power-state management (Deep Power Down and Hibernate) with full data and configuration retention.
It integrates hardware-based write protection via the WP# pin (active-low, no internal pull-up) and software-based protection through configurable status and block protect bits (BPSEL[2:0], TBSEL). The device features a separate 256-byte Augmented Storage Array-divided into eight 32-byte programmable/protectable sections-and supports JEDEC-standard reset commands for system-level reliability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8Mbit (0x000000–0x0FFFFF address space); enables compact firmware storage or real-time logging without external backup. |
| Interface Speed | 108MHz Single Data Rate (SDR); matches high-speed microcontroller SPI peripherals without requiring clock domain bridging. |
| Supply Voltage | 1.71V–2.00V; compatible with modern low-voltage industrial SoCs and eliminates need for level-shifting circuitry. |
| Operating Temp | −40°C to +85°C (Industrial grade); validated for continuous operation in factory automation enclosures and medical diagnostic chassis. |
| Endurance & Retention | Virtually unlimited write cycles and >20-year data retention at 85°C; eliminates wear-leveling firmware and lifetime monitoring logic. |
| Package | 8-pin SOIC (5.2mm × 5.2mm); drop-in replacement for legacy SPI NOR/EEPROM in existing PCB footprints. |
| Protection | Hardware WP# pin + software-configurable top/bottom/block protection; allows granular lockdown of boot code, calibration data, and user settings. |
Pinout & Package
8-pin SOIC (5.2mm × 5.2mm) package with standard JEDEC outline and lead finish. Compatible with reflow soldering and automated optical inspection (AOI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; device enters standby when high, tri-states outputs and reduces current to ISB (≤10µA). |
| WP# / IO[2] | Write Protect Input / Bidirectional Data 2 | In SDR mode: hardware write lock for status register when pulled low and WP#EN=1; in QPI mode: bidirectional data lane for 4-lane transfers. |
| SI / IO[0] | Serial Input / Bidirectional Data 0 | Command/address/data input in SDR; primary I/O lane in dual/quad modes; no internal pull-up required. |
| CLK | Clock Input | Synchronous timing reference; rising edge latches commands/addresses in SDR; both edges used in DDR for doubled throughput. |
| IO[3] | Bidirectional Data 3 | QPI data lane; must be tied to VCC if unused in SDR mode to prevent floating node noise coupling. |
| SO / IO[1] | Serial Output / Bidirectional Data 1 | Data output in SDR (falling-edge aligned); bidirectional lane in DPI/QPI; always drives on falling clock edge per spec. |
| VCC | Power Supply | 1.71–2.0V core/I/O rail; requires local 100nF ceramic decoupling adjacent to pin per layout guidelines. |
| VSS | Ground | Common return path for core and I/O; must connect to low-impedance ground plane to maintain signal integrity at 108MHz. |
Key Features
| Feature | Design Value |
|---|---|
| QSPI Interface (4-4-4) | Enables 4-lane parallel data transfer at 108MHz SDR, achieving 432MB/s effective bandwidth for burst reads in XIP applications. |
| eXecute-In-Place (XIP) | Allows sequential instruction execution directly from MRAM without copying to RAM, reducing boot latency and eliminating external SRAM dependency. |
| Augmented Storage Array | 256-byte user-programmable section with per-32-byte write protection-ideal for storing calibration coefficients, MAC addresses, or field-upgrade metadata. |
| JEDEC Reset Support | Standardized reset command (66h) ensures interoperability with generic flash memory drivers and bootloader frameworks across ARM/Cortex-M platforms. |
| Deep Power Down Mode | Reduces current to ≤1µA while preserving all memory contents and register states; critical for battery-backed industrial gateways with multi-year uptime requirements. |
Applications
| Factory Automation | Medical Diagnostics |
|---|---|
Use Scenario: PLCs and motion controllers logging sensor timestamps, fault codes, and recipe parameters during power interruptions. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory providing sub-100ns write latency and zero recovery delay after brownout. Use Value: Eliminates supercapacitor backup circuits and firmware wear-leveling, reducing BOM cost and qualification effort for IEC 61508 SIL2 systems. | Use Scenario: Portable ultrasound and MRI subsystems storing calibration profiles, patient setup data, and last-known operational state. IC Role / Device Role / Timing Role: Persistent configuration store with guaranteed 20+ year data retention at 40°C ambient, meeting IEC 62304 Class C requirements. Use Value: Removes need for EEPROM + SRAM dual-memory architecture, simplifying thermal design and EMI filtering in compact handheld enclosures. |
| Industrial Control And Monitoring | Data Switches And Routers |
Use Scenario: Remote I/O modules capturing process variable history and alarm logs in oil & gas telemetry nodes operating unattended for months. IC Role / Device Role / Timing Role: High-endurance logging buffer supporting 100k+ daily writes without degradation over 15-year field life. Use Value: Avoids NAND flash controller complexity and bad-block management, enabling deterministic write latency for time-critical event recording. | Use Scenario: Carrier-grade Ethernet switches storing forwarding tables, port configurations, and firmware rollback images with atomic update capability. IC Role / Device Role / Timing Role: Boot memory with XIP support and hardware write protection, ensuring secure, tamper-resistant startup sequence execution. Use Value: Prevents unauthorized firmware modification via WP# pin lockdown and block-protect register configuration, satisfying NEBS Level 3 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V08-G | 8Mb F-RAM with 40MHz SPI max speed, 2.0–3.6V supply, and SOIC-8 package; lower endurance than MRAM but faster write cycle time (≤150ns). | Preferred where ultra-fast single-byte writes dominate (e.g., counter increment), but lacks QPI and XIP support. | Select FM25V08-G only if system clock is <40MHz and write latency is more critical than density or interface flexibility. |
| Winbond W25Q80DVSNIG | 8Mb SPI NOR Flash in SOIC-8, 104MHz max clock, 2.7–3.6V supply; requires erase-before-write and has limited endurance (~100k cycles). | Suitable for static firmware storage, but unsuitable for frequent runtime data logging due to erase latency and wear constraints. | Choose W25Q80DVSNIG only for read-mostly applications with infrequent updates; avoid for dynamic parameter storage. |
Compared with FM25V08-G and W25Q80DVSNIG, the M10082040108X0ISAR uniquely combines 108MHz QSPI bandwidth, true byte-write capability, zero-erase latency, and industrial-temperature MRAM reliability-making it optimal for mixed-read/write embedded systems requiring deterministic performance and long-term data integrity.
Availability
M10082040108X0ISAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-lifecycle support, and RoHS/REACH-compliant sourcing.
Supply support for M10082040108X0ISAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The Mxxxx204 product line delivers persistent SRAM alternatives using STT-MRAM technology-designed specifically for industrial edge devices needing fast, reliable, and scalable non-volatile memory without flash limitations.
FAQ
What is the maximum clock frequency supported by M10082040108X0ISAR in Single Data Rate mode?
The M10082040108X0ISAR supports up to 108MHz in Single Data Rate (SDR) mode, as indicated by the "0108" segment in its part number. This frequency applies to command, address, and data transfers on the rising edge of CLK in standard SPI mode, enabling high-throughput access for real-time data logging and firmware execution.
Does M10082040108X0ISAR require an external pull-up resistor on the WP# pin?
Yes, the WP# pin on the M10082040108X0ISAR has no internal pull-up and must not be left floating. A 10kΩ pull-up to VCC is recommended per the datasheet to ensure predictable write protection behavior during power-up and idle states.
Can M10082040108X0ISAR retain data during deep power-down mode?
Yes, the M10082040108X0ISAR retains all stored data and register configurations-including status, configuration, and augmented storage array contents-while in Deep Power Down mode, with current draw reduced to ≤1µA and full functionality restored within 400µs of exit command.
Is the M10082040108X0ISAR pin-compatible with standard 8-pin SOIC SPI flash devices?
Yes, the M10082040108X0ISAR uses a JEDEC-standard 8-pin SOIC footprint (5.2mm × 5.2mm) with identical pinout (CS#, WP#/IO[2], SI/IO[0], CLK, IO[3], SO/IO[1], VCC, VSS) to common SPI NOR flash devices, enabling direct PCB-level replacement without layout changes.
What is the purpose of the Augmented Storage Array in M10082040108X0ISAR?
The Augmented Storage Array is a dedicated 256-byte memory region in the M10082040108X0ISAR, divided into eight 32-byte sections, each independently programmable and write-protectable. It is intended for storing critical system metadata-such as calibration constants, unique identifiers, or firmware version stamps-that must survive power cycles and resist accidental overwrite.
M10082040108X0ISAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 2M x 4
- Memory Interface:
- -
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.71V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M10082040108X0ISAR FAQ
1.How can I place an order for M10082040108X0ISAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M10082040108X0ISAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M10082040108X0ISAR reliable?
The price and inventory of M10082040108X0ISAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M10082040108X0ISAR is usually 5 days.
3.What payment methods are accepted for M10082040108X0ISAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M10082040108X0ISAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M10082040108X0ISAR?
M10082040108X0ISAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M10082040108X0ISAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M10082040108X0ISAR?
For technical support, including M10082040108X0ISAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M10082040108X0ISAR requirements.
6.How does Aetrix verify that M10082040108X0ISAR is sourced from the original manufacturer or authorized distributors?
All M10082040108X0ISAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M10082040108X0ISAR meets industry standards.
7.What is the process for return or replacement of M10082040108X0ISAR?
All M10082040108X0ISAR units undergo pre-shipment inspection (PSI). If there is an issue with M10082040108X0ISAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M10082040108X0ISAR part is unused and in its original packaging.
Return procedure for M10082040108X0ISAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M10082040108X0ISAR Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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