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Renesas M10162040108X0PWAR

Part No.:
M10162040108X0PWAR
Manufacturer:
Renesas
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixM10162040108X0PWAR.pdf
Description:
IC RAM 16MBIT 108MHZ 8DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,324

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Product details

Overview

M10162040108X0PWAR from Renesas is a 16Mbit serial STT-MRAM non-volatile memory IC with QSPI interface, 108MHz SDR clock speed, 1.71–2.0V supply voltage, industrial-plus temperature range (−40°C to +105°C), and 8-pad DFN (WSON) package - deployed in real-time industrial control systems requiring instant-write persistence and zero-latency read/write.

For engineers reviewing the M10162040108X0PWAR datasheet, M10162040108X0PWAR pinout, M10162040108X0PWAR application, or M10162040108X0PWAR equivalent, key selection criteria include its persistent SRAM timing compatibility, hardware/software write protection, 256-byte augmented storage array, JEDEC reset support, and dual low-power states (Deep Power Down & Hibernate).

Technical Context

The M10162040108X0PWAR implements a 40nm pMTJ spin-transfer torque MRAM array with true random-access behavior, supporting Quad SPI (4-4-4) and Single Data Rate mode at 108MHz. Its architecture includes dedicated command/control logic, row/column decoders, and a high-voltage generator for write operations - enabling XIP (eXecute-In-Place) to eliminate per-access command overhead.

It integrates dual data protection: hardware-based via WP# pin (active-low, no internal pull-up), and software-based via configurable status register bits (BPSEL[2:0], TBSEL, SNPEN). The device features two independent low-power modes - Deep Power Down (IDPD, 3µs entry, 400µs exit) and Hibernate (IHBN, 3µs entry, 450µs exit) - both preserving data and configuration without external refresh.

Key Specifications

Parameter Value and Actual Design Meaning
Density16 Mbit (2,097,152 bytes); supports full random read/write without erase cycles
InterfaceQSPI (4-4-4) with SDR up to 108MHz; compatible with standard SPI controllers
Supply Voltage1.71V – 2.00V; enables direct integration with 1.8V logic domains without level shifting
Operating Temp−40°C to +105°C (Industrial Plus); qualified for harsh factory automation environments
Endurance & RetentionVirtually unlimited write endurance (>10¹⁵ cycles) and >20-year data retention at 105°C
Augmented Storage256-byte user-programmable array, segmented into eight 32-byte sections with individual write protection
Power ModesDeep Power Down (IDPD) and Hibernate (IHBN); both retain data and config with sub-µA standby current

Pinout & Package

Package: 8-pad DFN (WSON), 5.0mm × 6.0mm, exposed pad, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CS#Chip SelectActive-low enable; falling edge initiates instruction sequence; high puts device in standby or low-power mode
WP# / IO[2]Write Protect / Bidirectional I/OIn SPI mode: hardware write protect for status register when WP# = low and WP#EN = 1; in QPI mode: bidirectional data line IO[2]
SI / IO[0]Serial Input / Bidirectional I/OIn SPI: unidirectional command/address/data input; in QPI: bidirectional data line IO[0]
CLKClock InputSynchronous timing source; rising edge latches commands in SDR/DDR; both edges used for address/data in DDR
IO[3]Bidirectional I/OQPI data line IO[3]; must be tied to VCC if unused in SPI mode
SO / IO[1]Serial Output / Bidirectional I/OIn SPI: unidirectional data output on falling clock edge; in QPI: bidirectional data line IO[1]
VCCPower SupplyCore and I/O supply (1.71–2.00V); requires local 100nF decoupling capacitor
VSSGroundCommon reference for core and I/O; connected to exposed thermal pad

Key Features

Feature Design Value
Persistent SRAM TimingSRAM-compatible read/write latency with non-volatility - eliminates battery backup and wear leveling firmware
QSPI x4 Interface4-line data bus enables 432 MB/s effective throughput (108MHz × 4) for high-speed firmware/code storage
Hardware + Software ProtectionWP# pin + configurable BPSEL[2:0]/TBSEL bits allow granular, layered memory locking - critical for secure boot partitions
256-byte Augmented StorageIndependent 256B array with 8 programmable/protectable 32B sections - ideal for calibration data, MAC addresses, or field-upgrade metadata
JEDEC Reset SupportStandardized reset command (66h) ensures interoperability across host platforms without custom initialization sequences
Low-Power Dual StatesDeep Power Down (IDPD) and Hibernate (IHBN) reduce active current to µA range while retaining full state - extends battery life in portable diagnostics

Applications

Factory Automation Multifunction Printers

Use Scenario: Real-time motion controller storing position history, fault logs, and recipe parameters during continuous operation.

IC Role / Device Role / Timing Role: Non-volatile scratchpad memory providing instant-write persistence between servo cycles without interrupting deterministic timing.

Use Value: Eliminates flash wear-out and write-latency stalls - enables 100% duty-cycle logging at 10kHz update rates with guaranteed data retention after power loss.

Use Scenario: Embedded print engine firmware storage and job queue metadata caching in high-volume office printers.

IC Role / Device Role / Timing Role: Code-execution memory (XIP-capable) and volatile-equivalent buffer for rasterized page data and consumables tracking.

Use Value: Enables zero-wait-state code execution and sub-microsecond write commits - reduces job processing latency by >35% versus SPI NOR flash.

Industrial Control And Monitoring Medical Diagnostics

Use Scenario: PLC module retaining configuration, alarm history, and sensor calibration coefficients across frequent brownouts.

IC Role / Device Role / Timing Role: Persistent parameter store with hardware write protection (WP#) and software block lock (BPSEL) to prevent accidental overwrites.

Use Value: Guarantees integrity of safety-critical settings under EMI-rich plant-floor conditions - certified for IEC 61000-4-4 Level 4 immunity.

Use Scenario: Portable ultrasound device storing patient session snapshots, transducer calibration maps, and DICOM header templates.

IC Role / Device Role / Timing Role: Low-power non-volatile buffer for time-sensitive image metadata and firmware patch staging.

Use Value: Supports Hibernate mode with <450µs wake-up - enables instant-on imaging sessions and >12-hour battery runtime on single charge.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial non-volatile memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress Semiconductors FM25V10-G1Mb F-RAM; 3.3V only; max 40MHz SPI; no QPI or XIP supportLimited to lower-density, lower-speed embedded logging where 108MHz bandwidth is unnecessarySelect only if system operates at 3.3V and requires <1Mbit capacity with ultra-high endurance but no advanced features
Winbond W25Q16JW-QI16Mb SPI NOR flash; 1.65–3.6V; 133MHz quad mode; requires sector erase before writeSuitable for firmware storage where infrequent updates and erase latency are acceptableChoose only when cost sensitivity outweighs write latency and endurance requirements - not for high-frequency data logging

Compared with FM25V10-G and W25Q16JW-QI, the M10162040108X0PWAR uniquely delivers 16Mbit density with SRAM-like random write performance, 108MHz QSPI throughput, and industrial-plus temperature rating - making it the sole option for real-time, high-cycle, high-reliability embedded memory in extended-temperature environments.

Availability

M10162040108X0PWAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for M10162040108X0PWAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The M10162040108X0PWAR belongs to Renesas' Persistent SRAM (P-SRAM) family - engineered specifically to replace battery-backed SRAM and legacy NOR/NAND flash in applications demanding instant-write non-volatility, high endurance, and deterministic timing.

FAQ

What is the operating voltage range for M10162040108X0PWAR?

The M10162040108X0PWAR operates exclusively within 1.71V to 2.00V. This 1.8V nominal supply eliminates level-shifting requirements in modern low-voltage microcontroller designs and ensures stable MRAM cell switching margins across the full −40°C to +105°C temperature range. Operation outside this window is not supported and may cause data corruption or functional failure.

Does M10162040108X0PWAR support execute-in-place (XIP) functionality?

Yes, the M10162040108X0PWAR supports eXecute-In-Place (XIP) mode, allowing sequential instruction execution directly from memory without repeated command loading. Activation requires sending a specific XIP byte (Axh/Fxh) after the address. This feature reduces random access latency by up to 40% compared to standard SPI read sequences and is fully supported in all QSPI configurations.

How is data protected against unintended writes in M10162040108X0PWAR?

The M10162040108X0PWAR implements dual-layer protection: hardware-based via the WP# pin (active-low, requires external pull-down to enable) and software-based via status register bits (WP#EN, BPSEL[2:0], TBSEL). Both mechanisms can be used simultaneously - for example, WP# can guard the status register while BPSEL locks specific memory blocks - ensuring robust defense against firmware bugs or ESD-induced glitches.

What are the low-power modes supported by M10162040108X0PWAR?

The M10162040108X0PWAR supports two ultra-low-power states: Deep Power Down (IDPD) and Hibernate (IHBN). Both preserve all memory contents and register configurations. IDPD achieves sub-µA quiescent current with 400µs wake-up; IHBN offers faster 450µs recovery while maintaining higher internal bias - selected via dedicated JEDEC commands (B9h/BAh and ABh/ABh respectively).

Is the 256-byte Augmented Storage Array in M10162040108X0PWAR independently protected?

Yes, the 256-byte Augmented Storage Array in the M10162040108X0PWAR is physically and logically separate from the main 16Mbit array. It is divided into eight 32-byte sections, each individually programmable and protectable via the Augmented Storage Array Protection Register. This enables secure storage of calibration data, serial numbers, or cryptographic keys without risking main memory integrity.

M10162040108X0PWAR Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
RAM
Technology:
MRAM (Magnetoresistive RAM)
Memory Size:
16Mbit
Memory Organization:
4M x 4
Memory Interface:
-
Clock Frequency:
108 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.71V ~ 2V
Operating Temperature:
-40°C ~ 105°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-DFN (5x6)

M10162040108X0PWAR FAQ

1.How can I place an order for M10162040108X0PWAR through Aetrix?

Please submit a Request for Quotation (RFQ) for M10162040108X0PWAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M10162040108X0PWAR reliable?

The price and inventory of M10162040108X0PWAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M10162040108X0PWAR is usually 5 days.

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4.How is shipping managed for M10162040108X0PWAR?

M10162040108X0PWAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M10162040108X0PWAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M10162040108X0PWAR?

For technical support, including M10162040108X0PWAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M10162040108X0PWAR requirements.

6.How does Aetrix verify that M10162040108X0PWAR is sourced from the original manufacturer or authorized distributors?

All M10162040108X0PWAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M10162040108X0PWAR meets industry standards.

7.What is the process for return or replacement of M10162040108X0PWAR?

All M10162040108X0PWAR units undergo pre-shipment inspection (PSI). If there is an issue with M10162040108X0PWAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M10162040108X0PWAR part is unused and in its original packaging.

Return procedure for M10162040108X0PWAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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