Renesas M10162040108X0ISAR
- Part No.:
- M10162040108X0ISAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M10162040108X0ISAR.pdf
- Description:
- IC RAM 16MBIT 108MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:4,927
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M10162040108X0ISAR from Renesas is a 16Mbit serial STT-MRAM non-volatile memory IC with QSPI interface, 108MHz SDR clock speed, 1.71–2.0V supply voltage, and industrial temperature range (−40°C to +85°C). It delivers SRAM-compatible read/write timing, zero write latency, and persistent data retention-ideal for real-time data logging in factory automation controllers.
For engineers reviewing the M10162040108X0ISAR datasheet, M10162040108X0ISAR pinout, M10162040108X0ISAR application, or M10162040108X0ISAR equivalent, key selection criteria include its 16Mbit density, 8-pad DFN (WSON) package, hardware/software write protection, 256-byte augmented storage array, and JEDEC Reset support.
Technical Context
The M10162040108X0ISAR implements a 40nm pMTJ spin-transfer torque MRAM array with Quad SPI (4-4-4) interface supporting both SDR (108MHz) and DDR (54MHz) modes. Its architecture includes dedicated command/address/data paths, eXecute-In-Place (XIP) capability, and dual power domains enabling Deep Power Down (3µs entry) and Hibernate (3µs entry) states without data loss.
It integrates hardware-based write protection via WP# pin and software-configurable block protection (Top/Bottom, BP[2:0]) through Status and Configuration Registers. The 256-byte Augmented Storage Array is partitioned into eight 32-byte sections, each independently programmable and protectable-enabling secure storage of calibration data or firmware metadata.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 16Mbit (2M × 8) - supports full memory mapping up to 0x1FFFFF address space |
| Interface | QSPI (4-4-4) - enables 4-line command/address/data transfer for high-throughput burst reads |
| Max Clock Speed | 108MHz SDR - achieves ~13.5 MB/s sequential read throughput in single I/O mode |
| Supply Voltage | 1.71V–2.00V - compatible with modern low-voltage microcontroller I/O rails and reduces system power |
| Operating Temp | −40°C to +85°C - qualified for industrial control environments without derating |
| Endurance | Virtually unlimited - no write-cycle wear-out mechanism inherent to STT-MRAM physics |
| Data Retention | 20+ years at 85°C - guaranteed non-volatility without backup power or refresh circuitry |
Pinout & Package
Package: 8-pad DFN (WSON), 5.0mm × 6.0mm, moisture sensitivity level (MSL) 3, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; falling edge initiates instruction sequence; high state places device in standby (ISB current) |
| WP# / IO[2] | Bidirectional I/O or Hardware Write Protect | In SPI mode: input for status register write lock; in QPI mode: bidirectional data line IO[2] |
| SI / IO[0] | Serial Input or Bidirectional Data 0 | In SPI: unidirectional command/address/data input; in QPI: bidirectional IO[0] for full quad operation |
| CLK | Clock Input | Synchronous timing reference; rising edge latches commands in SDR; both edges used for address/data in DDR |
| IO[3] | Bidirectional Data 3 | Quad SPI data lane; must be pulled to VCC if unused in lower-pin-count configurations |
| SO / IO[1] | Serial Output or Bidirectional Data 1 | In SPI: unidirectional data output on falling clock edge; in QPI: bidirectional IO[1] |
| VCC | Power Supply | Single 1.71–2.0V rail powers core logic, MRAM array, and I/O buffers |
| VSS | Ground | Common return path for all internal circuits; requires low-inductance decoupling near package |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-compatible timing | Zero write latency and random access - eliminates wait states required by Flash/EEPROM |
| eXecute-In-Place (XIP) | Enables direct code execution from MRAM - reduces external RAM footprint in boot-critical systems |
| Augmented Storage Array | 256-byte user-programmable section with per-section write protection - ideal for storing device-specific calibration or security keys |
| JEDEC Reset support | Standardized reset command (66h) ensures interoperability with existing SPI memory controllers and boot loaders |
| Hardware + software protection | WP# pin locks status register; configuration bits enable top/bottom and block-level memory write protection - multi-layer data integrity |
Applications
| Factory Automation Data Logger | Medical Diagnostic Imaging Buffer |
|---|---|
Use Scenario: Captures sensor timestamps and PLC event logs during power interruptions in robotic assembly lines. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory that retains last-known state and recent operational history without battery backup. Use Value: Eliminates supercapacitor or coin-cell dependencies while ensuring deterministic recovery within <100ms after brownout. | Use Scenario: Stores intermediate image frames and calibration coefficients in portable ultrasound devices between acquisitions. IC Role / Device Role / Timing Role: High-speed frame buffer with instant write persistence - avoids DRAM refresh overhead and Flash erase delays. Use Value: Enables sub-millisecond frame capture-to-store latency and guarantees image integrity across cold starts. |
| Industrial Router Configuration Store | Multi-Function Printer Firmware Vault |
Use Scenario: Holds routing tables, VLAN settings, and TLS certificates in DIN-rail mounted edge routers deployed in harsh electrical environments. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration repository with hardware write lock and unique ID authentication. Use Value: Prevents accidental overwrite during firmware updates and supports cryptographic binding of config data to device identity. | Use Scenario: Stores printer-specific firmware patches, toner usage counters, and page yield metrics across thousands of duty cycles. IC Role / Device Role / Timing Role: Endurance-critical non-volatile storage for frequently updated service data - immune to write-cycle exhaustion. Use Value: Extends product lifetime beyond 100,000 print cycles without degradation in counter accuracy or patch reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V16-G | 16Mb F-RAM; 3.0V only (2.7–3.6V); max 40MHz SPI clock; no QPI or XIP support | Limited to lower-bandwidth control-plane storage; lacks quad interface and execute-in-place capability | Select when legacy 3.0V systems require proven F-RAM endurance but do not need >40MHz throughput or XIP |
| Infineon Technologies CY14B116N-ZSP25XI | 16Mb nvSRAM; 3.0V only; integrated lithium backup capacitor; 25ns async parallel interface | Requires PCB area for backup cap; incompatible pinout and protocol - not SPI-replaceable | Select only for existing parallel-interface designs needing drop-in nvSRAM replacement with battery-backed retention |
Compared with FM25V16-G and CY14B116N-ZSP25XI, the M10162040108X0ISAR provides higher bandwidth (108MHz vs ≤40MHz), broader voltage support (1.71–2.0V), and true serial QSPI compatibility - making it optimal for new low-power, high-throughput embedded systems where pin count and layout simplicity are critical.
Availability
M10162040108X0ISAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial networking requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for M10162040108X0ISAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The M10162040108X0ISAR belongs to Renesas' Persistent SRAM (P-SRAM) family, engineered to replace battery-backed SRAM and legacy Flash/EEPROM in mission-critical industrial systems demanding instant-write non-volatility and 20+ year data retention.
FAQ
What is the operating voltage range specified for the M10162040108X0ISAR?
The M10162040108X0ISAR operates from 1.71V to 2.00V. This narrow 1.8V nominal range ensures compatibility with advanced low-power microcontrollers and reduces system-level power consumption. Operation outside this range is not guaranteed, and the device will not function below 1.71V or above 2.00V per the datasheet's absolute maximum ratings. The M10162040108X0ISAR does not support 3.0V operation - that variant is designated with suffix '3' (e.g., M10162040108X0IS3R).
Does the M10162040108X0ISAR support Quad SPI (QPI) mode, and what are the requirements?
Yes, the M10162040108X0ISAR supports full Quad SPI (4-4-4) mode using all four I/O pins (IO[0]–IO[3]). To enter QPI mode, the device must receive the Enable QPI instruction (38h), after which all subsequent commands use the 4-line bus. The M10162040108X0ISAR requires proper initialization including status register configuration and clock polarity/phase alignment (CPOL=0, CPHA=0 for SDR). All QPI timing parameters-including tEDPD and tEXDPD-are validated per the datasheet.
How is write protection implemented on the M10162040108X0ISAR?
The M10162040108X0ISAR implements dual-layer write protection: hardware-based via the WP# pin (active-low, disables status register writes when enabled) and software-based via Status Register bits (TBSEL, BPSEL[2:0]) for top/bottom and block-level memory array protection. The 256-byte Augmented Storage Array also supports per-section write lock. All protection mechanisms are active simultaneously and must be explicitly disabled before modifying protected regions - the M10162040108X0ISAR enforces strict hierarchical locking.
What is the purpose and structure of the Augmented Storage Array in the M10162040108X0ISAR?
The M10162040108X0ISAR includes a dedicated 256-byte Augmented Storage Array mapped to addresses 0x000000–0x0000FF, divided into eight 32-byte sections. Each section can be individually programmed and write-protected via configuration registers. This area is electrically isolated from the main 16Mbit array and intended for storing immutable or infrequently updated data such as calibration constants, device serial numbers, or firmware signatures - the M10162040108X0ISAR guarantees independent endurance and retention for this region.
Is the M10162040108X0ISAR compatible with standard SPI memory controllers?
Yes, the M10162040108X0ISAR is fully compatible with industry-standard SPI controllers supporting Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1). It responds to standard instructions including Read Status Register (05h), Write Enable (06h), Page Program (02h), and Read Data (03h). The M10162040108X0ISAR also supports JEDEC-standard Reset (66h) and Deep Power Down (B9h), ensuring seamless integration into existing SPI memory firmware stacks without custom driver development.
M10162040108X0ISAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 4M x 4
- Memory Interface:
- -
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.71V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M10162040108X0ISAR FAQ
1.How can I place an order for M10162040108X0ISAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M10162040108X0ISAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M10162040108X0ISAR reliable?
The price and inventory of M10162040108X0ISAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M10162040108X0ISAR is usually 5 days.
3.What payment methods are accepted for M10162040108X0ISAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M10162040108X0ISAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M10162040108X0ISAR?
M10162040108X0ISAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M10162040108X0ISAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M10162040108X0ISAR?
For technical support, including M10162040108X0ISAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M10162040108X0ISAR requirements.
6.How does Aetrix verify that M10162040108X0ISAR is sourced from the original manufacturer or authorized distributors?
All M10162040108X0ISAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M10162040108X0ISAR meets industry standards.
7.What is the process for return or replacement of M10162040108X0ISAR?
All M10162040108X0ISAR units undergo pre-shipment inspection (PSI). If there is an issue with M10162040108X0ISAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M10162040108X0ISAR part is unused and in its original packaging.
Return procedure for M10162040108X0ISAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M10162040108X0ISAR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

