Renesas M10162040108X0PSAY
- Part No.:
- M10162040108X0PSAY
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M10162040108X0PSAY.pdf
- Description:
- IC RAM 16MBIT 108MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,649
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Product details
Overview
M10162040108X0PSAY from Renesas is a 16Mbit serial STT-MRAM non-volatile memory IC with QSPI interface, 108MHz SDR clock rate, 1.71–2.0V or 2.7–3.6V supply, and industrial-plus (−40°C to +105°C) operation in 8-pad DFN (WSON) package. It serves as persistent SRAM replacement in real-time data logging and firmware storage.
For engineers reviewing the M10162040108X0PSAY datasheet, M10162040108X0PSAY pinout, M10162040108X0PSAY application, or M10162040108X0PSAY equivalent, key selection criteria include QSPI x4 timing compliance, hardware/software write protection, 256-byte augmented storage array, JEDEC reset support, and deep power-down latency.
Technical Context
The M10162040108X0PSAY implements a 40nm pMTJ spin-transfer torque MRAM array with true random access, enabling byte-level reads/writes without erase cycles. Its SPI controller supports QPI (4-4-4), SDR (108MHz), and DDR (54MHz) modes with configurable clock polarity/phase (Mode 0 or Mode 3).
It integrates dual protection mechanisms: hardware write protect via WP# pin and software-configurable block protection using Status Register BPSEL bits and TBSEL. The device also features eXecute-In-Place (XIP) mode to reduce command overhead during sequential accesses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 16 Mbit (2 MByte) main memory array with 256-byte user-programmable augmented storage |
| Interface | QSPI (4-4-4), SDR up to 108MHz - enables 432 MB/s peak throughput in quad mode |
| Supply Voltage | VCC = 1.71–2.00V or 2.70–3.60V - dual-voltage support simplifies integration into 1.8V or 3.3V systems |
| Operating Temp | −40°C to +105°C - qualified for industrial-plus environments including factory automation and medical diagnostics |
| Endurance & Retention | Virtually unlimited write cycles and ≥20-year data retention - eliminates wear leveling and refresh logic |
| Power Modes | Deep Power Down (IDPD ≤ 1 µA) and Hibernate (IHBN ≤ 5 µA) - preserves configuration and data with sub-µA quiescent current |
| Data Protection | Hardware WP# pin + software-configurable top/bottom block protection (BPSEL[2:0]) - prevents accidental writes to critical firmware or calibration data |
Pinout & Package
Package: 8-pad DFN (WSON), 5.0 mm × 6.0 mm, exposed pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; falling edge initiates instruction sequence; high puts device in standby (tri-state I/Os) |
| WP# / IO[2] | Bidirectional Data 2 / Write Protect | In SPI mode: hardware write protect for status register when WP# = low and WP#EN = 1; in QPI/DPI: bidirectional data line |
| SI / IO[0] | Serial Input / Data 0 | In SPI: unidirectional command/address/data input on rising clock edge; in QPI/DPI: bidirectional data line |
| CLK | Clock Input | Synchronous timing reference; SDR uses rising edge for inputs/falling for outputs; DDR uses both edges |
| IO[3] | Bidirectional Data 3 | QPI/DPI data line; must be tied to VCC if unused in SPI mode |
| SO / IO[1] | Serial Output / Data 1 | In SPI: unidirectional data output on falling clock edge; in QPI/DPI: bidirectional data line |
| VCC | Power Supply | Core and I/O supply (1.71–2.00V or 2.70–3.60V); requires local decoupling capacitor |
| VSS | Ground | Common reference for core and I/O circuits; connect to system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| QSPI x4 Interface | Enables 4-line simultaneous data transfer for 4× bandwidth vs. standard SPI, supporting high-speed firmware XIP and real-time logging |
| eXecute-In-Place (XIP) | Allows continuous read sequences without repeated command issuance, reducing latency by up to 40% in burst-access scenarios |
| Augmented Storage Array | 256-byte dedicated, write-protectable memory space - ideal for storing calibration coefficients, MAC addresses, or secure keys independent of main array |
| JEDEC Reset Support | Standardized reset command (66h) ensures interoperability with host controllers expecting JEDEC-compliant non-volatile memories |
| Unique & Programmable IDs | 64-bit factory-unique ID + 64-bit user-programmable serial number - enables device traceability and secure provisioning in production |
Applications
| Factory Automation | Multifunction Printers |
|---|---|
Use Scenario: Real-time logging of PLC I/O states and motion control parameters during machine runtime. IC Role / Device Role: Persistent SRAM replacement storing volatile operational data without battery backup. Use Value: Eliminates supercapacitor/battery dependency while sustaining >100k write cycles per second with <100 ns read latency. | Use Scenario: Storing firmware images, font tables, and job-specific configuration across power cycles. IC Role / Device Role: Non-volatile code storage with XIP capability for fast boot and dynamic firmware updates. Use Value: Enables sub-second cold-start recovery and in-field firmware patching without flash erase delays. |
| Industrial Control And Monitoring | Medical Diagnostics |
Use Scenario: Capturing sensor fusion data from vibration, temperature, and pressure sensors in predictive maintenance gateways. IC Role / Device Role: High-endurance buffer memory for time-critical telemetry before cloud upload. Use Value: Guarantees data integrity over 20+ years at 105°C ambient, meeting IEC 61508 SIL-2 requirements. | Use Scenario: Storing calibration profiles, patient history metadata, and DICOM header templates in portable ultrasound units. IC Role / Device Role: Secure, tamper-resistant memory for regulatory-critical configuration data. Use Value: Hardware WP# + software block protection prevents unauthorized modification of FDA-required calibration parameters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar non-volatile serial memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V10-G | 1 Mbit F-RAM; 40 MHz SPI; 2.0–3.6V; −40°C to +85°C; SOIC-8 only | Limited density and temperature range; lower endurance than MRAM but faster write speed than legacy EEPROM | Select for cost-sensitive, lower-density applications where 85°C max ambient suffices and F-RAM's instant-write advantage is prioritized over density/scalability. |
| Infineon Technologies CY14B108N-ZSP25XI | 8 Mbit nvSRAM; 25 MHz parallel interface; 3.0–3.6V; −40°C to +85°C; SOIC-32 | Parallel bus interface increases PCB routing complexity; no QSPI/XIP; lower density and narrower temp range than M10162040108X0PSAY | Choose only if existing design uses parallel nvSRAM footprint and cannot accommodate serial interface redesign or higher density needs. |
Compared with FM25V10-G and CY14B108N-ZSP25XI, the M10162040108X0PSAY delivers 2× higher density, extended temperature operation, QSPI scalability, and true MRAM endurance-making it optimal for next-generation industrial and medical edge devices requiring future-proof, high-reliability non-volatile memory.
Availability
M10162040108X0PSAY is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-term lifecycle assurance, and RoHS/REACH compliance.
Supply support for M10162040108X0PSAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT markets.
The Mxxxx204 family is designed as persistent SRAM (P-SRAM) replacements targeting high-reliability, low-power, and latency-critical applications where Flash endurance or battery-backed SRAM limitations are unacceptable.
FAQ
What is the primary memory technology used in the M10162040108X0PSAY?
The M10162040108X0PSAY uses spin-transfer torque magnetoresistive RAM (STT-MRAM) built on a 40nm pMTJ process. This technology provides true random access, non-volatility, SRAM-compatible timing, and virtually unlimited endurance - distinguishing it from Flash, EEPROM, or battery-backed SRAM. The M10162040108X0PSAY leverages this to deliver persistent storage without erase cycles or wear leveling.
Does the M10162040108X0PSAY support both 1.8V and 3.3V operation?
Yes, the M10162040108X0PSAY supports dual voltage operation: 1.71–2.00V (1.8V nominal) and 2.70–3.60V (3.3V nominal). The specific variant M10162040108X0PSAY is configured for 1.8V operation, as indicated by the "1" in the voltage code position of its ordering string. This allows seamless integration into mixed-voltage systems without level-shifting circuitry.
What package type does the M10162040108X0PSAY use, and is it RoHS compliant?
The M10162040108X0PSAY uses an 8-pad DFN (WSON) package measuring 5.0 mm × 6.0 mm with an exposed thermal pad. It is fully RoHS and REACH compliant, as confirmed in the official datasheet. The "Y" suffix in the part number denotes tray packaging, and the "WA" package code explicitly identifies the WSON variant.
How does the M10162040108X0PSAY implement data protection?
The M10162040108X0PSAY implements dual-layer data protection: hardware-based via the WP# pin (active-low, requires WP#EN bit set in Status Register), and software-based via configurable block protection (BPSEL[2:0]) and top/bottom selection (TBSEL). Both mechanisms prevent unintended writes to memory or registers, and the 256-byte augmented storage array can be independently write-protected per 32-byte section.
What is the significance of the "0108" and "0P" codes in M10162040108X0PSAY?
In M10162040108X0PSAY, "0108" indicates 108MHz Single Data Rate (SDR) SPI performance, and "0P" specifies the industrial-plus temperature grade (−40°C to +105°C). The "WA" package code (embedded in base part M1016204) confirms the 8-pad DFN (WSON) form factor, while "Y" denotes tray packing. These codes collectively define the full electrical, thermal, mechanical, and logistical configuration of the M10162040108X0PSAY.
M10162040108X0PSAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 4M x 4
- Memory Interface:
- -
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.71V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M10162040108X0PSAY FAQ
1.How can I place an order for M10162040108X0PSAY through Aetrix?
Please submit a Request for Quotation (RFQ) for M10162040108X0PSAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M10162040108X0PSAY reliable?
The price and inventory of M10162040108X0PSAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M10162040108X0PSAY is usually 5 days.
3.What payment methods are accepted for M10162040108X0PSAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M10162040108X0PSAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M10162040108X0PSAY?
M10162040108X0PSAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M10162040108X0PSAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M10162040108X0PSAY?
For technical support, including M10162040108X0PSAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M10162040108X0PSAY requirements.
6.How does Aetrix verify that M10162040108X0PSAY is sourced from the original manufacturer or authorized distributors?
All M10162040108X0PSAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M10162040108X0PSAY meets industry standards.
7.What is the process for return or replacement of M10162040108X0PSAY?
All M10162040108X0PSAY units undergo pre-shipment inspection (PSI). If there is an issue with M10162040108X0PSAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M10162040108X0PSAY part is unused and in its original packaging.
Return procedure for M10162040108X0PSAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M10162040108X0PSAY Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C08C-STUM-T
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