Renesas M10082040108X0PSAR
- Part No.:
- M10082040108X0PSAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M10082040108X0PSAR.pdf
- Description:
- IC RAM 8MBIT 108MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,111
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M10082040108X0PSAR from Renesas is an 8Mb serial STT-MRAM (Spin-Transfer Torque Magnetoresistive RAM) memory IC with QSPI interface, 108MHz SDR clock rate, 1.71–2.0V or 2.7–3.6V supply, and industrial-plus temperature range (−40°C to +105°C). It delivers SRAM-compatible read/write timing with true non-volatility, used in real-time data logging and firmware storage for industrial controllers.
For engineers reviewing the M10082040108X0PSAR datasheet, M10082040108X0PSAR pinout, M10082040108X0PSAR application, or M10082040108X0PSAR equivalent, key selection criteria include QSPI x4 interface support, hardware/software write protection, 256-byte augmented storage array, JEDEC reset compliance, and dual-voltage operation across extended temperature.
Technical Context
The M10082040108X0PSAR implements a 40nm pMTJ STT-MRAM cell architecture enabling persistent SRAM behavior with no wear-out mechanism. Its command-address-data nomenclature supports 1-4-4 QPI mode using all four I/O pins for address and data transfer, synchronized by rising-edge clock sampling in SDR mode.
It integrates dedicated registers for status control, configuration (four registers), device identification (64-bit unique ID), and user-programmable serial number. Power management includes Deep Power Down (3µs entry, 400µs exit) and Hibernate modes, both preserving data and register state without external refresh.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8 megabit (1,048,576 × 8-bit organization); enables compact firmware storage without external ECC logic |
| Interface | Quad SPI (QPI, 4-4-4 mode); allows 4x bandwidth vs standard SPI, reducing instruction overhead in XIP applications |
| Max Clock Rate | 108 MHz SDR; achieves ~43 MB/s effective read throughput in QPI mode with continuous burst |
| Supply Voltage | 1.71–2.00 V or 2.70–3.60 V; dual-range support simplifies integration into mixed-voltage industrial PCBs |
| Operating Temp | −40°C to +105°C (industrial plus); qualified for under-hood automotive ECUs and factory-floor PLCs |
| Endurance | Virtually unlimited write cycles (>10¹⁵); eliminates lifetime concerns in high-frequency logging or parameter update scenarios |
| Data Retention | 20+ years at +105°C; ensures firmware integrity over full product lifecycle without backup power |
Pinout & Package
Package: 8-pin SOIC (5.2 mm × 5.2 mm), RoHS-compliant, surface-mount compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable; falling edge initiates instruction sequence; must be held low during command/address/data transfer |
| WP# / IO[2] | Bidirectional I/O or Hardware Write Protect | In SPI mode: hardware lock for status register when WP# = Low and SR[7] = 1; in QPI mode: bidirectional data line |
| SI / IO[0] | Serial Input or Quad Data 0 | Command input in 1-1-1/1-1-4; primary data-in path in single/dual/quad modes |
| CLK | Clock Input | Synchronous timing reference; rising edge latches command/address in SDR; both edges used in DDR |
| IO[3] | Quad Data 3 | Used only in Dual/Quad modes; tied to VCC if unused to prevent floating |
| SO / IO[1] | Serial Output or Quad Data 1 | Data output in 1-1-1/1-1-4; always outputs on falling clock edge per spec |
| VCC | Power Supply | Single supply for core and I/O; supports 1.8V or 3.3V rails; requires local decoupling |
| VSS | Ground | Common return path; must be low-impedance connection to minimize noise coupling into MRAM array |
Key Features
| Feature | Design Value |
|---|---|
| eXecute-In-Place (XIP) | Enables direct code execution from MRAM without copying to RAM; reduces boot latency and external memory footprint |
| Augmented Storage Array | 256-byte user-programmable space with per-section (32B) write protection; ideal for calibration data or secure keys |
| Hardware + Software Protection | WP# pin + configurable block protect bits (BPSEL[2:0]) + top/bottom select (TBSEL) provide layered security against accidental writes |
| JEDEC Reset Support | Standardized reset command (66h) ensures interoperability with host bootloaders and memory controllers compliant with JEDEC JESD252 |
| Deep Power Down Mode | Reduces current to <1 µA while retaining full memory content and register state; suitable for battery-backed sleep states |
Applications
| Factory Automation | Multifunction Printers |
|---|---|
Use Scenario: Real-time motion controller storing position history and fault logs during servo axis operation. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory holding last-known state and diagnostic snapshots between power cycles. Use Value: Eliminates need for supercapacitor-backed SRAM or slow EEPROM writes; retains data instantly on power loss with zero recovery delay. | Use Scenario: Embedded print engine firmware storage with frequent field-upgrade capability. IC Role / Device Role / Timing Role: Primary boot memory hosting microcode and raster processing routines accessed via XIP. Use Value: Enables sub-100ms firmware reload and instant resume after power interruption-critical for high-throughput production printing. |
| Industrial Control And Monitoring | Medical Diagnostics |
Use Scenario: Programmable logic controller (PLC) storing ladder logic configurations and I/O mapping tables. IC Role / Device Role / Timing Role: Configuration memory with hardware write protection preventing runtime corruption during EMI events. Use Value: Guarantees deterministic startup behavior and eliminates configuration drift due to voltage transients or software bugs. | Use Scenario: Portable ultrasound device capturing and archiving calibration coefficients and patient session metadata. IC Role / Device Role / Timing Role: Secure augmented storage array holding sensor calibration parameters with per-section write lock. Use Value: Ensures regulatory-compliant traceability of calibration history without risk of overwrite during clinical use. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V08-G | 8Mb F-RAM; 40MHz SPI max; 2.0–3.6V supply; no QPI mode; lower endurance (~10¹⁴ cycles) | Limited to lower-bandwidth logging; lacks XIP and augmented storage; simpler protection model | Select when cost sensitivity outweighs speed and feature requirements; verify timing margins for legacy SPI hosts |
| Infineon Technologies CY14V108N-ZSP25XI | 8Mb nvSRAM; 25MHz parallel interface; 3.3V only; requires external capacitor for store operation | Not serial; higher pin count; store/retrieve latency depends on capacitor charge time | Choose only if existing design uses parallel bus; avoid for new QSPI-based platforms due to interface mismatch |
Compared with FM25V08-G and CY14V108N-ZSP25XI, the M10082040108X0PSAR provides superior bandwidth via QPI, eliminates external energy storage components, and adds programmable augmented storage-making it optimal for next-generation industrial and medical edge devices requiring fast, reliable, and secure non-volatile memory.
Availability
M10082040108X0PSAR is available at Aetrix Electronics and suitable for factory automation, multifunction printers, and industrial control systems requiring stable component supply, long-term obsolescence planning, and guaranteed industrial-plus temperature performance.
Supply support for M10082040108X0PSAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The Mxxxx204 family was designed to replace battery-backed SRAM and legacy EEPROM/Flash in mission-critical applications demanding instant-write non-volatility, extreme endurance, and seamless SPI/QPI integration.
FAQ
What is the exact memory density and organization of M10082040108X0PSAR?
M10082040108X0PSAR is an 8-megabit serial MRAM with a 1,048,576 × 8-bit organization. Its 24-bit addressing supports the full 000000h–0FFFFFh range. This density balances compact footprint with sufficient capacity for firmware images, configuration tables, and real-time data buffers in resource-constrained embedded systems.
Does M10082040108X0PSAR support both 1.8V and 3.3V operation?
Yes, M10082040108X0PSAR supports two independent supply ranges: 1.71–2.00 V and 2.70–3.60 V. The device auto-detects voltage level and configures internal regulators accordingly. No external level-shifting circuitry is required, simplifying design for mixed-voltage boards where M10082040108X0PSAR interfaces with 1.8V MCUs or 3.3V FPGAs.
How does the Augmented Storage Array in M10082040108X0PSAR differ from main memory?
The Augmented Storage Array in M10082040108X0PSAR is a separate 256-byte region divided into eight 32-byte sections, each independently programmable and write-protectable via configuration bits. Unlike main memory, it's intended for critical calibration data or security keys-offering finer-grained protection without affecting firmware storage in the primary 8Mb array.
Is M10082040108X0PSAR pin-compatible with other members of the Mxxxx204 family?
Yes, all Mxxxx204 variants-including M1004204, M1008204, and M1016204-in 8-pin SOIC or 8-pad DFN packages share identical pinouts and electrical characteristics. This allows drop-in replacement across densities (4Mb/8Mb/16Mb) and speed grades (108MHz/54MHz), provided timing and voltage requirements are met in the target application.
What power-saving modes does M10082040108X0PSAR offer, and how quickly can it resume operation?
M10082040108X0PSAR offers Deep Power Down (IDPD) and Hibernate modes. Both retain full memory and register contents. Entry takes ≤3 µs; exit from Deep Power Down requires ≤400 µs, and from Hibernate ≤450 µs. These modes reduce active current to <1 µA, making M10082040108X0PSAR suitable for battery-powered edge nodes with strict energy budgets.
M10082040108X0PSAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 2M x 4
- Memory Interface:
- -
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.71V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M10082040108X0PSAR FAQ
1.How can I place an order for M10082040108X0PSAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M10082040108X0PSAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M10082040108X0PSAR reliable?
The price and inventory of M10082040108X0PSAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M10082040108X0PSAR is usually 5 days.
3.What payment methods are accepted for M10082040108X0PSAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M10082040108X0PSAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M10082040108X0PSAR?
M10082040108X0PSAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M10082040108X0PSAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M10082040108X0PSAR?
For technical support, including M10082040108X0PSAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M10082040108X0PSAR requirements.
6.How does Aetrix verify that M10082040108X0PSAR is sourced from the original manufacturer or authorized distributors?
All M10082040108X0PSAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M10082040108X0PSAR meets industry standards.
7.What is the process for return or replacement of M10082040108X0PSAR?
All M10082040108X0PSAR units undergo pre-shipment inspection (PSI). If there is an issue with M10082040108X0PSAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M10082040108X0PSAR part is unused and in its original packaging.
Return procedure for M10082040108X0PSAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M10082040108X0PSAR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

